利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

53 条记录 (耗时 0.031 秒)

    Resistive material for bolometer, bolometer for infrared detector using the material, and method of manufacturing the bolometer
    11.
    发明授权
    Resistive material for bolometer, bolometer for infrared detector using the material, and method of manufacturing the bolometer 有权
    辐射热测量仪的电阻材料，使用该材料的红外探测器的测辐射热仪，以及制造测辐射热计的方法

    公开(公告)号：US08143579B2

    公开(公告)日：2012-03-27

    申请号：US12859466

    申请日：2010-08-19

    申请人： Woo Seok Yang ,  Sang Hoon Cheon ,  Seong Mok Cho ,  Ho Jun Ryu ,  Chang Auck Choi

    发明人： Woo Seok Yang ,  Sang Hoon Cheon ,  Seong Mok Cho ,  Ho Jun Ryu ,  Chang Auck Choi

    IPC分类号： G01J5/20

    CPC分类号： G01J5/04 ,  G01J5/046

    摘要： A resistive material for a bolometer, a bolometer for an infrared detector using the material, and a method of manufacturing the bolometer are provided. In the resistive material, at least one element selected from the group consisting of nitrogen (N), oxygen (O) and germanium (Ge) is included in antimony (Sb). The resistive material has superior properties such as high temperature coefficient of resistance (TCR), low resistivity, a low noise constant, and is easily formed in a thin film structure by sputtering typically used in a complementary metal-oxide semiconductor (CMOS) process, so that it can be used as a resistor for the bolometer for an uncooled infrared detector, and thus provide the infrared detector with superior temperature precision.

    摘要翻译： 提供了用于测辐射热力计的电阻材料，用于使用该材料的红外探测器的测辐射热计，以及制造测辐射热计的方法。 在电阻材料中，选自氮（N），氧（O）和锗（Ge）中的至少一种元素包括在锑（Sb）中。 电阻材料具有优异的性能，例如高温电阻系数（TCR），低电阻率，低噪声常数，并且易于通过通常用于互补金属氧化物半导体（CMOS）工艺中的溅射在薄膜结构中形成， 因此它可以用作非制冷红外探测器的辐射热计的电阻器，从而为红外检测器提供出色的温度精度。

    RESISTIVE MATERIAL FOR BOLOMETER, BOLOMETER FOR INFRARED DETECTOR USING THE MATERIAL, AND METHOD OF MANUFACTURING THE BOLOMETER
    14.
    发明申请
    RESISTIVE MATERIAL FOR BOLOMETER, BOLOMETER FOR INFRARED DETECTOR USING THE MATERIAL, AND METHOD OF MANUFACTURING THE BOLOMETER 有权
    用于使用该材料的红外探测器的玻璃体，BOLOMETER的电阻材料及其制造方法

    公开(公告)号：US20110049366A1

    公开(公告)日：2011-03-03

    申请号：US12859466

    申请日：2010-08-19

    申请人： Woo Seok Yang ,  Sang Hoon Cheon ,  Seong Mok Cho ,  Ho Jun Ryu ,  Chang Auck Choi

    发明人： Woo Seok Yang ,  Sang Hoon Cheon ,  Seong Mok Cho ,  Ho Jun Ryu ,  Chang Auck Choi

    IPC分类号： H01L31/09 ,  H01L31/18 ,  C09K3/00

    CPC分类号： G01J5/04 ,  G01J5/046

    摘要： A resistive material for a bolometer, a bolometer for an infrared detector using the material, and a method of manufacturing the bolometer are provided. In the resistive material, at least one element selected from the group consisting of nitrogen (N), oxygen (O) and germanium (Ge) is included in antimony (Sb). The resistive material has superior properties such as high temperature coefficient of resistance (TCR), low resistivity, a low noise constant, and is easily formed in a thin film structure by sputtering typically used in a complementary metal-oxide semiconductor (CMOS) process, so that it can be used as a resistor for the bolometer for an uncooled infrared detector, and thus provide the infrared detector with superior temperature precision.

    摘要翻译： 提供了用于测辐射热力计的电阻材料，用于使用该材料的红外探测器的测辐射热计，以及制造测辐射热计的方法。 在电阻材料中，选自氮（N），氧（O）和锗（Ge）中的至少一种元素包括在锑（Sb）中。 电阻材料具有优异的性能，例如高温电阻系数（TCR），低电阻率，低噪声常数，并且易于通过通常用于互补金属氧化物半导体（CMOS）工艺中的溅射在薄膜结构中形成， 因此它可以用作非制冷红外探测器的辐射热计的电阻器，从而为红外检测器提供出色的温度精度。

    Infrared sensor and method of fabricating the same
    15.
    发明授权
    Infrared sensor and method of fabricating the same 失效
    红外线传感器及其制造方法

