公开(公告)号：US20070263359A1

公开(公告)日：2007-11-15

申请号：US11308839

申请日：2006-05-12

申请人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

发明人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp (40) clamping the first, second heat sinks and the printed circuit board together. The first heat sink comprises a pair of positioning poles (24). The second heat sink comprises a heat pipe (36) disposed therein and thermally connecting therewith. The clamp comprises a connecting portion (42) and a pair of elastic pressing portions (44). The clamp resiliently presses the second heat sink toward the main heat-generating electronic component and the first heat sink engages with the second heat sink via the positioning poles of the first heat sink extending in and engaging with the second heat sink.

摘要翻译： 存储模块组件包括其上具有主要发热电子部件（52）的印刷电路板（10），安装在印刷电路板的相对侧上的第一和第二散热器（20），（30）和夹具 40）将第一，第二散热器和印刷电路板夹在一起。 第一散热器包括一对定位极（24）。 第二散热器包括设置在其中并与其热连接的热管（36）。 夹具包括连接部分（42）和一对弹性按压部分（44）。 夹具将第二散热器弹性地压向主发热电子部件，并且第一散热器经由第一散热器的定位极与第二散热器接合，第一散热器的定位极延伸并与第二散热器接合。

公开(公告)号：US20070246204A1

公开(公告)日：2007-10-25

申请号：US11309491

申请日：2006-08-11

申请人： CHENG-TIEN LAI ,  Zhi-Yong Zhou

发明人： CHENG-TIEN LAI ,  Zhi-Yong Zhou

IPC分类号： F28F3/00

CPC分类号： F28F3/086 ,  F28F3/12 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid cooling device includes a base, a housing and a heat exchanger. The base and the housing enclose a chamber which receives the heat exchanger therein. Inlet and outlet for liquid are provided at the housing. The heat exchanger includes stacked flakes. Each flake includes parallel and alternately arranged first and second strips each having a void defined therein. The flakes are stacked in a manner such that each first strip overlays and abuts against a corresponding second strip of an adjacent flake and that the void in each first strip and the void in the corresponding second strip of the adjacent flake are in fluid communication with each other to thereby form a channel between the inlet and the outlet.

摘要翻译： 液体冷却装置包括基座，壳体和热交换器。 基座和壳体包围容纳热交换器的腔室。 在壳体处设有用于液体的入口和出口。 热交换器包括堆积的薄片。 每个薄片包括平行且交替布置的第一和第二条带，每个带有限定在其中的空隙。 薄片以这样的方式堆叠，使得每个第一条覆盖并邻接相邻片状物的对应的第二条带，并且每个第一条带中的空隙和相邻片状物的相应第二条带中的空隙与每个 从而在入口和出口之间形成通道。

公开(公告)号：US20110255285A1

公开(公告)日：2011-10-20

申请号：US12824208

申请日：2010-06-27

申请人： CHENG-TIEN LAI ,  CHI-YUAN LAI ,  ZHI-YONG ZHOU

发明人： CHENG-TIEN LAI ,  CHI-YUAN LAI ,  ZHI-YONG ZHOU

IPC分类号： F21V29/00

CPC分类号： F21V29/83 ,  F21V29/507 ,  F21V29/745 ,  F21V29/80 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K2201/09063 ,  H05K2201/10106

摘要： An exemplary illumination device includes an enclosure, a semiconductor light source accommodated in the enclosure, and an envelope engaged with the enclosure and covering the semiconductor light source. Light generated by the semiconductor light source can project through the envelope and out of the illumination device. The semiconductor light source includes a plurality of light source modules independent from each other. A plurality of air passages are defined in each light source module for air passing therethrough to dissipate heat generated by the semiconductor light source into ambient air.

摘要翻译： 示例性照明装置包括外壳，容纳在外壳中的半导体光源以及与外壳接合并覆盖半导体光源的外壳。 由半导体光源产生的光可以穿过信封突出并且离开照明装置。 半导体光源包括彼此独立的多个光源模块。 在每个光源模块中限定多个空气通道，用于穿过其中的空气将半导体光源产生的热量散发到环境空气中。

公开(公告)号：US20090166004A1

公开(公告)日：2009-07-02

申请号：US11967058

申请日：2007-12-29

申请人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

发明人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC分类号： F28D15/04

CPC分类号： F28D15/046

摘要： A heat pipe includes a hollow metal casing and a wick structure arranged at an inner surface of the hollow metal casing. A part of the inner surface of the hollow metal casing is covered with the wick structure and other parts of the inner surface are uncovered with the wick structure.

