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    Backplateless silicon microphone
    11.
    发明申请
    Backplateless silicon microphone 有权
    无背板硅麦克风

    公开(公告)号：US20080123878A1

    公开(公告)日：2008-05-29

    申请号：US12011519

    申请日：2008-01-28

    Applicant: Wang Zhe ,  Miao Yubo

    Inventor： Wang Zhe ,  Miao Yubo

    IPC: H04R17/02

    CPC classification number: H04R31/003 ,  H04R19/005 ,  H04R19/04 ,  H04R25/00

    Abstract: A silicon based microphone sensing element and a method for making the same are disclosed. The microphone sensing element has a diaphragm with adjoining perforated plates on the front side of a conductive substrate. The diaphragm is aligned above a back hole in the substrate wherein the front opening of the back hole is smaller than the diaphragm. The diaphragm is supported by mechanical springs each having one end attached to the diaphragm and another end connected to a rigid pad anchored on a dielectric spacer. The diaphragm, perforated plates, and mechanical springs are preferably made of the same film and are suspended above an air gap that overlies the substrate. A first electrode is formed on one or more rigid pads and a second electrode is formed at one or more locations on the substrate to establish a variable capacitor circuit. Different embodiments are shown that reduce parasitic capacitance.

    Abstract translation: 公开了一种基于硅的麦克风传感元件及其制造方法。 麦克风感测元件具有在导电基板的正面上具有相邻多孔板的隔膜。 隔膜在衬底中的后孔上方对准，其中后孔的前开口小于隔膜。 隔膜由机械弹簧支撑，每个机械弹簧的一端连接到隔膜，另一端连接到锚定在介电隔离件上的刚性垫。 隔膜，多孔板和机械弹簧优选由相同的膜制成并且悬挂在覆盖在基底上的气隙之上。 第一电极形成在一个或多个刚性焊盘上，并且第二电极形成在衬底上的一个或多个位置处以建立可变电容器电路。 示出了减少寄生电容的不同实施例。

    MEMS microphone with a stacked PCB package and method of producing the same
    12.
    发明申请
    MEMS microphone with a stacked PCB package and method of producing the same 有权
    具有堆叠PCB封装的MEMS麦克风及其制造方法

    公开(公告)号：US20070205492A1

    公开(公告)日：2007-09-06

    申请号：US11368172

    申请日：2006-03-03

    Applicant: Zhe Wang

    Inventor： Zhe Wang

    IPC: H01L23/552

    CPC classification number: B81C1/0023 ,  B81B2201/0257 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A MEMS microphone with a stacked PCB package is described. The MEMS package has at least one MEMS acoustic sensor device located on a PCB stack. A metal cap structure surrounds the at least one MEMS acoustic sensor device wherein an edge surface of the metal cap structure is attached and electrically connected to the PCB stack. In a first embodiment, a back chamber is formed underlying the at least one MEMS acoustic sensor device and within the PCB stack wherein an opening underlying the at least one MEMS acoustic sensor device accesses the back chamber. An opening in the metal cap structure not aligned with the at least one MEMS acoustic sensor device allows external fluid, acoustic energy or pressure to enter the at least one MEMS acoustic sensor device. In a second embodiment, a back chamber is formed in the space under the metal cap and over the first PCB. A hollow chamber is formed between the first PCB and the second PCB wherein an opening under the at least one MEMS acoustic sensor device accesses the hollow chamber. An opening in a bottom surface of the PCB stack not aligned with the at least one MEMS acoustic sensor device also accesses the hollow chamber and allows external fluid, acoustic energy or pressure to enter the at least one MEMS acoustic sensor device.

    Abstract translation: 描述了具有堆叠PCB封装的MEMS麦克风。 MEMS封装具有位于PCB堆叠上的至少一个MEMS声学传感器装置。 金属盖结构围绕至少一个MEMS声学传感器装置，其中金属盖结构的边缘表面被附接并电连接到PCB堆叠。 在第一实施例中，后室形成在至少一个MEMS声学传感器装置的下方，并且在PCB堆叠内，其中至少一个MEMS声学传感器装置下方的开口进入后室。 不与至少一个MEMS声学传感器装置对准的金属盖结构中的开口允许外部流体，声能或压力进入至少一个MEMS声学传感器装置。 在第二实施例中，在金属盖下方的空间和第一PCB上形成后室。 在第一PCB和第二PCB之间形成中空室，其中至少一个MEMS声学传感器装置下方的开口进入中空室。 PCB堆叠底部未与至少一个MEMS声学传感器装置对准的底表面中的开口还访问中空室并允许外部流体，声能或压力进入至少一个MEMS声学传感器装置。

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