Abstract:
The present invention assesses memory (DIMM) strength by calculating frequency content of a radiated field which is collected by an apparatus, such as a dipole antenna. Radiated field is created by accelerated charge, which is a function of the slew rate or DIMM strength. Radiated power is directly proportional to the frequency at which bits are driven. By separating the radiated field from the near field or stored field, the DIMM strength content is isolated from other functional DIMM issues, such as tRCD latency, refresh cycles, addressing mode, etc. By examining the radiated power, the disadvantages of the prior art, such as by probing the DIMM's contacts, are avoided.
Abstract:
A method of transmitting a signal on a bi-directional universal serial bus (“USB”) circuit for boosting a signal on a USB bus disclosed. The circuit includes a first stage inverting buffer coupled to a second stage inverting buffer to form a non-inverting buffer circuit. A high pass filter is coupled in series with the non-inverting buffer circuit to provide AC coupling to the USB bus and to allow fast signal edges through the circuit. The booster circuit is arranged to improve signal quality over a USB bus to allow additional USB devices and longer USB busses to be utilized.
Abstract:
A design structure embodied in a machine readable storage medium for designing, manufacturing, and/or testing a memory module system and DIMM connector is provided. A DIMM connector includes a plurality of DIMM sockets for receiving a corresponding plurality of DIMMs in a radially oriented, angularly spaced orientation. The DIMM sockets are connected in parallel at a memory module junction so that socket terminals of each DIMM socket are joined to the same relative terminal of all the other DIMM sockets along electronic pathways of substantially equal length. A memory controller selectively communicates with the DIMMs via the DIMM junction. By virtue of the improved topology, impedance within the DIMM connector may be better matched to minimize reflections and improve signal quality.
Abstract:
The invention is directed to an on-chip probing apparatus. In accordance with an embodiment of the present invention, the on-chip probing apparatus includes: a plurality of switches on a chip; a plurality of externally accessible probe points on the chip; and a multiplexer for controlling the plurality of switches to selectively couple an output signal of the chip to one of the plurality of probe points.
Abstract:
The present invention is directed to a multi-path redundant architecture for fault tolerant fully buffered dual inline memory modules (FB-DIMMs). The architecture includes: a FB-DIMM channel including a plurality of DIMM modules and a memory controller; a bidirectional serial memory bus for coupling the memory controller and the plurality of DIMM modules of the FB-DIMM channel in a first connection order; and a redundant bidirectional serial memory bus for coupling the memory controller and the plurality of DIMM modules of the FB-DIMM channel in a second connection order