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公开(公告)号：US11510316B2
公开(公告)日：2022-11-22
申请号：US17249339
申请日：2021-02-26
发明人： Abderrazzaq Ifis
摘要： A component carrier with an electrically insulating layer having a front side and a back side, a first and a second electrically conductive layer covering the front side and the back side of the electrically insulating layer, respectively. A through hole extends through both electrically conductive layers and the electrically insulating layer. An overhang is formed along one of the electrically conductive layers and sidewalls of the electrically insulating layer structure delimiting the through hole. An annular plating layer covers the sidewalls and fills part of the overhang such that a horizontal extension of the overhang after plating is less than 20 μm and/or such that a ratio between a horizontal extension of the overhang after plating and a width of a first window through the first electrically conductive layer and/or a width of a second window through the second electrically conductive layer is smaller than 20%.
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公开(公告)号：US20220353997A1
公开(公告)日：2022-11-03
申请号：US17660741
申请日：2022-04-26
摘要： A component carrier includes a layer body with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component embedded in the layer body, and at least one galvanic connection stack at least partially on at least part of at least one main surface of the layer body. At least one of a bottom main surface and a top main surface of the embedded component is electrically connected to the at least one galvanic connection stack.
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公开(公告)号：US11445601B2
公开(公告)日：2022-09-13
申请号：US17247832
申请日：2020-12-24
发明人： Mikael Tuominen , Seok Kim Tay
IPC分类号： H05K1/02 , H05K1/18 , H01L21/48 , H01L23/31 , H01L23/498
摘要： A component carrier includes a stack having at least one electrically conductive layer structure, a first electrically insulating layer structure and a second electrically insulating layer structure. The first electrically insulating layer structure is made of a material which has first physical properties. The second electrically insulating layer structure is made of another material which has second physical properties differing from the first physical properties. The first electrically insulating layer structure and the second electrically insulating layer structure are at least partially in direct physical contact with each other. A method of manufacturing a component carrier is also disclosed.
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公开(公告)号：US11412622B2
公开(公告)日：2022-08-09
申请号：US16808109
申请日：2020-03-03
发明人： Thomas Kristl , Ewald Moitzi
IPC分类号： H05K1/02 , H05K1/03 , H05K1/09 , H05K1/11 , H05K1/16 , H05K1/18 , H05K3/00 , H05K3/06 , H05K3/10 , H05K3/30 , H05K3/38 , H05K3/42 , H05K3/46 , H01L21/02 , H01L21/44 , H01L21/48 , H01L21/8239 , H01L23/02 , H01L23/34 , H01L23/48 , H01L23/52 , H01L23/46 , H01L23/66 , H01L23/498
摘要： A component carrier includes a stack having an electrically conductive layer structure, with at least one recess, on an electrically insulating layer structure; a dielectric filling medium filling at least part of the at least one recess; and a further electrically insulating layer structure on the electrically conductive layer structure and on the dielectric filling medium. A method of manufacturing a component carrier includes forming a stack having an electrically conductive layer structure, with at least one recess, on an electrically insulating layer structure; at least partially filling the at least one recess by a dielectric filling medium; and thereafter forming a further electrically insulating layer structure on the electrically conductive layer structure and on the dielectric filling medium.
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公开(公告)号：US11388824B2
公开(公告)日：2022-07-12
申请号：US16153199
申请日：2018-10-05
IPC分类号： H05K1/09 , H05K1/11 , H05K1/18 , H05K3/46 , H05K3/10 , H05K3/36 , H05K1/02 , B29C64/10 , B33Y99/00 , H05K3/12 , B33Y80/00 , B33Y10/00 , B33Y70/00
摘要： A component carrier and a method for manufacturing a component carrier is described wherein the component carrier includes a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures where the wiring structure is at least partially formed as a three-dimensionally printed structure.
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公开(公告)号：US20220190464A1
公开(公告)日：2022-06-16
申请号：US17653628
申请日：2022-03-04
发明人： Marco Gavagnin , Markus Leitgeb , Ahmad Bader Alothman Alterkawi , Ferdinand Lutschounig , Heinz Moitzi , Thomas Krivec , Gernot Grober , Erich Schlaffer , Mike Morianz , Rainer Frauwallner , Hubert Haidinger , Gernot Schulz , Gernot Gmunder
摘要： A component carrier and a method for manufacturing a component carrier are disclosed. The component carrier comprises a carrier body having a plurality of electrically conductive layer structures and/or electrically isolating layer structures and a three-dimensionally printed structure forming at least a part of an antenna on the carrier body.
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公开(公告)号：US20220158366A1
公开(公告)日：2022-05-19
申请号：US17649969
申请日：2022-02-04
摘要： An arrangement is illustrated and described. The arrangement includes a component carrier including ia) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ib) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier; ii) the further component carrier connected with the component carrier by the at least one elastic element, wherein the further component carrier includes: iia) a further recess configured such that the component carrier is at least partially placeable into the further recess; iii) the component carrier is a smaller unit than the further component carrier, and iv) the component carrier is at least partially placed into the further recess.
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公开(公告)号：US11284511B2
公开(公告)日：2022-03-22
申请号：US16190976
申请日：2018-11-14
摘要： A component carrier and a method for manufacturing the same are disclosed. The component carrier includes an electrically conductive layer structure and an overhanging end. A first surface finish is formed on a first surface portion of the electrically conductive layer structure. Furthermore, the component carrier further includes a second surface finish on a second surface portion of the electrically conductive layer structure connected to the first surface finish and extending under the overhanging end.
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公开(公告)号：US20210329779A1
公开(公告)日：2021-10-21
申请号：US17301756
申请日：2021-04-13
发明人： Artan Baftiri
摘要： A component carrier includes a stack having a first electrically insulating layer structure and a first electrically conductive layer structure arranged on the first electrically insulating layer structure. The first electrically insulating layer structure has at least one first covered portion, which is covered by the first electrically conductive layer structure, and at least one first non-covered portion, which is not covered by the first electrically conductive layer structure. The first electrically insulating layer structure defines a recess at the at least one first non-covered portion.
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公开(公告)号：US20210315104A1
公开(公告)日：2021-10-07
申请号：US17301130
申请日：2021-03-25
发明人： Jolanta Klocek
IPC分类号： H05K3/06
摘要： A method of etching an electrically conductive layer structure during manufacturing a component carrier is provided. The method includes subjecting the electrically conductive layer structure to an etching composition having an etchant and a photosensitive compound to thereby form a recess in the electrically conductive layer structure; while, at least for a part of time, irradiating and/or heating the recess. In addition, an apparatus for etching an electrically conductive layer structure during manufacturing a component carrier, an etched electrically conductive layer structure and a component carrier are provided.
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