公开(公告)号：US20190321628A1

公开(公告)日：2019-10-24

申请号：US16452785

申请日：2019-06-26

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/08 ,  H05K1/18 ,  H01G4/35 ,  H05K9/00 ,  H03H1/00 ,  H01R13/7195 ,  H03H7/01 ,  H05K5/00 ,  H01G4/06 ,  A61N1/375 ,  A61N1/37 ,  H01G4/40

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active metallization that is electrically connected to the active electrode plates and a ground metallization that is electrically connected to the ground electrode plates of the capacitor. A ground electrical path extends from the ground metallization of the chip capacitor to the ferrule. A conductive ground pin is electrically and mechanically connected to the ferrule. The ground path comprises an internal ground plate disposed within the circuit board substrate. The internal ground plate is electrically connected to the ground metallization of the chip capacitor and to either the ferrule or the ground pin connected to the ferrule. An active electrical path extends between the active metallization of the chip capacitor and the lead wire.

公开(公告)号：US20190255319A1

公开(公告)日：2019-08-22

申请号：US16391801

申请日：2019-04-23

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Keith W. Seitz ,  Marc Gregory Martino

IPC: A61N1/08 ,  A61N1/375 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35

Abstract: A filtered feedthrough assembly for an active implantable medical device (AIMD) includes an insulator hermetically sealed to an opening of an electrically conductive ferrule. A ceramic reinforced metal composite of platinum and alumina (CRMC) material is disposed in an insulator via hole surrounding a substantially pure platinum fill. A capacitor disposed on the insulator device side has a capacitor dielectric with a dielectric constant k that is greater than 0 and less than 1000. Coming from the body fluid side to the device side of the AIMD, the capacitor is the first filter capacitor electrically connected to the substantially pure platinum fill. An active electrical connection electrically connects the substantially pure platinum fill to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and subsequently to the housing of the AIMD

公开(公告)号：US10350421B2

公开(公告)日：2019-07-16

申请号：US15943998

申请日：2018-04-03

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods

IPC: A61N1/00 ,  A61N1/375 ,  A61N1/378 ,  H01R13/52 ,  H01R4/58 ,  H01R13/26 ,  H03H1/00

Abstract: A feedthrough subassembly for an active implantable medical device includes a metallic ferrule having a conductive ferrule body, at least one surface disposed on a device side, and a ferrule opening passing through the at least one surface. An insulator body hermetically seals the ferrule opening of the conductive ferrule body by at least one of a first gold braze ceramic seal, a glass seal or a glass-ceramic seal. At least one hermetically sealed conductive pathway is disposed through the insulator body. At least one pocket formed in the at least one surface has a gold pocket pad disposed within. When the first gold braze ceramic seal is present, the first gold braze ceramic seal and the gold pocket pad are not physically touching one another.

公开(公告)号：US10312722B2

公开(公告)日：2019-06-04

申请号：US16194458

申请日：2018-11-19

Applicant: Greatbatch Ltd.

Inventor： Gregory G. Decker ,  Brian R. Peterson ,  Eric Jankins ,  William A. Planck ,  Leslie I. Halberg ,  Jason Hamilton

IPC: H01M10/46 ,  H02J7/02 ,  H02J50/12 ,  A61L2/26 ,  H02J50/00 ,  A61L2/07 ,  H02J50/50

Abstract: In various examples, a system includes a power generating device configured to generate and transfer power to an electrical device. A sterilizable vessel is configured to accommodate the electrical device. The vessel is configured to allow power to be at least partially wirelessly transferred from the power generating device, through the vessel, and to the electrical device. In other examples, a method includes wirelessly powering and/or charging an electrical device disposed within a sterilizable vessel.

公开(公告)号：US10292718B2

公开(公告)日：2019-05-21

申请号：US15201835

申请日：2016-07-05

Applicant: Greatbatch Ltd.

Inventor： Matthew L. Mroczkowski ,  Lasantha Viyannalage ,  Steven W Winn

IPC: A61B17/16 ,  A61B18/00

Abstract: An orthopedic reamer cutting tool is disclosed that incorporates a second material such as graphene having an increased coefficient of thermal conductivity to remove heat generated at the tissue cutting surface during use. The reamer is constructed having a hemispherical cutting shell that extends from an equatorial base to an apex at a distal end. A plurality of cutting teeth, each having a tissue cutting surface, extend from the exterior of the cutting shell. A reamer driver interface may be positioned spanning the diameter of the reamer base. The second material, having increased thermal conductivity, may be applied to the interior and/or exterior shell surfaces. In addition, the second material may be incorporated within the shell or the driver interface.

公开(公告)号：US20190070691A1

公开(公告)日：2019-03-07

申请号：US16181499

申请日：2018-11-06

Applicant: Greatbatch Ltd.