    公开(公告)号：US08053730B2

    公开(公告)日：2011-11-08

    申请号：US12511251

    申请日：2009-07-29

    申请人： Seong Mok Cho ,  Ho Jun Ryu ,  Woo Seok Yang ,  Sang Hoon Cheon ,  Byoung Gon Yu ,  Chang Auk Choi

    发明人： Seong Mok Cho ,  Ho Jun Ryu ,  Woo Seok Yang ,  Sang Hoon Cheon ,  Byoung Gon Yu ,  Chang Auk Choi

    IPC分类号： G01J5/02

    CPC分类号： G01J5/20 ,  G01J5/02 ,  G01J5/023 ,  G01J5/10 ,  H01L31/022408 ,  H01L31/108

    摘要： An infrared sensor and a method of fabricating the same are provided. The sensor includes a substrate including a reflection layer and a plurality of pad electrodes, an interdigitated sensing electrode connected to the pad electrode and formed to be spaced apart from the reflection layer by a predetermined distance and a sensing layer formed on the sensing electrode and having an opening exposing a portion in which an interdigitated region of the sensing electrode connected to one pad region is separated from the sensing electrode connected to the other pad electrode. Therefore, the sensor has an electrode in a very simple constitution, and a sensing layer divided into rectangular blocks, so that current that non-uniformly flows into the electrode can be removed. Accordingly, the sensor in which current of the sensing layer can be uniformly flown, and noise is lowered can be implemented.

    摘要翻译： 提供了一种红外线传感器及其制造方法。 该传感器包括：基板，包括反射层和多个焊盘电极;连接到焊盘电极并形成为与反射层隔开预定距离的叉指感测电极，以及形成在感测电极上的感测层， 连接到一个焊盘区域的感测电极的交错区域与连接到另一个焊盘电极的感测电极分离的部分露出。 因此，传感器具有非常简单的结构的电极和分为矩形块的感测层，从而可以去除不均匀地流入电极的电流。 因此，可以实现感测层的电流可以均匀地流动并且噪声降低的传感器。

    Sound detecting circuit and amplifier circuit thereof
    16.
    发明授权
    Sound detecting circuit and amplifier circuit thereof 有权
    声音检测电路及其放大电路

    公开(公告)号：US09077287B2

    公开(公告)日：2015-07-07

    申请号：US13531437

    申请日：2012-06-22

    申请人： Yi-Gyeong Kim ,  Min-Hyung Cho ,  Tae Moon Roh ,  Jong-Kee Kwon ,  Woo Seok Yang ,  Jongdae Kim

    发明人： Yi-Gyeong Kim ,  Min-Hyung Cho ,  Tae Moon Roh ,  Jong-Kee Kwon ,  Woo Seok Yang ,  Jongdae Kim

    IPC分类号： H03F99/00 ,  H03F3/08

    CPC分类号： H03F3/08

    摘要： Disclosed is a sound detecting circuit which includes a sensing unit configured to generate an AC signal in response to a sound pressure level of a sound signal; an amplification unit configured to amplify the AC signal; and a bias voltage generating unit configured to generate a bias voltage to be provided to the amplification unit. The bias voltage generating unit comprises a current source configured to provide a power current; and a current-voltage converting circuit configured to convert the power current into the bias voltage and to reduce a noise due to the power current.

    摘要翻译： 公开了一种声音检测电路，其包括：感测单元，被配置为响应于声音信号的声压级产生AC信号; 放大单元，被配置为放大AC信号; 以及偏置电压产生单元，被配置为产生要提供给所述放大单元的偏置电压。 偏置电压产生单元包括被配置为提供功率电流的电流源; 以及电流电压转换电路，被配置为将功率电流转换成偏置电压并且减少由于功率电流引起的噪声。

    Process independent temperature sensor based on oscillator
    17.
    发明授权
    Process independent temperature sensor based on oscillator 有权
    基于振荡器的独立温度传感器

    公开(公告)号：US09068896B2

    公开(公告)日：2015-06-30

    申请号：US13620594

    申请日：2012-09-14

    申请人： Seok Ju Yun ,  Young-deuk Jeon ,  Tae Moon Roh ,  Jong-Kee Kwon ,  Woo Seok Yang ,  Jongdae Kim

    发明人： Seok Ju Yun ,  Young-deuk Jeon ,  Tae Moon Roh ,  Jong-Kee Kwon ,  Woo Seok Yang ,  Jongdae Kim

    IPC分类号： G01K11/00 ,  G01K7/32

    CPC分类号： G01K7/32

    摘要： The inventive concept discloses a new temperature sensor structure based on oscillator which is insensitive to a process change and improves an error rate of temperature output. The temperature sensor based on oscillator compares an oscillator circuit structure insensitive to a temperature change with an oscillator circuit structure having a frequency change in proportion to a temperature change to output a relative difference between the two oscillator circuit structures and thereby it is compensated itself. In the temperature sensor based on oscillator, a problem of performance reduction due to an external environment and a process deviation of temperature sensor is improved and an output distortion and temperature nonlinearity are effectively improved. Thus, since the temperature sensor based on oscillator has a structure of high performance, low power and low cost, it can be variously used in a detection equipment of temperature environment.

