公开(公告)号：US07126824B2

公开(公告)日：2006-10-24

申请号：US10900716

申请日：2004-07-27

申请人： Hsieh Kun Lee ,  Wanlin Xia ,  Jin Song Feng

发明人： Hsieh Kun Lee ,  Wanlin Xia ,  Jin Song Feng

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device assembly includes a heat sink (20) placed on an electronic component (52) which is mounted on a printed circuit board (PCB) (50) and including a pair of shoulders (23) on opposite sides thereof, a pressing part (30) including a pair of pressing portions (36) supported on the shoulders and a pair of locking portions (34) spaced from the shoulders, a sliding part (40) slidably attached to the pressing part and including a pair of locking portions (41) spaced from the shoulder, and a back plate (60) mounted below the PCB and including four posts (61) extending through the PCB and the heat sink to resilently engage with the locking portions. Each locking portion defines a locking opening (33, 43) including an entrance (33a, 43a) and a locking slot (33b, 43b), the post being capable of extending through the entrance to engage in the locking slot.

摘要翻译： 散热装置组件包括放置在电子部件（52）上的散热器（20），该散热器安装在印刷电路板（PCB）（50）上并且包括在其相对侧上的一对肩部（23） 包括支撑在肩上的一对按压部分（36）和与肩部间隔开的一对锁定部分（34）的部分（30），滑动部分（40）可滑动地附接到按压部分并且包括一对锁定部分 （41）和安装在PCB下方的后板（60），并且包括延伸穿过PCB和散热器的四个柱（61），以与锁定部分弹性地接合。 每个锁定部分限定包括入口（33a，43a）和锁定槽（33b，43b）的锁定开口（33,43），该柱能够延伸穿过入口以接合在锁定槽中。

公开(公告)号：US06962192B2

公开(公告)日：2005-11-08

申请号：US10867941

申请日：2004-06-14

申请人： Hsieh Kun Lee ,  Tao Li ,  Jin Song Feng

发明人： Hsieh Kun Lee ,  Tao Li ,  Jin Song Feng

IPC分类号： H01L23/40 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation assembly includes a printed circuit board (70) with a heat-generating device (74) mounted thereon, a heat sink (60) mounted on the heat-generating device for dissipating heat therefrom, a retaining device (1) and a locating member (50). The retaining device includes a pair of spaced pressing portions (14) pressing on the heat sink, and a pair of pivot portions (34) pivotally engaged with the pressing portions respectively. The locating member includes a baseplate (52) located at an underside of the printed circuit board, and four pins (54) extending from the baseplate. The pins pass through the printed circuit board and the heat sink. Two of the pins are engaged by the pressing portions, and the other two pins are engaged by the pivot portions when the pivot portions are pivotally moved toward the printed circuit board.

摘要翻译： 散热组件包括其上安装有发热装置（74）的印刷电路板（70），安装在发热装置上以散发热量的散热片（60），保持装置（1）和 定位构件（50）。 保持装置包括一对按压在散热器上的间隔开的挤压部分（14），以及一对枢转部分（34），分别与按压部分枢轴地啮合。 定位构件包括位于印刷电路板的下侧的基板（52）和从基板延伸的四个销（54）。 引脚穿过印刷电路板和散热片。 其中两个销被按压部分接合，另外两个销在枢转部分朝向印刷电路板转动时由枢轴部分啮合。

公开(公告)号：US20050128714A1

公开(公告)日：2005-06-16

申请号：US10950324

申请日：2004-09-23

申请人： Hsieh Lee ,  Wan-Lin Xia ,  Xue-Wen Peng ,  Jin-Song Feng

发明人： Hsieh Lee ,  Wan-Lin Xia ,  Xue-Wen Peng ,  Jin-Song Feng

IPC分类号： G06F1/20 ,  H01L23/34 ,  H01L23/40 ,  H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/306 ,  H01L2924/00

摘要： A fastener (10) for mounting a heat-radiator (20) to an electronic device (30) on a circuit board (40) is disclosed. The heat-radiator and the circuit board have aligned holes (22, 44). The fastener includes a head (11) having an upper portion (112) with a large diameter and a lower portion (113) with a smaller diameter, a cylindrical spring (14) captured around the lower portion of the head for exerting a spring force against the heat-radiator, and a metallic wire (15) having a first end portion fixed on said head and a second end portion bent to form an engaging portion (152). The engaging portion of the metallic wire compressively passes through the aligned holes of the heat-radiator and the circuit board and is engaged with an underside of the circuit board.

