公开(公告)号：US10560771B2

公开(公告)日：2020-02-11

申请号：US16052261

申请日：2018-08-01

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Gerhard Metzger-Brueckl ,  Johann Strasser ,  Arnaud Walther ,  Andreas Wiesbauer

IPC: H04R1/06 ,  H04R1/08 ,  B81B3/00 ,  B81C1/00 ,  H04R23/00 ,  H04R31/00

Abstract: In accordance with an embodiment, microelectromechanical microphone includes a holder and a sound detection unit carried on the holder. The sound detection unit includes a planar first membrane, a planar second membrane arranged at a distance from the first membrane, a low-pressure chamber formed between the first membrane and the second membrane, a reduced gas pressure relative to normal pressure being present in the low-pressure chamber, a reference electrode arranged at least in sections in the low-pressure chamber, where the first and second membranes are displaceable relative to the reference electrode by sound waves to be detected, the reference electrode includes a planar base section and a stiffening structure provided on the base section, and the stiffening structure is provided on a side of the base section that faces the first membrane or/and on a side of the base section that faces the second membrane.

公开(公告)号：US10546752B2

公开(公告)日：2020-01-28

申请号：US16227761

申请日：2018-12-20

Applicant: Infineon Technologies AG

Inventor： Stephan Pindl ,  Daniel Lugauer ,  Dominic Maier ,  Alfons Dehe

IPC: H01L21/306 ,  H01L21/20 ,  H01L21/18 ,  H01L33/00 ,  H01L21/762 ,  H01L23/31 ,  H01L23/057 ,  H01L23/053 ,  G01N27/12 ,  H01L23/29 ,  H01L23/00 ,  H01L21/02 ,  H01L21/302 ,  G01N27/02 ,  G01N33/00 ,  H01L21/56 ,  H01L23/538 ,  H05K1/18

Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.

公开(公告)号：US10527589B2

公开(公告)日：2020-01-07

申请号：US15258646

申请日：2016-09-07

Applicant: Infineon Technologies AG

Inventor： Stefan Kolb ,  Alfons Dehe ,  Jochen Huber ,  Franz Jost ,  Horst Theuss ,  Juergen Woellenstein

IPC: G01N29/30 ,  G01N29/24

Abstract: An apparatus for in-situ calibration of a photoacoustic sensor is provided. The apparatus includes a light emitter to emit light along a transmission path to a gas and an acoustic sensor element configured to detect an acoustic signal emitted from the gas based on the received light. Furthermore, the apparatus includes a sensing unit configured to detect the light transmitted along the transmission path and to provide an output signal, and a calibration unit to receive the output signal from the sensing unit and to provide a calibration information based on the output signal received from the sensing unit.

公开(公告)号：US20190297441A1

公开(公告)日：2019-09-26

申请号：US16439016

申请日：2019-06-12

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen ,  Wolfgang Friza ,  Wolfgang Klein

IPC: H04R31/00 ,  H04R19/04 ,  H04R7/14 ,  B81B3/00 ,  H04R19/00

Abstract: In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is formed over the local oxide regions and the top surface of the substrate. A portion of the substrate under the membrane layer is removed. The local oxide regions under the membrane layer are removed.

公开(公告)号：US10405118B2

公开(公告)日：2019-09-03

申请号：US14611953

申请日：2015-02-02

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen ,  Wolfgang Friza ,  Wolfgang Klein

IPC: B81B3/00 ,  H04R7/14 ,  H04R19/04 ,  H04R31/00 ,  H04R19/00

Abstract: In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is formed over the local oxide regions and the top surface of the substrate. A portion of the substrate under the membrane layer is removed. The local oxide regions under the membrane layer is removed.

公开(公告)号：US10384934B2

公开(公告)日：2019-08-20

申请号：US15923599

申请日：2018-03-16

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stephan Pindl ,  Bernhard Knott ,  Carsten Ahrens

IPC: B81C1/00 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00

Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack over a first main surface of a substrate, forming a polymer layer over a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.

公开(公告)号：US10352910B2

公开(公告)日：2019-07-16

申请号：US15252332

申请日：2016-08-31

Applicant: Infineon Technologies AG

Inventor： Christoph Glacer ,  Alfons Dehe ,  David Tumpold

IPC: G01N33/00 ,  G01N29/24 ,  G01N29/14

Abstract: A gas analyzer is provided. The gas analyzer may include: a tubular housing having a housing wall extending along an axial direction of the tubular housing and surrounding a gas chamber configured to receive a gas to be analyzed therein, an excitation element positioned at a first axial end of the tubular housing and configured to selectively excite gas molecules of a specific type that is to be detected in the gas received in the gas chamber in a time-varying fashion, thereby generating acoustic waves, and a sensor positioned at a second axial end of the tubular housing and configured to detect acoustic waves generated by the excitation element.

公开(公告)号：US10302599B2

公开(公告)日：2019-05-28

申请号：US15335511

申请日：2016-10-27

Applicant: Infineon Technologies AG

Inventor： David Tumpold ,  Alfons Dehe ,  Christoph Glacer

IPC: G01N29/24 ,  G01N29/22 ,  G01N29/36

Abstract: A photoacoustic gas detector may include: a gas chamber configured to receive a gas to be analyzed therein, an excitation element configured to selectively excite gas molecules of a specific type that is to be detected in the gas received in the gas chamber in a time-varying fashion, thereby generating pressure differences, a sensor configured to detect pressure differences generated by the excitation element, and a pump configured to pump gas between the exterior of the photoacoustic gas detector and the gas chamber.

公开(公告)号：US10263542B2

公开(公告)日：2019-04-16

申请号：US15842148

申请日：2017-12-14

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe

IPC: H01L21/00 ,  H02N99/00 ,  H04R7/10 ,  H04R31/00 ,  G01N21/956 ,  H01J37/26 ,  H02N1/08 ,  H04R19/04

Abstract: A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a first material layer comprising a first stress, a second material layer arranged beneath the first material layer, the second material layer comprising a second stress, an opening arranged in the first material layer and the second material layer, and an extension extending into opening, wherein the extension comprises a portion of the first material layer and a portion of the second material layer, and wherein the extension is curved away from a top surface of the plate based on a difference in the first stress and the second stress.

公开(公告)号：US20180317021A1

公开(公告)日：2018-11-01

申请号：US15581744

申请日：2017-04-28

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Ulrich Krumbein

IPC: H04R19/04 ,  H04R7/04 ,  H04R19/00 ,  B81B3/00

CPC classification number: H04R19/04 ,  B81B3/0089 ,  B81B7/0061 ,  B81B2201/0257 ,  H04R7/04 ,  H04R19/005 ,  H04R2201/003

Abstract: A sound transducer includes a housing with a sound port and a MEMS structure disposed in an interior space of the housing. The MEMS structure and the sound port are acoustically coupled to each other. The MEMS structure separates a front volume from a back volume of the housing. At least one vent hole of the MEMS structure allows a gas exchange between the front volume and the back volume. The sound port allows a liquid to enter the front volume. Further, the MEMS structure prevents liquid from entering the back volume.