摘要翻译： 热管包括中空金属壳体和布置在中空金属壳体的内表面处的芯结构。 中空金属外壳的内表面的一部分被芯体结构覆盖，并且内表面的其它部分被芯结构覆盖。

公开(公告)号：US20090155099A1

公开(公告)日：2009-06-18

申请号：US11959436

申请日：2007-12-18

申请人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

发明人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC分类号： F04B17/00

CPC分类号： F04D13/064 ,  F04D13/0673

摘要： A pump includes a base (10), a case (20) fixed on the base, a stator (30) embedded into the case, a rotor unit (40) sandwiched between the base and the case. The rotor unit includes an inner rotor (42) surrounded by the stator and an outer rotor (44) surrounding the stator. Magnetic fields produced by the stator have interior parts interacting with the inner rotor, and exterior parts interlinking with the outer rotor. Therefore, the magnetic fields are able to be utilized sufficiently to drive the rotor unit to have a high speed rotation, and an operation efficiency of the pump is enhanced accordingly.

摘要翻译： 泵包括基座（10），固定在基座上的壳体（20），嵌入壳体中的定子（30），夹在基座和壳体之间的转子单元（40）。 转子单元包括被定子包围的内转子（42）和围绕定子的外转子（44）。 由定子产生的磁场具有与内转子相互作用的内部部分，以及与外转子相互连接的外部部件。 因此，能够充分利用磁场来驱动转子单元进行高速旋转，从而相应地提高泵的运转效率。

公开(公告)号：US20090154168A1

公开(公告)日：2009-06-18

申请号：US12037100

申请日：2008-02-26

申请人： WEN-XIANG ZHANG ,  GUANG YU ,  CHENG-TIEN LAI

发明人： WEN-XIANG ZHANG ,  GUANG YU ,  CHENG-TIEN LAI

IPC分类号： F21V7/00

CPC分类号： F21V29/74 ,  F21K9/00 ,  F21V7/0008 ,  F21V15/02 ,  F21V23/02 ,  F21V29/75 ,  F21V29/763 ,  F21V31/005 ,  F21W2111/06 ,  F21W2121/00 ,  F21Y2115/10

摘要： An LED lamp includes a frame, a heat sink, an LED module and a reflector. The frame comprises a base, an upper ring spaced from the base and a plurality of stanchions connecting the upper ring and the base together. The heat sink is coupled to a top of the upper ring and covers a whole of a top of the frame. The LED module is attached to a bottom surface of the heat sink and surrounded by the upper ring. The reflector is placed on the base and has an outer surface facing and slantwise to the LED module. The reflector has a configuration like an inverted funnel. The outer surface of the reflector has multiple steps formed thereon.

摘要翻译： LED灯包括框架，散热器，LED模块和反射器。 框架包括基座，与基座间隔开的上环和连接上环和底座的多个支柱。 散热器耦合到上环的顶部并且覆盖框架的整个顶部。 LED模块连接到散热器的底部表面，并被上环环绕。 反射器放置在基座上，并且具有面向并且朝向LED模块倾斜的外表面。 反射器具有如倒置漏斗的结构。 反射器的外表面形成有多个台阶。

公开(公告)号：US20090151921A1

公开(公告)日：2009-06-18

申请号：US11959438

申请日：2007-12-18

申请人： CHI-YUAN LAI ,  ZHI-YONG ZHOU ,  CHENG-TIEN LAI

发明人： CHI-YUAN LAI ,  ZHI-YONG ZHOU ,  CHENG-TIEN LAI

IPC分类号： F28F3/00

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, and a plurality of heat pipes sandwiched between the lower plate and the upper plate. The lower plate includes a panel, a pair of sidewalls extending upwardly from two opposite sides of the panel, and a plurality of flanges extending upwardly from the sidewalls, respectively. The upper plate defines a plurality of cutouts corresponding to the flanges. The flanges fit into the cutouts to position the upper plate on the lower plate, whereby the lower plate and the upper plate are mechanically connected together.