摘要翻译： 公开了一种用于将散热器（20）安装到电路板（40）上的电子设备（30）的紧固件（10）。 散热器和电路板具有对准的孔（22,44）。 紧固件包括具有大直径的上部部分（112）和较小直径的下部（113）的头部（11），围绕头部的下部部分捕获的圆柱形弹簧（14），用于施加弹簧力 以及金属线（15），其具有固定在所述头部上的第一端部和弯曲形成接合部分（152）的第二端部。 金属丝的接合部压缩地穿过散热器和电路板的对准的孔，并与电路板的下侧接合。

公开(公告)号：US06871698B2

公开(公告)日：2005-03-29

申请号：US10748809

申请日：2003-12-29

申请人： Hsieh Kun Lee ,  WanLin Xia ,  Jin Song Feng

发明人： Hsieh Kun Lee ,  WanLin Xia ,  Jin Song Feng

IPC分类号： H01L23/367 ,  F28F3/04

CPC分类号： H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device (30) includes a base (50) and a plurality of individual fin plates (40) standing side by side on the base. Each fin plate includes a main body (41), a flange (43) and a pair of tabs (45) distal from the flange. Each tab defines a split (46) in a middle thereof where it adjoins the corresponding main body and thereby forms a tongue (47) surrounded on three sides by the split. The tongue is coplanar with the main body while the flange and the tabs are perpendicular to the main body. A slot (49) is defined in a distal end of each tab. The flanges of the fin plates are in alignment with each other and attached on the base. The slots of each fin plate receive the tongues of an adjoining preceding fin plate.

摘要翻译： 散热装置（30）包括底座（50）和在基座上并排站立的多个单独翅片（40）。 每个翅片板包括主体（41），凸缘（43）和远离凸缘的一对凸片（45）。 每个翼片在其中间分隔开一个分隔（46），在其中它与相应的主体相邻，从而形成一个通过分开的三面包围的舌部（47）。 舌头与主体共面，而凸缘和凸片垂直于主体。 狭槽（49）被限定在每个翼片的远端。 鳍板的凸缘彼此对准并且附接在基座上。 每个翅片板的槽接收相邻的前翅片的舌片。

公开(公告)号：US20130112387A1

公开(公告)日：2013-05-09

申请号：US13338252

申请日：2011-12-28

申请人： JI-YUN QIN ,  JIN-SONG FENG ,  QIANG YAN

发明人： JI-YUN QIN ,  JIN-SONG FENG ,  QIANG YAN

IPC分类号： F28F7/00

CPC分类号： H05K7/20418 ,  H01L23/367 ,  H01L2023/4056 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a first heat sink and a second heat sink connected to each other. Each of the first and second heat sinks includes a base and a plurality of fins extending from the base. The base of the first heat sink forms a rib on a lateral face thereof, and the base of the second heat sink defines a groove in a lateral face thereof. The rib is received in the groove to connect the first heat sink with the second heat sink.

摘要翻译： 散热装置包括彼此连接的第一散热器和第二散热器。 第一和第二散热片中的每一个包括基部和从基部延伸的多个翅片。 第一散热器的底部在其侧面上形成肋，第二散热器的基部在其侧面中形成凹槽。 肋被容纳在凹槽中以将第一散热器与第二散热器连接。

公开(公告)号：US07950828B2

公开(公告)日：2011-05-31

申请号：US12024964

申请日：2008-02-01

申请人： Wen-Xiang Zhang ,  Guang Yu ,  Jin-Song Feng ,  Zhi-Yong Zhou

发明人： Wen-Xiang Zhang ,  Guang Yu ,  Jin-Song Feng ,  Zhi-Yong Zhou

IPC分类号： F21V29/00

CPC分类号： F21K9/00 ,  F21K9/65 ,  F21V14/02 ,  F21V19/02 ,  F21V29/73 ,  F21V29/74 ,  F21V29/75 ,  F21V29/763 ,  F21V29/77 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10

摘要： An LED lamp includes a first heat sink, a second heat sink and a plurality of LED modules. The second heat sink is located at a lateral side of the first heat sink and pivotally connects with the first heat sink. The LED modules are evenly attached on bottoms of the first and second heat sinks. The second heat sink can be rotated relative to the first heat sink to be fixed at a required position, whereby an illumination angle of the LED lamp can be adjusted. Heat generated by the LED modules is dissipated by the first and second heat sinks.

摘要翻译： LED灯包括第一散热器，第二散热器和多个LED模块。 第二散热器位于第一散热器的侧面并与第一散热器枢转连接。 LED模块均匀地附着在第一和第二散热器的底部。 第二散热器可以相对于第一散热器旋转以固定在所需位置，从而可以调节LED灯的照明角度。 由LED模块产生的热量由第一和第二散热器消散。

公开(公告)号：US20110061918A1

公开(公告)日：2011-03-17

申请号：US12581179

申请日：2009-10-19

申请人： JIN WANG ,  JIN-SONG FENG

发明人： JIN WANG ,  JIN-SONG FENG

IPC分类号： H05K1/16 ,  H05K1/00

CPC分类号： H05K7/142

摘要： A backboard assembly includes a back plate, an electrically insulative sheet and a connection element. The connection element comprises a plurality of first engaging structures on a first side thereof to engage with the back plate and a plurality of second engaging structures on a second side opposing to the first side to engage with the electrically insulative sheet.

