公开(公告)号：US06879238B2

公开(公告)日：2005-04-12

申请号：US10447760

申请日：2003-05-28

Applicant: Chun-Tiao Liu ,  Yi-Min Huang

Inventor： Chun-Tiao Liu ,  Yi-Min Huang

IPC: H01F27/02 ,  H01F27/29 ,  H01F27/28

CPC classification number: H01F27/027 ,  H01F27/292 ,  H01F2017/046 ,  H01F2017/048

Abstract: This invention discloses a method for manufacturing an inductor by first press punching a first and a second layer of conductive plates into a first and second coil layers with a first and second inductor lead layers as single integrated layers. The manufacturing process further includes a step of overlapping and connecting the first and second coil layers to form an inductor. In a preferred embodiment, process of manufacturing further includes a step of mixing epoxy to bond with a highly magnetic material and pressure molding the bonding magnetic material around the coil layers to form an inductor.

Abstract translation: 本发明公开了一种用于制造电感器的方法，该方法首先将第一和第二导电板层压成第一和第二线圈层，第一和第二电感器引线层作为单个集成层。 制造工艺还包括重叠和连接第一和第二线圈层以形成电感器的步骤。 在优选实施例中，制造方法还包括将环氧树脂与高磁性材料混合并在线圈层周围加压成型接合磁性材料以形成电感器的步骤。

公开(公告)号：US20050006721A1

公开(公告)日：2005-01-13

申请号：US10886965

申请日：2004-07-07

Applicant: Yu Lin ,  Ching-Chao Wang ,  Hung-Shen Chu

Inventor： Yu Lin ,  Ching-Chao Wang ,  Hung-Shen Chu

IPC: H05K1/03 ,  H05K3/38 ,  H01L29/00

CPC classification number: H05K3/38 ,  H05K1/0306 ,  H05K3/388

Abstract: A structural configuration and manufacture method is applied to manufacture electronic circuits on a ceramic substrate including capacitor and inductors for filters. The electronic circuits have strong bonding to securely adhere to the SOG-coated substrate when the SOG is cured at an elevated temperature supplemented with high nitrogen flow during the curing process. The SOG coated ceramic substrate shows excellent layer compatibilities during temperature variations because reduced differences of thermal coefficients between different layers.

Abstract translation: 应用结构构造和制造方法来制造包括用于滤波器的电容器和电感器的陶瓷基板上的电子电路。 当SOG在固化过程中在补充有高氮气流的升高的温度下固化时，电子电路具有牢固粘附以牢固地粘附到SOG涂覆的基底上。 SOG涂覆的陶瓷基板在温度变化期间显示出优异的层相容性，因为不同层之间的热系数的差异减小。

公开(公告)号：US20020180000A1

公开(公告)日：2002-12-05

申请号：US09867644

申请日：2001-05-29

Applicant: CYNTEC COMPANY

Inventor： Horng-Yih Juang ,  Ying-Chang Wu ,  Yi-Min Huang ,  Cheng-Er Fan

IPC: H01L021/20 ,  H01L029/00

CPC classification number: H01L27/0802 ,  H01C1/148 ,  H01C17/003 ,  H01C17/288

Abstract: The present invention discloses a resistor supported on a metal plate composed of a low temperature coefficient of resistance (TCR) metallic material. The resistor includes at least two electrode columns composed of the low TCR metallic material disposed on the metal plate. The resistor further includes at least an electrode layer disposed on each of the electrode columns to form an electrode for each of the electrode columns. In a preferred embodiment, the low TCR metallic material composed of the metal plate further comprises a nickel-copper alloy. In another preferred embodiment, the electrode layer disposed on each of the electrode columns further comprises a copper layer and a tin-lead alloy layer on each of the electrode columns. In another preferred embodiment, the electrode columns disposed on the metal plate having a precisely defined position for providing precisely defined resistance for the resistor ranging between one milli-ohm to one ohm.

Abstract translation: 本发明公开了一种负载在由低温电阻（TCR）金属材料构成的金属板上的电阻器。 电阻器包括由设置在金属板上的低TCR金属材料构成的至少两个电极柱。 电阻器还包括设置在每个电极柱上的至少一个电极层，以形成每个电极柱的电极。 在优选实施例中，由金属板构成的低TCR金属材料还包括镍 - 铜合金。 在另一个优选实施例中，设置在每个电极柱上的电极层还包括在每个电极柱上的铜层和锡 - 铅合金层。 在另一个优选实施例中，设置在金属板上的电极柱具有精确限定的位置，用于为电阻器提供精确限定的电阻，范围在1毫欧至1欧姆之间。

公开(公告)号：US5958606A

公开(公告)日：1999-09-28

申请号：US795518

申请日：1997-02-05

Applicant: Chung-Hsiung Wang ,  Duen-Jen Cheng

Inventor： Chung-Hsiung Wang ,  Duen-Jen Cheng

IPC: B32B17/06 ,  G01K7/18 ,  H01C1/012 ,  B32B15/01

CPC classification number: H01C1/012 ,  B32B17/06 ,  G01K7/183 ,  Y10T428/12847 ,  Y10T428/12875 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/24777 ,  Y10T428/24917 ,  Y10T428/31518 ,  Y10T428/31529

Abstract: The present invention discloses a substrate structure for supporting a thin film with specific temperature coefficient of resistance (TCR) thereon. The substrate structure includes a substrate composed of a borosilicate glass. The substrate further includes an interface layer of LaSiONx covering a top surface of the substrate. The substrate supports the thin film includes a platinum thin film thereon. The substrate structure further includes an adhesion anchoring seam disposed as a bonding seam interfacing the thin film to the substrate for securely attaching the thin film to the substrate therein. The bonding seam is disposed on a boundary edge of the thin film and includes a nickel-chromium alloy anchor seam disposed on the boding seam. In a preferred embodiment, the substrate structure includes a protective layer covering and protecting the substrate structure thereunder. In another preferred embodiment, the substrate structure further includes electrodes for electrically connecting to the thin film with the specific TCR for providing an electrical voltage thereto.

Abstract translation: 本发明公开了一种用于支撑其上具有特定温度系数（TCR）的薄膜的衬底结构。 基板结构包括由硼硅酸盐玻璃构成的基板。 衬底还包括覆盖衬底的顶表面的LaSiONx的界面层。 基板支撑薄膜在其上包括铂薄膜。 衬底结构还包括粘合锚定缝，其设置为将薄膜与基底相接合的粘合缝，用于将薄膜牢固地附接到衬底中。 粘合缝设置在薄膜的边界边缘上，并且包括设置在焊缝上的镍铬合金锚缝。 在优选实施例中，衬底结构包括覆盖并保护其下的衬底结构的保护层。 在另一个优选实施例中，衬底结构还包括用于与特定TCR电连接到薄膜的电极，用于向其提供电压。