Inventor： Xiangyang Dai ,  Robert D. Miller

IPC: B23K11/30 ,  B23K11/20 ,  B23K11/00 ,  B23K101/32 ,  B23K103/04 ,  B23K103/10 ,  B23K103/18 ,  B23K103/14 ,  B23K103/08 ,  B23K101/36

Abstract: An electrode used for resistance welding is described. In an embodiment, the electrode comprises a two-part construction having an electrode tip portion that is removably contactable to an electrode base. The electrode is constructed such that the respective base and electrode tip portions may be composed of metals having differing melting temperatures, in particular a significant difference in melting temperature of at least 100° C. or more. The electrode is preferably constructed so that the electrode tip portion can be easily removed, thereby leaving the base portion within the fixture.

公开(公告)号：US10205151B2

公开(公告)日：2019-02-12

申请号：US15289392

申请日：2016-10-10

Applicant: Greatbatch Ltd.

Inventor： Xiangyang Dai ,  Mark J. Roy

IPC: H01M2/06 ,  H01M2/22 ,  H01M2/26 ,  H01M2/30 ,  B23K26/20 ,  H01M4/38 ,  H01M4/40 ,  H01M4/485 ,  H01M4/505 ,  H01M4/525 ,  H01M4/58 ,  H01M4/66 ,  H01M10/052 ,  H01M2/02 ,  B23K101/38

Abstract: A process for creating a laser braze weld joint between a current collector and a terminal pin in the construction of electrochemical cells is described. The laser braze welding process utilizes a laser weld instrument to create a braze-like joint between two work pieces. The weld joint is created by controlling the amount of laser heat and energy imparted to the work pieces through proper control and positioning of the laser beam with respect to the work pieces. Preferably, the method is used to bond the terminal pin to the cathode current collector. This method of attachment is suitable for either primary or secondary cells, particularly those powering implantable biomedical devices.

公开(公告)号：US20190001123A1

公开(公告)日：2019-01-03

申请号：US16121716

申请日：2018-09-05

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Keith W. Seitz ,  Marc Gregory Martino

IPC: A61N1/08 ,  H01G4/005 ,  A61N1/37 ,  H01G4/35 ,  H01G4/30 ,  H01G4/12 ,  A61N1/375 ,  H03H1/00

Abstract: A hermetically sealed filtered feedthrough assembly includes an electrically conductive ferrule sealed by a first gold braze to an insulator disposed at least partially within a ferrule opening. A conductive wire is disposed within a via hole disposed through the insulator extending from a body fluid side to a device side. A second gold braze hermetically seals the conductive leadwire to the via hole. A capacitor is disposed on the device side having a capacitor dielectric body with a dielectric constant k that is greater than 0 and less than 1000. The capacitor is the first filter capacitor electrically connected to the conductive leadwire coming from the body fluid side into the device side. An active electrical connection electrically connects the conductive leadwire to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and housing of the active implantable medical device.

公开(公告)号：US10124164B2

公开(公告)日：2018-11-13

申请号：US15651045

申请日：2017-07-17

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/375 ,  H01G4/40 ,  A61N1/08 ,  A61N1/37 ,  H01G4/35 ,  H01R13/7195 ,  H03H1/00 ,  H05K9/00 ,  H03H7/01 ,  H05K5/00 ,  H05K1/18 ,  H01G4/06

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the capacitor. A ground path electrically extends between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises a conductive pin electrically and mechanically connected to the ferrule by a third gold braze. The ground path comprises an internal ground plate disposed within the circuit board substrate, and the internal ground plate is electrically connected to both the conductive pin and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

公开(公告)号：US20180256907A1

公开(公告)日：2018-09-13

申请号：US15979700

申请日：2018-05-15

Applicant: Greatbatch Ltd.

Inventor： Rodolphe Katra ,  Scott Kimmel ,  Lawrence Kane ,  Daniel Chase

IPC: A61N1/372 ,  A61M25/06 ,  A61B17/34 ,  A61B17/32 ,  A61N1/05

CPC classification number: A61N1/37229 ,  A61B17/3468 ,  A61B2017/320044 ,  A61B2017/320056 ,  A61M25/0668 ,  A61N1/0504

Abstract: In various examples, an apparatus is configured for subcutaneously inserting an implantable device within a patient. The apparatus includes a dilator portion including a dilator including a dilator length. The dilator portion is configured to separate tissue to create a subcutaneous pocket within the patient sized and shaped to accommodate an implantable device within the subcutaneous pocket. A sheath portion includes a sheath sized and shaped to accommodate the dilator within a sheath lumen. The sheath is configured to accommodate an antenna of the implantable device with the dilator removed from within the sheath. The sheath includes a sheath length that is at least substantially as long as an antenna length. The sheath is configured to separate to allow removal of the sheath around the implantable device to remove the sheath from and leave the implantable device within the subcutaneous pocket within the patient.