公开(公告)号：US20090026169A1

公开(公告)日：2009-01-29

申请号：US12010195

申请日：2008-01-22

申请人： Chung-Woo Cho ,  Soon-Jin Cho ,  Byung-Bae Seo ,  Ki-Young Yoo ,  Seok-Hwan Ahn

发明人： Chung-Woo Cho ,  Soon-Jin Cho ,  Byung-Bae Seo ,  Ki-Young Yoo ,  Seok-Hwan Ahn

IPC分类号： H01B13/00 ,  B23K26/36

CPC分类号： H05K3/0008 ,  H05K1/0269 ,  H05K3/0035 ,  H05K3/4644 ,  H05K3/4679 ,  H05K2201/0108 ,  H05K2201/09918

摘要： A printed circuit board manufacturing system and a manufacturing method thereof are disclosed. A method of manufacturing printed circuit board, comprising: providing a substrate that comprises a pad and an insulation layer covering the pad; acquiring an image of the substrate; acquiring location information of the pad by analyzing the image of the substrate; forming a via hole by removing a part of the insulation layer that corresponds the location information of the pad; and forming a via by filling the via hole with a conductive material, provides improved process conformity, even if the substrate has partial or nonlinear deformation, by considering the location information of the pad in the via hole forming. The improved conformity may allow more flexibility to substrate design and more integrity for circuitries on printed circuit board.

摘要翻译： 公开了印刷电路板制造系统及其制造方法。 一种制造印刷电路板的方法，包括：提供包括衬垫和覆盖所述衬垫的绝缘层的衬底; 获取所述基板的图像; 通过分析衬底的图像来获取衬垫的位置信息; 通过去除与衬垫的位置信息相对应的绝缘层的一部分来形成通孔; 并且通过用导电材料填充通孔形成通孔，通过考虑通孔形成中的焊盘的位置信息，即使衬底具有部分或非线性变形也提供了改进的工艺一致性。 改进的一致性可以允许对印刷电路板上的电路板的基板设计和更完整性的更大的灵活性。