Resin composition, molded body, optical layer, cover member and moving body

    公开(公告)号:US11634579B2

    公开(公告)日:2023-04-25

    申请号:US17598980

    申请日:2020-03-24

    摘要: A resin composition of the present invention is used in an optical layer 10 provided with a first layer (base material layer 1) including a polycarbonate-based resin and a visible light absorber for forming the first layer. The visible light absorber includes a plurality of kinds of light absorbers, and a melting point of a first light absorber having the lowest melting point is equal to or higher than 200° C., in which a melting point of a second light absorber having the highest melting point is equal to or lower than 330° C. The resin composition is such that the viscosity at 260° C. obtainable when a shear rate is 243.2 [1/sec] is equal to or more than 400 Pa·s and equal to or less than 3500 Pa·s.

    OPTICAL SHEET AND OPTICAL COMPONENT

    公开(公告)号:US20230011467A1

    公开(公告)日:2023-01-12

    申请号:US17772713

    申请日:2020-10-26

    摘要: An optical sheet 10 of the present invention includes a laminate including a polarizing layer 4 containing at least one kind of a light absorbing agent and having a polarizing function, and a protective layer 1 laminated on the polarizing layer 4, in which in the polarizing layer 4, a value of a* is 0 or more and 30 or less and a value of b* is 0 or more and 30 or less in an L*a*b* color system defined by JIS Z 8781-4, and in the optical sheet 10, a size of a Q Blue value defined by Australian Standard Australia/New Zealand Standard 1067-2016 is 0.70 or more. Thus, even when the optical sheet is toned to brown, blue light can be distinguished with excellent distinguishability.

    RESIN COMPOSITION AND MOLDED ARTICLE

    公开(公告)号:US20220380521A1

    公开(公告)日:2022-12-01

    申请号:US17765887

    申请日:2020-10-01

    摘要: Provided are a resin composition, which is used for transfer molding, including a resin (A), a magnetic powder (B) having a median diameter of 7.5 to 100 μm, and particles (C) having a median diameter of 0.2 to 5 μm, in which a saturation magnetic flux density of a molded article obtained by transfer molding the resin composition at 175° C. is equal to or more than 1.1 T; and a molded article formed of the resin composition. The particles (C) may include a magnetic powder or a non-magnetic powder.

    RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME

    公开(公告)号:US20220213248A1

    公开(公告)日:2022-07-07

    申请号:US17603628

    申请日:2020-04-10

    发明人: Hajime Mifuka

    摘要: According to the present invention, A resin material including a phenolic resin and a dicyandiamide polymer finely dispersed in the phenolic resin; and a method for producing a resin material including a phenolic resin and a dicyandiamide polymer dispersed in the phenolic resin, the method including a step of preparing a resin composition including the phenolic resin and dicyandiamide and a step of heating the resin composition to polymerize the dicyandiamide and form the dicyandiamide polymer are provided.

    MULTILAYER FILM AND PACKAGE
    16.
    发明申请

    公开(公告)号:US20220118746A1

    公开(公告)日:2022-04-21

    申请号:US17563516

    申请日:2021-12-28

    发明人: Hideki KAI

    IPC分类号: B32B27/08 B32B27/32 B65D75/36

    摘要: A multilayer film, including: a barrier layer in which an unstretched first film layer containing a first resin, and an unstretched second film layer containing a second resin different from the first resin are alternately and repeatedly laminated; a pair of unstretched first outer layers sandwiching the barrier layer; and a pair of unstretched second outer layers sandwiching the pair of unstretched first outer layers, wherein the average thickness per layer of the first film layers is 10 to 1,000 nm, and the lamination number of the first film layers in the barrier layer is in the range of 50 to 5,000.

    Method for preparing sugar chain
    17.
    发明授权

    公开(公告)号:US11293926B2

    公开(公告)日:2022-04-05

    申请号:US16084454

    申请日:2018-02-28

    发明人: Masaaki Toyoda

    IPC分类号: G01N33/58 C12Q1/34 C12P19/04

    摘要: Provided is a method for preparing a sugar chain, including: a labeling step of adding a labeling reagent to a sugar chain-containing sample which contains a sugar chain to obtain a labeled product containing a labeled substance of the sugar chain, in which a reaction environment of the labeling reagent and the sugar chain contains water in the labeling step.

    RESIN COMPOSITION FOR SEALING, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

    公开(公告)号:US20220073727A1

    公开(公告)日:2022-03-10

    申请号:US17417852

    申请日:2019-12-23

    发明人: Shinya KAWAMURA

    摘要: According to the present invention, there is provided a resin composition for sealing containing (A) an epoxy resin; (B) a curing agent; and (C) a filler, wherein the epoxy resin (A) includes an epoxy resin (A-1) having a naphthyl ether skeleton, and wherein the resin composition for sealing satisfies the following Formula (1): Formula (1) E2×(α2×10−6)×(175−Tg)×η2≤0.3
    wherein, in Formula (1), Tg (° C.) is a glass transition temperature of a cured product of the resin composition for sealing, α2 (ppm/° C.) is a coefficient of linear expansion over a range from 190° C. to 230° C. of the cured product, and E2 (MPa) is a hot elastic modulus at 260° C. of the cured product, and η2 (MPa) is a rectangular pressure at 175° C. of the resin composition for sealing as measured by the following method; (method) the resin composition for sealing is injected, using a low-pressure transfer molding machine, into a rectangular-shaped flow channel having a width of 15 mm, a thickness of 1 mm, and a length of 175 mm under conditions of a mold temperature of 170° C. and an injection flow rate of 177 mm3/sec, a change in pressure over time is measured with a pressure sensor embedded at a position 25 mm away from an upstream tip of the flow channel, a lowest pressure (MPa) during a flow of the resin composition for sealing is measured, and the lowest pressure is regarded as the rectangular pressure.