摘要:
A method of semiconductor device fabrication including forming a plurality of gate structures in a first portion of a substrate, wherein the plurality of gate structures have a first height. A first metal gate structure is formed in a second portion of the substrate, the first metal gate structure being surrounded by an isolation region. A plurality of dummy gate structures is formed in the second portion of the substrate. The plurality of dummy gate structures are configured in a ring formation encircling the metal gate structure and the isolation region. The plurality of dummy structures have a top surface that is substantially planar with the plurality of gate structures and covers at least 5% of a pattern density of the second portion of the substrate.
摘要:
The present invention is in related to a strap lock with both functions of combination code setting and key operation and comprises a lock body being unlocked or locked and a buckle being hasped or separated from the lock body when the lock body being unlocked, the buckle and the lock body are connected each other via a binder so as to that a baggage being bound and buckled; the lock body has a combination locking mechanism and a key device simultaneously, thus the officer for security checking can use a special key to unlock the lock body via the key device, and the lock body can be unlocked without damaging. Besides, the lock body further has an indicator, which can be shifted to a different position after the lock body is unlocked by the key. Thus, the owner of the baggage know whether the baggage being opened or not by means of the displaying position of the indicator.
摘要:
A flash storage device for transferring data to and from a host. The flash storage uses a controller to data transfer in the flash storage device, a buffer to temporarily store data for transfer between the host and the flash storage device, a first table for maintaining storage information relating to the flash storage; and a second table for maintaining information relating to the association of virtual sectors to the logical sectors, wherein the controller transfers data between the host and the flash storage and updates the first table and the second table to reflect the transfer of the data. The first table and the second table contain include addressing and status information for a more efficient and improved data transfer.
摘要:
A data storage system using flash storage maintains a status indicator corresponding to data written into the flash storage. The status indictor of the data indicates whether a disruption, such as a power disruption or a device disconnection, occurred when the data was being written into the flash storage. The data storage system determines whether the data may be corrupted based on one or more of the status indictors. The data storage system may make this determination at a selected time or after a power-up of the data storage system. If the data is determined to possibly be corrupted, the data storage system may optionally discard the corrupted data from the flash storage or flag the corrupted data for future removal.
摘要:
A memory and storage device includes a data management system for transferring data units referenced by logical addresses. The data management system maps the logical addresses to sequential virtual addresses according to the order the data units are received. The data management system also maps the sequential virtual addresses to sequential physical addresses in a memory block of a memory device. Additionally, the data management system can modify a data unit in the memory block by copying any other valid data units in the memory block to another memory block and writing the modified data unit into this other memory block. The data management system writes the valid data units and the modified data unit into sequential physical addresses of this other memory block.
摘要:
An optical element fabrication method including following steps are provided. First, a micro-lens layer including a micro-lens and a first substrate is provided. Besides, a micro optical channel layer including a micro optical channel and a second substrate is provided. A first bonding process is performed to bond the micro-lens layer to the micro optical channel layer, wherein the micro-lens is corresponded to the micro optical channel in a direction that is perpendicular to the surface of the second substrate, and the first substrate of the micro-lens layer is removed later.
摘要:
A power supply system of an electronic device and a power supply method thereof are provided. Directly detecting the power voltage, when a power anomaly of the power voltage is detected, the electronic device may enter the energy-saving mode immediately for reducing power consumption, and a required DC voltage may be provided directly from the battery.
摘要:
A power supply system of an electronic device and a power supply method thereof are provided. Directly detecting the power voltage, when a power anomaly of the power voltage is detected, the electronic device may enter the energy-saving mode immediately for reducing power consumption, and a required DC voltage may be provided directly from the battery.
摘要:
Doped silicon carbide structures, as well as methods associated with the same, are provided. The structures, for example, are components (e.g., layer, patterned structure) in MEMS structures. The doped silicon carbide structures may be highly conductive, thus, providing low resistance to electrical current. An in-situ doping process may be used to form the structures. The process parameters can be selected so that the structures have a low residual stress and/or low strain gradient. Thus, the structures may be formed having desired dimensions with little (or no) distortion arising from residual stress and/or strain gradient. The high conductivity and mechanical integrity of the structures are significant advantages in MEMS devices such as sensors and actuators.
摘要:
A safety adhesive tape having a base layer, a hard resin layer, an adhesive layer, and an anti-sticking layer, the base layer being a plastic film, the hard resin layer being coated on the top side of the base layer, the adhesive layer being coated on the bottom side of the base layer for sticking, the anti-sticking layer being a stripping film covered on one side of the hard resin layer opposite to the base layer. The hard resin layer changes the structural property of the adhesive tape, enabling the adhesive tape to be easily pulled apart with the hands, or cut with a cutter.