Electronic apparatus with touch panel and method for updating touch panel

    公开(公告)号:US10146369B2

    公开(公告)日:2018-12-04

    申请号:US15712148

    申请日:2017-09-22

    Abstract: An electronic apparatus with a touch panel including a host controller, an interface unit, and a touch panel control unit is provided. The host controller is used to control an electronic apparatus implemented with the host controller. The touch panel control unit is coupled to the host controller through the interface unit. The host controller transmits an updating information to the touch panel control unit with a format of the interface unit, in which the updating data is used to update the touch panel control unit. The touch panel control unit decodes the updating data to accordingly update.

    IMAGE PROCESSING METHOD AND IMAGE PROCESSING APPARATUS

    公开(公告)号:US20180330523A1

    公开(公告)日:2018-11-15

    申请号:US15591121

    申请日:2017-05-10

    CPC classification number: G06T11/001 G09G5/02

    Abstract: An image processing apparatus including an image processing circuit is provided. The image processing circuit is configured to perform a subpixel conversion operation on an input image of a first format to convert the input image of the first format to the input image of a second format; obtain a first detection result with respect to a target pixel of the input image of the first format; determine a filter parameter with respect to the target pixel according to the first detection result; and perform a subpixel rendering operation on the input image of the second format according to the determined filter parameter to obtain an output image.

    Silicon controlled rectifier
    234.
    发明授权

    公开(公告)号:US10121777B2

    公开(公告)日:2018-11-06

    申请号:US15275492

    申请日:2016-09-26

    Abstract: A silicon controlled rectifier including a semiconductor substrate, first and second semiconductor wells, first and second semiconductor regions, third and fourth semiconductor regions and a silicide layer is provided. The first and the second semiconductor wells are formed in the semiconductor substrate. The first and the second semiconductor regions are respectively formed in the first and the second semiconductor wells in spaced apart relation. The third and the fourth semiconductor regions are respectively formed in the first and the second semiconductor wells. The silicide layer is formed on the third and the fourth semiconductor regions. The silicon controlled rectifier is at least suitable for high frequency circuit application. The silicon controlled rectifier has a relatively low trigger voltage, a relatively high electrostatic discharge level, and a relatively low capacitance.

    Video processing apparatus and video processing circuits thereof

    公开(公告)号:US10110928B2

    公开(公告)日:2018-10-23

    申请号:US14583066

    申请日:2014-12-24

    Abstract: A video processing apparatus and a video processing circuit of the video processing apparatus are provided. The video processing circuit includes a video processor, a first memory controller, a second memory controller and a distributor. The video processor includes at least one sub-processing-tasks processor which is configured to execute one or more sub-processing tasks respectively. The first memory controller controls a first memory. The second memory controller controls a second memory. The distributor stores the data outputted by the video processor to the first memory and the second memory through the first memory controller and the second memory controller respectively.

    DUTY CYCLE CALIBRATION CIRCUIT AND FREQUENCY SYNTHESIZER USING THE SAME

    公开(公告)号:US20180302073A1

    公开(公告)日:2018-10-18

    申请号:US15488545

    申请日:2017-04-17

    Abstract: A duty cycle calibration circuit and a frequency synthesizer using the same are provided. The duty cycle calibration circuit includes a single-ended correction circuit and a single-ended detection circuit. The single-ended correction circuit is configured to adjust a duty cycle of an input clock signal. The single-ended correction circuit includes a first slew rate controller, a second slew rate controller, and at least one logic gate. The first slew rate controller adjusts a rising slew rate of an output clock signal in response to a control signal. The second slew rate controller adjusts a falling slew rate of the output clock signal in response to the control signal. The single-ended detection circuit is configured to detect a duty cycle of the output clock signal by converting the duty cycle of the output clock signal to an average voltage to be served as the control signal.

    DISPLAY DRIVING CIRCUIT
    237.
    发明申请

    公开(公告)号:US20180293926A1

    公开(公告)日:2018-10-11

    申请号:US16010242

    申请日:2018-06-15

    Abstract: A display driving circuit comprising a video signal transformation circuit, a reference voltage generating circuit, a DAC and an interpolation operational amplifier is provided. The video signal transformation circuit transforms an input video signal into a transformed video signal with a higher bit depth. The transformed video signal comprises an upper n bits data and a lower m bits data, wherein n+m equals a bit depth of the transformed video signal. The reference voltage generating circuit generates reference voltages. The DAC selects a first reference voltage and a second reference voltage to interpolation operational amplifier from the reference voltages according to an upper n bits data of the transformed video signal. The interpolation operational amplifier outputs a driving voltage to display device according to the first reference voltage, the second reference voltage and the lower m bits data of the transformed video signal.

    CHIP ON FILM PACKAGE
    239.
    发明申请

    公开(公告)号:US20180261523A1

    公开(公告)日:2018-09-13

    申请号:US15613275

    申请日:2017-06-05

    Abstract: A chip on film package includes a base film, a patterned circuit layer, a solder resist layer, a chip and a graphite sheet. The base film includes a first surface and a mounting region located on the first surface. The patterned circuit layer is disposed on the first surface. The solder resist layer partially covers the patterned circuit layer. The chip is disposed on the mounting region and electrically connected to the patterned circuit layer. The graphite sheet covers at least a part of the solder resist layer, wherein an outer edge of the graphite sheet is substantially aligned with an outer edge of the solder resist layer.

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