公开(公告)号：US10658178B2

公开(公告)日：2020-05-19

申请号：US16024907

申请日：2018-07-01

Applicant: UNITED MICROELECTRONICS CORP. ,  Fujian Jinhua Integrated Circuit Co., Ltd.

Inventor： Feng-Yi Chang ,  Fu-Che Lee ,  Ying-Chih Lin ,  Gang-Yi Lin

IPC: H01L21/311 ,  H01L21/033 ,  H01L21/027 ,  H01L27/108

Abstract: A method of forming a capacitor mask includes the following steps. A bulk mandrel and a plurality of strip mandrels are formed on a mask layer. Spacers are formed on sidewalls of the bulk mandrel and the strip mandrels. The strip mandrels are removed while the bulk mandrel is reserved. A material fills in space between the spacers and on the bulk mandrel, wherein the material has a flat top surface. A patterned photoresist is formed to cover the bulk mandrel and a part of the spacers but exposing the other part of the spacers after filling the material.

公开(公告)号：US20200083325A1

公开(公告)日：2020-03-12

申请号：US16154704

申请日：2018-10-08

Applicant: UNITED MICROELECTRONICS CORP. ,  Fujian Jinhua Integrated Circuit Co., Ltd.

Inventor： Feng-Yi Chang ,  Fu-Che Lee ,  Yi-Ching Chang ,  Kai-Lou Huang ,  Ying-Chih Lin ,  Gang-Yi Lin

IPC: H01L29/06 ,  H01L21/027 ,  H01L29/66 ,  H01L21/033 ,  H01L21/311 ,  H01L21/3213

Abstract: A semiconductor device and a method of forming the same, the semiconductor device includes a substrate, a gate structure, a first dielectric layer, a second dielectric layer, a first plug and two metal lines. The substrate has a shallow trench isolation and an active area, and the gate structure is disposed on the substrate to cover a boundary between the active area and the shallow trench isolation. The first dielectric layer is disposed on the substrate, to cover the gate structure, and the first plug is disposed in the first dielectric layer to directly in contact with a conductive layer of the gate structure and the active area. The second dielectric layer is disposed on the first dielectric layer, with the first plug and the gate being entirely covered by the first dielectric layer and the second dielectric layer. The two metal lines are disposed in the second dielectric layer.

公开(公告)号：US10535530B2

公开(公告)日：2020-01-14

申请号：US16167435

申请日：2018-10-22

Applicant: UNITED MICROELECTRONICS CORP. ,  Fujian Jinhua Integrated Circuit Co., Ltd.

Inventor： Feng-Yi Chang ,  Fu-Che Lee ,  Ying-Chih Lin ,  Gang-Yi Lin

IPC: H01L21/308 ,  H01L21/033 ,  H01L21/8234

Abstract: A patterning method for forming a semiconductor device is disclosed. A substrate having a hard mask disposed thereon is provided. A first patterned layer is formed on the hard mask layer. A first self-aligned double patterning process based on the first patterned layer is performed to pattern the hard mask layer into a first array pattern and a first peripheral pattern. After that, a second patterned layer is formed on the substrate. A second self-aligned double patterning process based on the second patterned layer is performed to pattern the first array pattern into a second array pattern. Subsequently, a third patterned layer is formed on the substrate. An etching process using the third patterned mask layer as an etching mask is performed to etch the first peripheral pattern thereby patterning the first peripheral pattern into a second peripheral pattern.

公开(公告)号：US20190304777A1

公开(公告)日：2019-10-03

申请号：US15964031

申请日：2018-04-26

Applicant: UNITED MICROELECTRONICS CORP. ,  Fujian Jinhua Integrated Circuit Co., Ltd.

Inventor： Feng-Yi Chang ,  Fu-Che Lee ,  Ying-Chih Lin ,  Gang-Yi Lin

IPC: H01L21/02 ,  H01L21/033

Abstract: The present invention provides a method for fabricating a hard mask, comprising: firstly, a first material layer and a second material layer are provided on the first material layer, a cell region and a peripheral region are defined thereon, and then a plurality of sacrificial patterns and a plurality of spacers are formed in the cell region on the second material layer, each two spacers are located at two sides of each of the sacrificial patterns. Afterwards, a first etching step is performed to remove the sacrificial patterns, a second etching step is performed to remove a portion of the second material layer and expose a portion of the first material layer within the cell region, and a third etching step is performed to remove portions of the first material layer, so as to forma plurality of first recesses in the first material layer.

公开(公告)号：US20190172722A1

公开(公告)日：2019-06-06

申请号：US16158316

申请日：2018-10-12

Applicant: UNITED MICROELECTRONICS CORP. ,  Fujian Jinhua Integrated Circuit Co., Ltd.

Inventor： Feng-Yi Chang ,  Wei-Hsin Liu ,  Ying-Chih Lin ,  Jui-Min Lee ,  Gang-Yi Lin ,  Fu-Che Lee

IPC: H01L21/311 ,  H01L21/308 ,  H01L21/033 ,  H01L27/105

CPC classification number: H01L21/31144 ,  H01L21/0337 ,  H01L21/0338 ,  H01L21/3086 ,  H01L21/3088 ,  H01L27/1052

Abstract: A method of forming a semiconductor memory device includes following steps. First of all, a target layer is provided, and a mask structure is formed on the target layer, with the mask structure including a first mask layer a sacrificial layer and a second mask layer. The first mask layer and the second mask layer include the same material but in different containing ratio. Next, the second mask layer and the sacrificial layer are patterned, to form a plurality of mandrels. Then, a plurality of spacer patterns are formed to surround the mandrels, and then transferred into the first mask layer to form a plurality of opening not penetrating the first mask layer. Finally, the first mask layer is used as a mask to etch the target layer, to form a plurality of target patterns.

