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    THERMAL DISSIPATION
    241.
    发明公开
    THERMAL DISSIPATION 审中-公开

    公开(公告)号：US20230171927A1

    公开(公告)日：2023-06-01

    申请号：US17989173

    申请日：2022-11-17

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Richard REMBERT ,  Fanny LAPORTE ,  Catherine CADIEUX

    IPC: H05K7/20

    CPC classification number: H05K7/2039

    Abstract: A heat dissipation device includes a substrate with a network of thermally-conductive vias and thermally-conductive layers. The substrate has a first surface and a second surface opposite to the first surface. A heat dissipation interface layer including a stack of a first layer made of a first thermally-conductive material and a second layer made of a second thermally-conductive material. The first material is different from the second material. A surface of the first layer is coplanar with the first surface of the substrate. At least one of the thermally-conductive vias of said network supports and is in contact with the first layer. At least one opening thoroughly crosses the stack of the first and second layers. Material of the substrate fills the opening in the first layer.

    ELECTRONIC DEVICE
    244.
    发明申请
    ELECTRONIC DEVICE 有权

    公开(公告)号：US20230114469A1

    公开(公告)日：2023-04-13

    申请号：US17961911

    申请日：2022-10-07

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Patrick LAURENT ,  Jean-Michel RIVIERE

    IPC: H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11

    Abstract: A device includes comprising first and second printed circuit boards. Walls couple the first and second printed circuit boards to each other and define a first cavity between the first and second printed circuit boards. Electric conductors associated with the walls electrically connect the the first and second printed circuit boards. An integrated circuit chip is mounted to a first surface of the first integrated circuit board in the first cavity. The integrated circuit chip is electrically connected to conductive tracks of the first surface of the first printed circuit board. Surface-mounted components are mounted on top of and in contact with conductive tracks of a first surface of the second printed circuit board. The first surfaces of the first and second printed circuit boards are arranged facing towards each other. The first and second printed circuit boards may form rigid components of a flex-rigid type printed circuit board.

    Integrated circuit and method for diagnosing an integrated circuit
    245.
    发明授权
    Integrated circuit and method for diagnosing an integrated circuit 有权

    公开(公告)号：US11624779B2

    公开(公告)日：2023-04-11

    申请号：US17375450

    申请日：2021-07-14

    Applicant: STMicroelectronics (Alps) SAS ,  STMicroelectronics (Grenoble 2) SAS

    Inventor： Etienne Auvray ,  Tommaso Melis ,  Philippe Sirito-Olivier

    IPC: G01R31/311 ,  G01R31/28 ,  G01R19/00 ,  G01R15/22

    Abstract: According to one aspect, an integrated circuit includes: an electronic module configured to generate a voltage at an output, and an electronic control circuit coupled to an output of the electronic module, the electronic control circuit comprising an emissive electronic component. The electronic control circuit is configured to cause the emissive electronic component to emit light radiation as a function of a value of the voltage at the output of the electronic module relative to a value of an operating voltage of the electronic module, and the operating voltage is specific thereto during normal operation of this electronic module. The light radiation emitted by the emissive electronic component is configured to diffuse to an outer face of the integrated circuit.

    DC/DC voltage converter and method
    246.
    发明授权
    DC/DC voltage converter and method 有权

    公开(公告)号：US11616440B2

    公开(公告)日：2023-03-28

    申请号：US17089102

    申请日：2020-11-04

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Helene Esch ,  Mathilde Sie

    IPC: H02M3/158 ,  H02M1/088

    Abstract: In an embodiment, a voltage converter includes: a first transistor coupled between an internal node and a first node receiving a supply voltage; a second transistor coupled between the internal node and a second node receiving a reference voltage; an inductance coupled between the internal node and an output node; a first circuit controlling the first and second transistors; and a second circuit configured to detect, when the first and second transistors are in the off state, when the voltage of the internal node is equal to the voltage of the output node, to condition a switching to the on state of the first transistor.

    Direct memory access
    249.
    发明授权
    Direct memory access 有权

    公开(公告)号：US11593289B2

    公开(公告)日：2023-02-28

    申请号：US16516988

    申请日：2019-07-19

    Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Rousset) SAS

    Inventor： François Cloute ,  Sandrine Lendre

    IPC: G06F13/28

    Abstract: A memory contains a linked list of records representative of a plurality of data transfers via a direct memory access control circuit. Each record is representative of parameters of an associated data transfer of the plurality of data transfers. The parameters of each record include a transfer start condition of the associated data transfer and a transfer end event of the associated data transfer.

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