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18 条记录 (耗时 0.024 秒)

    Heat-resistant DNA ligase with high reactivity
    11.
    发明授权
    Heat-resistant DNA ligase with high reactivity 有权
    耐高温DNA连接酶具有高反应性

    公开(公告)号：US08137943B2

    公开(公告)日：2012-03-20

    申请号：US12390767

    申请日：2009-02-23

    申请人： Hirokazu Nishida ,  Maiko Tanabe

    发明人： Hirokazu Nishida ,  Maiko Tanabe

    IPC分类号： C12N9/00 ,  C07K1/00 ,  C07H21/04

    CPC分类号： C12N9/93 ,  C12Q1/6862

    摘要： Thermostable DNA ligases with enhanced DNA binding activity and reaction activity are obtained. These modified thermostable DNA ligases having enhanced DNA binding activity compared to the wild type can be obtained by substituting a negatively charged amino acid (for example, the amino acid corresponding to the aspartic acid at position 540 of SEQ ID NO: 1) present at the N-terminal side of the C-terminal helix moiety of thermostable DNA ligases from thermophilic bacteria, hyperthermophilic bacteria, thermophilic archaea, or hyperthermophilic archaea, with a non-negatively charged amino acid (for example, alanine, serine, arginine, or lysine).

    摘要翻译： 获得具有增强的DNA结合活性和反应活性的热稳定DNA连接酶。 与野生型相比，具有增强的DNA结合活性的这些修饰的热稳定DNA连接酶可以通过将存在于所述野生型的带负电荷的氨基酸（例如，对应于SEQ ID NO：1的位置540的天冬氨酸的氨基酸） 具有非带负电氨基酸（例如丙氨酸，丝氨酸，精氨酸或赖氨酸）的嗜热细菌，嗜热细菌，嗜热古细菌或嗜热古细菌的热稳定DNA连接酶的C末端螺旋部分的N-末端侧， 。

    SEQUENCE ANALYSIS METHOD
    12.
    发明申请
    SEQUENCE ANALYSIS METHOD 审中-公开
    序列分析方法

    公开(公告)号：US20100167281A1

    公开(公告)日：2010-07-01

    申请号：US12389151

    申请日：2009-02-19

    申请人： Maiko Tanabe ,  Chihiro Uematsu ,  Hirokazu Nishida ,  Kenko Uchida

    发明人： Maiko Tanabe ,  Chihiro Uematsu ,  Hirokazu Nishida ,  Kenko Uchida

    IPC分类号： C12Q1/68

    CPC分类号： C12Q1/6816 ,  C12Q2521/501 ,  C12Q2565/301

    摘要： It is intended to provide an assay for the presence, absence or amount of a nucleic-acid fragment having a certain nucleotide sequence, for example, a polyA length, a difference in the number of repetition of a direct repeat sequence (e.g., microsatellite), single nucleotide substitution (or single nucleotide polymorphism), and nucleotide sequence insertion or deletion, and to provide a genetic testing using the same. The present invention relates to a nucleotide analysis method, comprising: hybridizing at least two probes to a nucleic-acid fragment; ligating the at least two probes using ligase; exchanging, to ATP, pyrophosphoric acid produced through the ligation reaction; and detecting chemiluminescence reaction dependent on the ATP.

    摘要翻译： 旨在提供具有某一核苷酸序列的核酸片段的存在，不存在或量的测定，例如polyA长度，直接重复序列（例如，微卫星）的重复次数的差异， ，单核苷酸取代（或单核苷酸多态性）和核苷酸序列插入或缺失，并提供使用其的遗传检测。 本发明涉及一种核苷酸分析方法，包括：将至少两个探针与核酸片段杂交; 使用连接酶连接至少两个探针; 通过连接反应产生的ATP，焦磷酸交换; 并根据ATP检测化学发光反应。

    Multi-wire saw
    16.
    发明授权
    Multi-wire saw 有权
    多线锯

    公开(公告)号：US07306508B2

    公开(公告)日：2007-12-11

    申请号：US10540020

    申请日：2004-10-22

    申请人： Takafumi Kawasaki ,  Hirozoh Tsuruta ,  Hirokazu Nishida ,  Seiichi Mimura ,  Masayuki Hamayasu ,  Hisashi Tominaga

    发明人： Takafumi Kawasaki ,  Hirozoh Tsuruta ,  Hirokazu Nishida ,  Seiichi Mimura ,  Masayuki Hamayasu ,  Hisashi Tominaga

    IPC分类号： B24B49/00 ,  B28D1/06

    CPC分类号： B28D5/007 ,  B24B27/0633 ,  B28D5/045 ,  H01L21/304 ,  Y02P70/179

    摘要： A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating the slurry; a thermal insulating pipe for transporting the slurry sent with a pump from the storage tank with a heating mechanism to a position before a position where the wire is incorporated into the workpiece, while keeping the slurry at a predetermined temperature; a thermostat for keeping a temperature in a vicinity of the workpiece fixed to a stage at the predetermined temperature; and a wire heating mechanism for heating the wire to the predetermined temperature. Consequently, the cutting resistance decreases during cutting machining of a silicon ingot, and the variation in the cutting resistance also decreases, whereby a high-quality wafer can be obtained at a high efficiency and a low cost.