    摘要翻译： 本发明的概念公开了一种基于振荡器的新型温度传感器结构，其对过程变化不敏感并且提高了温度输出的误差率。 基于振荡器的温度传感器将对温度变化不敏感的振荡器电路结构与具有与温度变化成比例的频率变化的振荡器电路结构进行比较，以输出两个振荡器电路结构之间的相对差，由此自身进行补偿。 在基于振荡器的温度传感器中，提高了由于外部环境导致的性能降低和温度传感器的工艺偏差的问题，并且有效地提高了输出失真和温度非线性。 因此，由于基于振荡器的温度传感器具有高性能，低功率和低成本的结构，因此可以被多种用于温度环境的检测设备中。

    ACOUSTIC SENSOR AND FABRICATION METHOD THEREOF
    19.
    发明申请
    ACOUSTIC SENSOR AND FABRICATION METHOD THEREOF 有权
    声学传感器及其制造方法

    公开(公告)号：US20130100779A1

    公开(公告)日：2013-04-25

    申请号：US13557108

    申请日：2012-07-24

    申请人： Jae Woo LEE ,  Chang Han Je ,  Woo Seok Yang ,  Jong Dae Kim

    发明人： Jae Woo LEE ,  Chang Han Je ,  Woo Seok Yang ,  Jong Dae Kim

    IPC分类号： H04R17/00 ,  H04R31/00

    CPC分类号： H04R19/005 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R19/04 ,  H04R31/00 ,  Y10T29/49005 ,  H01L2924/00014

    摘要： A method for fabricating an acoustic sensor according to an exemplary embodiment of the present disclosure includes: forming an acoustic sensor unit by forming a lower electrode on an upper portion of a substrate, forming etching holes on the lower electrode, forming a sacrifice layer on an upper portion of the lower electrode, and coupling a diaphragm to an upper portion of the sacrifice layer; coupling a lower portion of the substrate of the acoustic sensor unit to a printed circuit board on which a sound pressure input hole is formed so as to expose the lower portion of the substrate of the acoustic sensor unit to the outside through the sound pressure input hole; attaching a cover covering the acoustic sensor unit on the printed circuit board; etching the substrate of the acoustic sensor unit to form an acoustic chamber; and removing the sacrifice layer.

    摘要翻译： 根据本公开的示例性实施例的用于制造声学传感器的方法包括：通过在基板的上部形成下电极来形成声传感器单元，在下电极上形成蚀刻孔，在其上形成牺牲层 下部电极的上部，并且将隔膜连接到牺牲层的上部; 将声学传感器单元的基板的下部耦合到其上形成有声压输入孔的印刷电路板，以便通过声压输入孔将声学传感器单元的基板的下部暴露于外部 ; 将覆盖所述声学传感器单元的盖附着在所述印刷电路板上; 蚀刻声学传感器单元的基板以形成声学室; 并去除牺牲层。

    ACOUSTIC SENSOR AND METHOD OF MANUFACTURING THE SAME
    20.
    发明申请
    ACOUSTIC SENSOR AND METHOD OF MANUFACTURING THE SAME 有权
    声学传感器及其制造方法

    公开(公告)号：US20120098076A1

    公开(公告)日：2012-04-26

    申请号：US13012489

    申请日：2011-01-24

    申请人： Jaewoo LEE ,  Chang Han Je ,  Woo Seok Yang ,  Jongdae Kim

    发明人： Jaewoo LEE ,  Chang Han Je ,  Woo Seok Yang ,  Jongdae Kim

    IPC分类号： H01L29/84 ,  H01L21/02

    CPC分类号： H04R31/00 ,  H04R19/005 ,  H04R19/02

    摘要： Provided is an acoustic sensor. The acoustic sensor includes: a substrate including sidewall portions and a bottom portion extending from a bottom of the sidewall portions; a lower electrode fixed at the substrate and including a concave portion and a convex portion, the concave portion including a first hole on a middle region of the bottom, the convex portion including a second hole on an edge region of the bottom; diaphragms facing the concave portion of the lower electrode, with a vibration space therebetween; diaphragm supporters provided on the lower electrode at a side of the diaphragm and having a top surface having the same height as the diaphragm; and an acoustic chamber provided in a space between the bottom portion and the sidewall portions below the lower electrode.

    摘要翻译： 提供了一种声学传感器。 声学传感器包括：基底，其包括侧壁部分和从侧壁部分的底部延伸的底部部分; 固定在所述基板上的下部电极，具有凹部和凸部，所述凹部包括在所述底部的中间区域的第一孔，所述凸部包括在所述底部的边缘区域上的第二孔; 隔膜面向下电极的凹部，其间具有振动空间; 隔膜支撑体设置在隔膜侧面的下电极上，具有与隔膜相同高度的顶表面; 以及设置在下部电极下方的底部和侧壁部之间的空间中的声学室。