摘要翻译： 用于冷却电子部件的散热适配器包括下板，固定在下板上的上板和夹在下板与上板之间的多个热管。 下板包括面板，从面板的两个相对侧向上延伸的一对侧壁和分别从侧壁向上延伸的多个凸缘。 上板限定对应于凸缘的多个切口。 凸缘装配到切口中以将上板定位在下板上，由此下板和上板机械连接在一起。

公开(公告)号：US20090151906A1

公开(公告)日：2009-06-18

申请号：US11959313

申请日：2007-12-18

申请人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

发明人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC分类号： F28D15/00

CPC分类号： F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink includes a tank and a plate covering on the tank and hermetically engaging with the tank. The tank includes a base for absorbing heat from heat-generating members and a first wick layer formed at an inner face of base. The plate has a second wick layer formed at an inner face thereof. A chamber is defined between the tank and the plate and contains working fluid therein. An artery mesh is located in the chamber between the tank and the plate. The artery mesh is in porosity communication with the first wick layer and the second wick layer.

摘要翻译： 散热器包括一个罐和一个覆盖在罐上的板，并与油箱密封接合。 该罐包括用于从发热部件吸收热量的基座和形成在基部内表面的第一芯线层。 该板具有形成在其内表面的第二芯吸层。 在罐和板之间限定一个室，并在其中包含工作流体。 动脉网位于罐和板之间的腔室中。 动脉网与第一芯线层和第二芯线层连通。

公开(公告)号：US20090103308A1

公开(公告)日：2009-04-23

申请号：US12013379

申请日：2008-01-11

申请人： FANG-WEI XU ,  GUANG YU ,  CHENG-TIEN LAI

发明人： FANG-WEI XU ,  GUANG YU ,  CHENG-TIEN LAI

IPC分类号： F21V29/00

CPC分类号： F21V29/77 ,  F21K9/00 ,  F21V29/75 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： An LED lamp includes a plurality of LED modules, a cone-shaped heat absorbing member, a heat sink and an envelope. The heat absorbing member comprises a plurality of heat absorbing portions. Each of the heat absorbing portions has a configuration like a triangular pyramid and comprises a sector base and an inclined surface extending from an edge of the sector base to a single apex. Each of the LED modules is attached on a corresponding inclined surface. The heat sink thermally connects with the heat absorbing member. The envelope is mounted below the heat sink and engages with the heat sink to enclose the heat absorbing member and the LED modules therein. Heat generated by the LED modules is first absorbed by the heat absorbing member and then dissipated to ambient air through the heat sink.

摘要翻译： LED灯包括多个LED模块，锥形吸热构件，散热器和外壳。 吸热构件包括多个吸热部。 每个吸热部分具有如三角锥体的构造，并且包括扇形基部和从扇形基部的边缘延伸到单个顶点的倾斜表面。 每个LED模块附接在相应的倾斜表面上。 散热器与吸热构件热连接。 信封安装在散热器下方并与散热器接合，以将吸热件和LED组件封闭在其中。 由LED模块产生的热量首先被吸热构件吸收，然后通过散热器散发到环境空气中。

公开(公告)号：US20090059605A1

公开(公告)日：2009-03-05

申请号：US11933996

申请日：2007-11-01

申请人： FANG-WEI XU ,  GUANG YU ,  CHENG-TIEN LAI

发明人： FANG-WEI XU ,  GUANG YU ,  CHENG-TIEN LAI

IPC分类号： F21V29/00

CPC分类号： F21V29/763 ,  F21K9/00 ,  F21V29/51 ,  F21V29/75 ,  F21Y2115/10

摘要： An LED lamp includes a heat dissipation apparatus with a base, an LED module mounted on the base, and an AC-DC converter electrically connected to the LED module. The AC-DC converter is mounted on the base near the LED module. Heat generated by the LED module and heat-generating components of the AC-DC converter is transferred to the base from which the heat is dissipated by the heat dissipation apparatus. Heat pipes are embedded in the base of the heat dissipation apparatus.

摘要翻译： LED灯包括具有基座的散热装置，安装在基座上的LED模块以及与LED模块电连接的AC-DC转换器。 AC-DC转换器安装在LED模块附近的基座上。 由LED模块产生的热量和AC-DC转换器的发热部件传递到由散热装置散热的基座。 热管埋在散热装置的底部。