    摘要翻译： 根据本发明的多线锯在将含有碱或混合酸的浆料供给到工件和线材之间的切割界面的同时切割工件，并且包括：具有用于储存和加热浆料的加热机构的储罐 ; 绝热管，用于将具有加热机构的从所述储存罐输送的浆料输送到所述线材并入所述工件的位置之前，同时将所述浆料保持在预定温度; 用于将工件附近的温度固定在预定温度的台上的恒温器; 以及用于将线材加热到预定温度的线材加热机构。 因此，在硅锭的切割加工期间切削阻力降低，并且切削阻力的变化也降低，从而可以以高效率和低成本获得高质量的晶片。

    Multi-wire saw
    17.
    发明申请
    Multi-wire saw 有权
    多线锯

    公开(公告)号：US20060249134A1

    公开(公告)日：2006-11-09

    申请号：US10540020

    申请日：2004-10-22

    申请人： Takafumi Kawasaki ,  Hirozoh Tsuruta ,  Hirokazu Nishida ,  Seiichi Mimura ,  Masayuki Hamayasu ,  Hisashi Tominaga

    发明人： Takafumi Kawasaki ,  Hirozoh Tsuruta ,  Hirokazu Nishida ,  Seiichi Mimura ,  Masayuki Hamayasu ,  Hisashi Tominaga

    IPC分类号： B28D1/08

    CPC分类号： B28D5/007 ,  B24B27/0633 ,  B28D5/045 ,  H01L21/304 ,  Y02P70/179

    摘要： A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating the slurry; a thermal insulating pipe for transporting the slurry sent with a pump from the storage tank with a heating mechanism to a position before a position where the wire is incorporated into the workpiece, while keeping the slurry at a predetermined temperature; a thermostat for keeping a temperature in a vicinity of the workpiece fixed to a stage at the predetermined temperature; and a wire heating mechanism for heating the wire to the predetermined temperature. Consequently, the cutting resistance decreases during cutting machining of a silicon ingot, and the variation in the cutting resistance also decreases, whereby a high-quality wafer can be obtained at a high efficiency and a low cost.

    摘要翻译： 根据本发明的多线锯在将含有碱或混合酸的浆料供给到工件和线材之间的切割界面的同时切割工件，并且包括：具有用于储存和加热浆料的加热机构的储罐 ; 绝热管，用于将具有加热机构的从所述储存罐输送的浆料输送到所述线材并入所述工件的位置之前，同时将所述浆料保持在预定温度; 用于将工件附近的温度固定在预定温度的台上的恒温器; 以及用于将线材加热到预定温度的线材加热机构。 因此，在硅锭的切割加工期间切削阻力降低，并且切削阻力的变化也降低，从而可以以高效率和低成本获得高质量的晶片。

    Slurry for slicing silicon ingot and method for slicing silicon ingot using same
    18.
    发明申请
    Slurry for slicing silicon ingot and method for slicing silicon ingot using same 审中-公开
    用于切片硅锭的浆料和使用该硅锭切片硅锭的方法

    公开(公告)号：US20060075687A1

    公开(公告)日：2006-04-13

    申请号：US10540480

    申请日：2004-10-12

    申请人： Hirozoh Tsuruta ,  Masayuki Hamayasu ,  Takafumi Kawasaki ,  Hirokazu Nishida ,  Hisashi Tominaga

    发明人： Hirozoh Tsuruta ,  Masayuki Hamayasu ,  Takafumi Kawasaki ,  Hirokazu Nishida ,  Hisashi Tominaga

    IPC分类号： B26D1/00 ,  C09K3/14

    CPC分类号： C09K3/1463 ,  B28D5/007 ,  Y02P70/179 ,  Y10T83/04

    摘要： In a slurry for cutting a silicon ingot according to the present invention, a content of a basic material is at least 3.5% by mass with respect to the total mass of a liquid component of a slurry, organic amine is contained in a mass ratio of 0.5 to 5.0 with respect to water in a liquid component of the slurry, and pH of the slurry is 12 or more. Furthermore, according to a method of cutting a silicon ingot according to the present invention, the above-mentioned slurry for cutting a silicon ingot is used at 65° C. to 95° C. Consequently, the cutting resistance during cutting processing of a silicon ingot is reduced, and a wafer of high quality can be obtained efficiently.

    摘要翻译： 在根据本发明的用于切割硅锭的浆料中，碱性物质的含量相对于浆料的液体成分的总质量为至少3.5质量％，以质量比计含有有机胺 相对于浆液的液体成分中的水为0.5〜5.0，浆料的pH为12以上。 此外，根据本发明的硅锭的切割方法，上述用于切割硅锭的浆料在65℃〜95℃下使用。因此，在硅的切割加工过程中的切削阻力 锭减少，可以有效地获得高质量的晶片。