公开(公告)号：US20200212048A1

公开(公告)日：2020-07-02

申请号：US16258657

申请日：2019-01-27

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Gang-Yi Lin ,  Shih-Fang Tzou ,  Fu-Che Lee ,  Feng-Yi Chang ,  Ying-Chih Lin ,  Kai-Lou Huang ,  Yi-Ching Chang

IPC: H01L27/108

Abstract: The present invention provides a method for forming a semiconductor pattern, comprising: firstly, a target layer is provided and a first material layer is formed on the target layer, and then a first pattern is formed on the first material layer, followed by a first self-aligned double pattering step is performed, a plurality of first grooves are formed in the first material layer. Next, a second material layer is formed on the first material layer, and a plurality of second grooves are formed in the second material layer. Next, transferring a pattern of the overlapping portion of the first grooves and the second grooves into the target layer, the target layer includes a plurality of third patterns and a plurality of fourth patterns, an area of each fourth pattern is larger than an area of each third pattern.

公开(公告)号：US10734284B2

公开(公告)日：2020-08-04

申请号：US16134976

申请日：2018-09-19

Applicant: UNITED MICROELECTRONICS CORP. ,  Fujian Jinhua Integrated Circuit Co., Ltd.

Inventor： Feng-Yi Chang ,  Fu-Che Lee ,  Ying-Chih Lin ,  Gang-Yi Lin ,  Chieh-Te Chen ,  Yi-Ching Chang

IPC: H01L21/033 ,  H01L21/768 ,  H01L21/308 ,  H01L21/28 ,  H01L21/3213 ,  H01L21/311

Abstract: A method of self-aligned double patterning is disclosed in the present invention, which includes the step of forming multiple mandrels on a hard mask layer and spacers at two sides of each mandrel, forming a protection layer filling between the spacers, removing the mandrels to expose the hard mask layer, and performing an anisotropic etch process using the spacers and the protection layer as an etch mask to remove a portion of hard mask layer, so that a thickness of hard mask layer exposed between the spacers equals to a thickness of hard mask layer under the protection layer.

公开(公告)号：US10700071B1

公开(公告)日：2020-06-30

申请号：US16258657

申请日：2019-01-27

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Gang-Yi Lin ,  Shih-Fang Tzou ,  Fu-Che Lee ,  Feng-Yi Chang ,  Ying-Chih Lin ,  Kai-Lou Huang ,  Yi-Ching Chang

IPC: H01L21/033 ,  H01L21/308 ,  H01L27/108

Abstract: The present invention provides a method for forming a semiconductor pattern, comprising: firstly, a target layer is provided and a first material layer is formed on the target layer, and then a first pattern is formed on the first material layer, followed by a first self-aligned double pattering step is performed, a plurality of first grooves are formed in the first material layer. Next, a second material layer is formed on the first material layer, and a plurality of second grooves are formed in the second material layer. Next, transferring a pattern of the overlapping portion of the first grooves and the second grooves into the target layer, the target layer includes a plurality of third patterns and a plurality of fourth patterns, an area of each fourth pattern is larger than an area of each third pattern.

公开(公告)号：US20200105764A1

公开(公告)日：2020-04-02

申请号：US16175858

申请日：2018-10-31

Applicant: UNITED MICROELECTRONICS CORP. ,  Fujian Jinhua Integrated Circuit Co., Ltd.

Inventor： Wei-Lun Hsu ,  Gang-Yi Lin ,  Yu-Hsiang Hung ,  Ying-Chih Lin ,  Feng-Yi Chang ,  Ming-Te Wei ,  Shih-Fang Tzou ,  Fu-Che Lee ,  Chia-Liang Liao

IPC: H01L27/108 ,  G11C11/402 ,  H01L23/538

Abstract: A method of forming a layout definition of a semiconductor device includes the following steps. Firstly, a plurality of first patterns is established to form a material layer over a substrate, with the first patterns being regularly arranged in a plurality of columns along a first direction to form an array arrangement. Next, a plurality of second patterns is established to surround the first patterns. Then, a third pattern is established to form a blocking layer on the material layer, with the third pattern being overlapped with a portion of the second patterns and with at least one of the second patterns being partially exposed from the third pattern. Finally, the first patterns are used to form a plurality of first openings in a stacked structure on the substrate to expose a portion of the substrate respectively.

公开(公告)号：US10475662B2

公开(公告)日：2019-11-12

申请号：US16158316

申请日：2018-10-12

Applicant: UNITED MICROELECTRONICS CORP. ,  Fujian Jinhua Integrated Circuit Co., Ltd.

Inventor： Feng-Yi Chang ,  Wei-Hsin Liu ,  Ying-Chih Lin ,  Jui-Min Lee ,  Gang-Yi Lin ,  Fu-Che Lee

IPC: H01L21/311 ,  H01L21/308 ,  H01L27/105 ,  H01L21/033

Abstract: A method of forming a semiconductor memory device includes following steps. First of all, a target layer is provided, and a mask structure is formed on the target layer, with the mask structure including a first mask layer a sacrificial layer and a second mask layer. The first mask layer and the second mask layer include the same material but in different containing ratio. Next, the second mask layer and the sacrificial layer are patterned, to form a plurality of mandrels. Then, a plurality of spacer patterns are formed to surround the mandrels, and then transferred into the first mask layer to form a plurality of opening not penetrating the first mask layer. Finally, the first mask layer is used as a mask to etch the target layer, to form a plurality of target patterns.