Abstract:
Disclosed herein are a silicon wafer for probe bonding and a probe bonding method using the same. The silicon wafer for probe bonding is improved in structure to facilitate probe bonding on a probe substrate. The probe bonding method involves bonding supporting beams on the silicon wafer to bumps on the probe substrate. The silicon wafer is formed at a surface thereof with probe tips and supporting beams on an end of each probe tip to have a redetermined arrangement pattern. The silicon wafer is further formed with openings from an upper surface to a lower surface thereof. A portion of each supporting beam opposite to the probe tips protrudes is exposed to the outside through the openings.
Abstract:
The present invention relates to a liquid crystal display having excellent brightness without moiré patterns. The present invention also relates to a prism sheet and backlight unit which may improve the brightness of the liquid crystal display while removing the moiré patterns. A prism sheet comprises a protective layer including a base material consisting of a light-transmissive resin; and a plurality of diffusion particles distributed in the protective layer to scatter the light input into the base material; a base film disposed on a surface of the protective layer, wherein the light emitted from the protective layer is input into the base film; and a plurality of linear prisms having a pitch of between about 32 μm and about 38 μm and disposed in parallel on a surface of the base film.
Abstract:
A NAND-type nonvolatile memory device includes a first string and a second string. The ends of each of the first and second strings are connected to a common bit line and a common source line, respectively. Each of the first string and the second string have a string selection transistors, a plurality of unit devices and a source selection transistor. Word lines are respectively connected to control gates of the unit devices in the same rows. A first string selection line and a second string selection line are respectively connected to the gates of the string selection transistors of the first string and the second string. A first source selection line and a second source selection line are respectively connected to the gates of the first string and the second string.
Abstract:
A separator sheet for manufacturing an electric double layer capacitor, and a method for manufacturing the electric double layer capacitor using the same, are provided. According to an embodiment, the separator sheet for manufacturing the electric double layer capacitor comprises: a plurality of separators; and a resin film holding the plurality of separators, wherein the separators are disposed in the resin film at a predetermined interval.
Abstract:
A new SONOS memory device is provided, in which a conventional planar surface of multi-dielectric layers (ONO layers) is instead formed with a curved surface such as a cylindrical shape, and included is a method for fabricating the same. A radius of curvature of the upper surface of a blocking oxide can be designed to be larger than that of the lower surface of a tunneling oxide, which restrains electrons from passing through the blocking oxide by back-tunneling on erasing. As a result, a SONOS memory device shows an improvement in erasing speed.
Abstract:
Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of making the same. The probe having a prescribed thickness and formed in the shape of a flat plate. The probe comprises a body part bent at the middle thereof so that the body part is elastically tensioned or compressed when a tension force or a compression force is applied to the body part at the upper and lower ends thereof, a connection part integrally formed with the lower end of the body part, the connection part being fixed to a substrate, and a tip part integrally formed with the upper end of the body part, the tip part contacting a pad of an element.
Abstract:
Disclosed herein are a probe positioning and bonding device and a probe bonding method, and more particularly a probe positioning and bonding device used to fix probes to prescribed positions on a substrate so that a probe card used for semiconductor integrated circuit testing equipment is manufactured, and a probe bonding method using the same. The probe positioning and bonding device comprises a stage unit disposed on a working table, a microscope disposed above the stage unit while being supported by means of a first supporting member disposed on the working table, a probe fixing unit disposed above the stage unit and below the microscope while being supported by means of a second supporting member disposed on the working table, and a light source unit supported by means of a third supporting member disposed on the working table. The light source unit is disposed toward the upper part of the stage unit.
Abstract:
The present invention discloses a method for forming a bit line of a semiconductor device which can easily perform a contact process of the semiconductor device, by forming parallel rows of I-shaped active regions, a plug poly and a ladder-type bit line. The spacing between adjacent active regions is maintained at the minimum line width. Two word lines of minimum line width and separated by the minimum line width are formed on the active region. The word lines are perpendicular to the active regions. A plug poly is formed on the active region between the word lines. A bit line contact plug is formed over the plug poly and a device isolation region. A bit line of minimum line width contacts the bit line contact plug and aligned generally parallel to the word lines is formed in a ladder-type configuration. That is, one side the lower portion of the contact plug contacts the plug poly, and the upper portion of the other side of the contact plug contacts the bit line. As a result, a storage electrode contact process may be performed using a self aligned method.
Abstract:
A catapult is disclosed. The catapult according to an embodiment of the present invention, comprises: a take-off assisting member contacting an aircraft to push the aircraft; a power source coupled to the take-off assisting member to drive the take-off assisting member; and a winch coupled to the take-off assisting member.
Abstract:
Provided is an orthokerato lens including a central portion located on a center of a lens and configured to change a refractive index by pressurizing a cornea, a fitting portion configured to form a negative pressure between the lens and the cornea to pile epithelial cells moved from the central portion, a fixing portion configured to be in contact with an eyeball and align the lens such that the center of the lens is located at a center of the cornea, a peripheral portion configured to allow tears between the lens and the eyeball to circulate, and a circulation hole configured to penetrate the central portion.