LIGHT EMITTING DIODE DEVICE, DISPLAY PANEL, DISPLAY DEVICE, AND MANUFACTURING METHOD

    公开(公告)号:US20230354630A1

    公开(公告)日:2023-11-02

    申请号:US17296839

    申请日:2020-08-20

    Abstract: Embodiments of the present disclosure provide a light emitting diode device, a display panel, a display device, and a manufacturing method. The light emitting diode device includes: a base substrate; a first electrode disposed on one side of the base substrate; a carrier functional layer disposed on one side, facing away from the base substrate, of the first electrode; a quantum dot light emitting layer disposed on one side, facing away from the first electrode, of the carrier functional layer, having a molecular chain structure inside, where the molecular chain structure is formed by atom transfer radical polymerization of a first reactant and a modified molecule, the first reactant undergoes atom transfer radical polymerization with the modified molecule through a ligand molecule A, and in an initial state, the modified molecule is connected to one surface, facing the quantum dot light emitting layer, of the carrier functional layer; and a second electrode disposed on one side, facing away from the carrier functional layer, of the quantum dot light emitting layer.

    Display device
    19.
    发明授权

    公开(公告)号:US11805672B2

    公开(公告)日:2023-10-31

    申请号:US17856933

    申请日:2022-07-01

    CPC classification number: H10K50/844 H10K50/87 H10K77/111 H10K85/141

    Abstract: Provided is a display device that can retard the degradation of light-emitting elements even when the display device is used in a high temperature environment. A display device includes a TFT layer, a light-emitting element layer provided with a plurality of light-emitting elements, a heat dissipating layer, an extraction member, and a thermal insulation layer that insulates the light-emitting elements from external heat. The thermal insulation layer is made from a material containing a first resin in which a metal complex compound having an ammonium salt as a ligand is dispersed. The TFT layer is formed between the heat dissipating layer and the light-emitting element layer. The heat dissipating layer overlaps the light-emitting elements. The thermal insulation layer surrounds the heat dissipating layer. The extraction member is formed to overlap the thermal insulation layer. The heat dissipating layer and the thermal insulation layer are in direct contact with the TFT layer.

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