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17 条记录 (耗时 0.019 秒)

    INTEGRATED CIRCUIT LEADLESS PACKAGE SYSTEM
    15.
    发明申请
    INTEGRATED CIRCUIT LEADLESS PACKAGE SYSTEM 有权
    集成电路无铅封装系统

    公开(公告)号：US20070108567A1

    公开(公告)日：2007-05-17

    申请号：US11381726

    申请日：2006-05-04

    申请人： Leocadio Alabin ,  Il Kwon Shim ,  Henry Bathan ,  Jeffrey Punzalan

    发明人： Leocadio Alabin ,  Il Kwon Shim ,  Henry Bathan ,  Jeffrey Punzalan

    IPC分类号： H01L23/495

    CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L24/97 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

    摘要： An integrated circuit leadless package system is presented comprising forming a QFN leadframe comprises providing a die pad, forming a fishtail tie-bar on the die pad, forming a row of an outer contact pad around the die pad, forming an additional outer contact pad around the fishtail tie-bar, and forming an inner contact pad in a staggered position from the outer contact pad, mounting an integrated circuit on the die pad of the QFN leadframe, and attaching a bond wire from the integrated circuit to the additional outer contact pad.

    摘要翻译： 提供了一种集成电路无引线封装系统，包括形成QFN引线框架，包括提供管芯焊盘，在管芯焊盘上形成鱼尾连接杆，在管芯焊盘周围形成一排外部接触焊盘，形成附近的外部接触焊盘 钓鱼连接杆，并且从外部接触垫形成交错位置的内部接触垫，将集成电路安装在QFN引线框架的管芯焊盘上，以及将来自集成电路的接合线附接到附加的外部接触焊盘 。

    INTEGRATED CIRCUIT PACKAGING SYSTEM INCLUDING A NON-LEADED PACKAGE
    16.
    发明申请
    INTEGRATED CIRCUIT PACKAGING SYSTEM INCLUDING A NON-LEADED PACKAGE 有权
    集成电路封装系统，包括非引线封装

    公开(公告)号：US20070182024A1

    公开(公告)日：2007-08-09

    申请号：US11307383

    申请日：2006-02-04

    申请人： Jeffrey Punzalan ,  Henry Bathan ,  Il Kwon Shim ,  Keng Kiat Lau

    发明人： Jeffrey Punzalan ,  Henry Bathan ,  Il Kwon Shim ,  Keng Kiat Lau

    IPC分类号： H01L23/48

    CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/49541 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated circuit non-leaded package system is provided including: forming a plurality of leads with a predetermined thickness and a predetermined interval gap between each of the plurality of leads; configuring each one of the plurality of leads to include first terminal ends disposed adjacent an integrated circuit and second terminal ends disposed along a periphery of a package; and forming the second terminal ends of alternating leads disposed along the periphery of the package to form a lead-to-lead gap between adjacent leads in excess of the predetermined interval gap.

    摘要翻译： 提供一种集成电路非引线封装系统，包括：在多个引线中的每一个之间形成预定厚度的多个引线和预定的间隔间隙; 配置所述多个引线中的每一个包括邻近集成电路设置的第一终端和沿着封装的周边设置的第二终端; 以及形成沿所述封装的周边布置的交替引线的第二端部，以在相邻引线之间形成超过所述预定间隔间隙的引线到引线间隙。

    NON-LEADED INTEGRATED CIRCUIT PACKAGE SYSTEM
    17.
    发明申请
    NON-LEADED INTEGRATED CIRCUIT PACKAGE SYSTEM 有权
    非引线集成电路封装系统

    公开(公告)号：US20070114650A1

    公开(公告)日：2007-05-24

    申请号：US11164335

    申请日：2005-11-18

    申请人： Jeffrey Punzalan ,  Henry Bathan ,  Il Kwon Shim

    发明人： Jeffrey Punzalan ,  Henry Bathan ,  Il Kwon Shim

    IPC分类号： H01L23/48

    CPC分类号： H01L23/49503 ,  H01L23/49541 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A non-leaded integrated circuit package system is provided providing a die paddle of a lead frame, forming a dual row of terminals including outer terminal pads and inner terminal pads, and selectively fusing an extension between the die paddle and instances of the inner terminal pads.

    摘要翻译： 提供了一种非引线集成电路封装系统，其提供引线框架的管芯焊盘，形成包括外部端子焊盘和内部端子焊盘的双排端子，并且选择性地熔合管芯焊盘与内部端子焊盘的实例之间的延伸 。