公开(公告)号：US20090314739A1

公开(公告)日：2009-12-24

申请号：US12345896

申请日：2008-12-30

Applicant: CHIH-KANG YANG ,  WEN-CHIN LEE

Inventor： CHIH-KANG YANG ,  WEN-CHIN LEE

IPC: B44C1/22 ,  C23F1/08

CPC classification number: H05K3/0085 ,  H05K3/068 ,  H05K2203/0195 ,  H05K2203/075 ,  H05K2203/082 ,  H05K2203/1476 ,  H05K2203/1509 ,  H05K2203/166

Abstract: An exemplary system for processing a workpiece comprises a conveyor, a first liquid spraying device, a second liquid spraying device, and a substrate positioning device. The conveyor is configured for conveying the workpiece along a conveying direction. The first and second liquid spraying devices for spraying liquid onto the workpiece transported on the conveyor face the conveyor and are arranged along the conveying direction. The substrate positioning device for reorienting the workpiece on the conveyor is installed between the first and second liquid spraying devices and faces the conveyor.

Abstract translation: 用于处理工件的示例性系统包括输送机，第一液体喷射装置，第二液体喷射装置和基板定位装置。 输送机构造成沿输送方向输送工件。 第一和第二液体喷射装置，用于将液体喷射到在输送机上传送的工件上，并且沿输送方向布置。 用于在输送机上重新定向工件的基板定位装置安装在第一和第二液体喷涂装置之间并面向输送机。

公开(公告)号：US20090107706A1

公开(公告)日：2009-04-30

申请号：US12135842

申请日：2008-06-09

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: H05K1/00

CPC classification number: H05K3/4641 ,  H05K3/386 ,  H05K2201/0382 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A multilayer printed circuit board includes a first printed circuit board, a second printed circuit board, an adhesive film, and a function layer. The adhesive film is sandwiched between the first printed circuit board and the second printed circuit board. The function layer is disposed between the first printed circuit board and the second printed circuit board for blocking water from passing therethrough and for screening electromagnetic interference between the first printed circuit board and the second printed circuit board.

Abstract translation: 多层印刷电路板包括第一印刷电路板，第二印刷电路板，粘合膜和功能层。 粘合膜夹在第一印刷电路板和第二印刷电路板之间。 功能层设置在第一印刷电路板和第二印刷电路板之间，用于阻止水从其中通过，并用于屏蔽第一印刷电路板和第二印刷电路板之间的电磁干扰。

公开(公告)号：US20090050602A1

公开(公告)日：2009-02-26

申请号：US12135843

申请日：2008-06-09

Applicant: CHENG-HSIEN LIN ,  WEN-CHIN LEE ,  KAI-LI JIANG

Inventor： CHENG-HSIEN LIN ,  WEN-CHIN LEE ,  KAI-LI JIANG

IPC: H01B13/00

CPC classification number: H05K3/0038 ,  B82Y10/00 ,  H05K2201/0112 ,  H05K2201/026 ,  H05K2201/0323

Abstract: A method for forming holes in making a printed circuit board includes the step of: providing a copper clad laminate including an insulation layer and a copper layer laminated on the insulation layer; forming a carbon nano-material on the copper layer of the copper clad laminate; and applying a laser beam onto a portion of the carbon nano-material to define a hole in the copper clad laminate beneath the portion of the carbon nano-material.

Abstract translation: 一种在制造印刷电路板中形成孔的方法包括以下步骤：提供层压在绝缘层上的包括绝缘层和铜层的覆铜层压板; 在覆铜层压板的铜层上形成碳纳米材料; 以及将激光束施加到所述碳纳米材料的一部分上以在所述碳纳米材料部分之下的所述覆铜层压板中限定出一个孔。

公开(公告)号：US20080035603A1

公开(公告)日：2008-02-14

申请号：US11614362

申请日：2006-12-21

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: H01B13/00 ,  B44C1/22 ,  C23F1/00

CPC classification number: C23F1/08 ,  H05K3/068 ,  H05K2203/075

Abstract: The present invention relates to an apparatus for spraying an etchant and a method for manufacturing a printed circuit board. In one exemplary embodiment the apparatus includes a manifold, a plurality of feed pipes in fluid communication with the manifold, each of the feed pipes having a plurality of spray nozzles mounted thereon, the feed pipes cooperatively constitute a spray region, and a pressure-boosting device configured for increasing a spray pressure of the spray nozzles which are located at a central area of the spray region. The apparatus can overcome “the puddle effect” on an upper surface of the printed circuit board.

Abstract translation: 本发明涉及喷涂蚀刻剂的设备和印刷电路板的制造方法。 在一个示例性实施例中，设备包括歧管，与歧管流体连通的多个进料管，每个进料管具有安装在其上的多个喷嘴，进料管协同地构成喷射区域，并且加压 该装置被配置为增加位于喷射区域的中心区域处的喷嘴的喷雾压力。 该设备可以克服印刷电路板上表面上的“水坑效应”。