摘要翻译： 背板组件包括背板，电绝缘片和连接元件。 连接元件包括在其第一侧上的多个第一接合结构，其与背板接合并且在与第一侧相对的第二侧上与多个第二接合结构接合以与电绝缘片接合。

公开(公告)号：US07891845B2

公开(公告)日：2011-02-22

申请号：US12396475

申请日：2009-03-03

申请人： Yi Zhang ,  Cheng-Tien Lai ,  Jin-Song Feng

发明人： Yi Zhang ,  Cheng-Tien Lai ,  Jin-Song Feng

IPC分类号： F21V29/00

CPC分类号： F21V29/763 ,  F21K9/00 ,  F21V19/003 ,  F21V29/51 ,  F21V29/75 ,  F21V29/76 ,  F21Y2115/10

摘要： An LED lamp includes a heat sink having a base and a plurality of LED module assemblies mounted on a top surface of the base of the heat sink. Each of the LED module assemblies includes a fixing bracket secured to the top surface of the base, an LED module mounted on a top surface of the fixing bracket and two heat pipes engaging with the fixing bracket and the heat sink. The fixing bracket includes a bottom plate attached on the top surface of the base, a top plate on which the LED module is attached and a connecting plate interconnecting the bottom plate with the top plate. The heat pipes thermally connect the bottom plate and the heat sink with the top plate.

摘要翻译： LED灯包括具有基座的散热器和安装在散热器的基座的顶表面上的多个LED模块组件。 每个LED模块组件包括固定到基座顶面的固定支架，安装在固定支架顶表面上的LED模块和与固定支架和散热片相接合的两个热管。 固定支架包括安装在基座顶表面上的底板，安装有LED模块的顶板和将底板与顶板互连的连接板。 热管将顶板和散热器与顶板热连接。

公开(公告)号：US07723844B2

公开(公告)日：2010-05-25

申请号：US11626734

申请日：2007-01-24

申请人： Jin-Song Feng ,  Song-Shui Liu

发明人： Jin-Song Feng ,  Song-Shui Liu

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink, a retention module and a locking device for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat-generating component. The retention module includes a bottom wall and a first spring clip secured at one side thereof. The locking device is pivotably connected to the retention module and includes a second spring clip attached thereon. The heat sink rests on the bottom wall of the retention module with an end thereof being pressed by the first spring clip, and an opposite end thereof being pressed by the second spring clip. The locking device can be at a released position where the locking device is pivotable, so that the heat sink is removable from the retention module, and a locked position where the locking device presses the base of the heat sink.

摘要翻译： 散热装置包括散热器，保持模块和用于将散热器固定到保持模块的锁定装置。 散热器包括用于与发热部件接触的基座。 保持模块包括底壁和固定在其一侧的第一弹簧夹。 锁定装置可枢转地连接到保持模块并且包括附接在其上的第二弹簧夹。 散热片搁置在保持模块的底壁上，其一端由第一弹簧夹压紧，其另一端被第二弹簧夹压。 锁定装置可以处于释放位置，在该位置锁定装置可枢转，使得散热器可从保持模块移除，锁定装置可以锁定装置按压散热器的底部。

公开(公告)号：US20100097766A1

公开(公告)日：2010-04-22

申请号：US12417605

申请日：2009-04-02

申请人： WEI-LE WU ,  JIN-SONG FENG ,  CHENG-TIEN LAI

发明人： WEI-LE WU ,  JIN-SONG FENG ,  CHENG-TIEN LAI

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/4006 ,  H01L23/467 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

摘要： A fixing device fastens a heat sink having a base on one of motherboards with different specifications. Each motherboard with a corresponding specification defines a plurality of extending holes therethrough. The fixing device comprises a plurality of slats each having an end thereof pivotally connecting to the base of the heat sink and the other end thereof defining an elongated slot for corresponding to one of the extending holes of the one of the motherboards, a back plate defining a plurality of mounting holes corresponding to the extending holes of the motherboards, and a plurality of fixing units extending through the slots of the slats, the extending holes of the one of the motherboards and corresponding mounting holes of the back plate to mount the heat sink on the one of the motherboards.

摘要翻译： 定影装置将具有基座的散热器固定在具有不同规格的主板之一上。 具有相应规格的每个主板限定了穿过其中的多个延伸的孔。 定影装置包括多个板条，每个板条的端部枢转地连接到散热器的底部，并且其另一端限定用于对应于一个主板的一个延伸孔的细长槽，限定 与主板的延伸孔相对应的多个安装孔，以及延伸穿过板条槽的多个固定单元，一个主板的延伸孔和背板的相应安装孔，以安装散热片 在主板之一上。