公开(公告)号：US09036368B2

公开(公告)日：2015-05-19

申请号：US13546503

申请日：2012-07-11

Applicant: Ching-Sheng Chen

Inventor： Ching-Sheng Chen

IPC: H02G3/04

CPC classification number: H02G3/045 ,  H02G3/0418

Abstract: A cable management device used in a chassis includes a frame and two board-like cable management units are respectively connected to two sides of the frame. Each cable management unit has multiple recesses. The cables of each of the ports are located in the corresponding recesses to avoid the cables from being in contact with each other and have better heat dissipating feature.

Abstract translation: 在机架中使用的电缆管理装置包括框架，并且两个板状电缆管理单元分别连接到框架的两侧。 每个电缆管理单元都有多个凹槽。 每个端口的电缆位于相应的凹槽中，以避免电缆彼此接触并具有更好的散热特征。

公开(公告)号：US08853102B2

公开(公告)日：2014-10-07

申请号：US13961844

申请日：2013-08-07

Applicant: Ching-Sheng Chen

Inventor： Ching-Sheng Chen

IPC: H01L21/00 ,  H05K3/06 ,  B82Y10/00 ,  H01L21/768

CPC classification number: H01L21/7685 ,  B82Y10/00 ,  H05K3/062 ,  H05K2201/0338

Abstract: A manufacturing method of a circuit structure is provided. A metal layer having an upper surface is provided. A surface passivation layer is formed on the metal layer. The surface passivation layer exposes a portion of the upper surface of the metal layer, and a material of the metal layer is different from a material of the surface passivation layer. The metal layer and the surface passivation layer are dipped into a modifier, and the modifier is selectively absorbed and attached to the surface passivation layer, so as to form a covering layer. The covering layer has a plurality of nanoparticles and covers the surface passivation layer.

Abstract translation: 提供一种电路结构的制造方法。 提供具有上表面的金属层。 在金属层上形成表面钝化层。 表面钝化层暴露金属层的上表面的一部分，并且金属层的材料不同于表面钝化层的材料。 将金属层和表面钝化层浸入改性剂中，并且改性剂被选择性地吸收并附着到表面钝化层，以形成覆盖层。 覆盖层具有多个纳米颗粒并覆盖表面钝化层。

公开(公告)号：US20120070684A1

公开(公告)日：2012-03-22

申请号：US13046785

申请日：2011-03-14

Applicant: Chin-Sheng Wang ,  Ching-Sheng Chen ,  Chien-Hung Wu

Inventor： Chin-Sheng Wang ,  Ching-Sheng Chen ,  Chien-Hung Wu

IPC: B32B15/04 ,  B32B38/00 ,  C25D5/16 ,  B32B37/00

CPC classification number: C25D5/16 ,  B32B15/08 ,  B32B37/02 ,  B32B2307/302 ,  B32B2457/08 ,  C25D5/10 ,  H01L2924/0002 ,  H05K1/05 ,  H05K3/421 ,  H05K2201/0338 ,  Y10T428/12535 ,  H01L2924/00

Abstract: A thermal conductivity substrate including a metal substrate, a metal layer, an insulating layer, a plurality of conductive structures, a first conductive layer and a second conductive layer is provided. The metal layer is disposed on the metal substrate and entirely covers the metal substrate. The insulating layer is disposed on the metal layer. The conductive structures are embedded in the insulating layer and connected to a portion of the metal layer. The first conductive layer is disposed on the insulating layer. The second conductive layer is disposed on the first conductive layer and the conductive structures. The second conductive layer is electrically connected to a portion of the metal layer through the conductive structures. The second conductive layer and the conductive structures are integrally formed.

Abstract translation: 提供了包括金属基板，金属层，绝缘层，多个导电结构，第一导电层和第二导电层的导热性基板。 金属层设置在金属基板上，完全覆盖金属基板。 绝缘层设置在金属层上。 导电结构嵌入在绝缘层中并连接到金属层的一部分。 第一导电层设置在绝缘层上。 第二导电层设置在第一导电层和导电结构上。 第二导电层通过导电结构电连接到金属层的一部分。 第二导电层和导电结构整体形成。