Abstract:
Connector structures for electronic devices may be provided with moisture indicators. The connector structures may include a connector such as data port connector that has a rear opening. A moisture barrier structure may cover the rear of the data port connector and may have an opening that is aligned with the rear opening. A moisture indicator may cover the opening in the moisture barrier structure. A transparent window structure such as a layer of clear film may be used to prevent moisture from traveling through the rear opening of the data port connector and the opening in the moisture barrier structure to the moisture indicator. An audio port connector may be provided with a moisture indicator and a transparent window structure that helps prevent moisture from reaching the moisture indicator through the audio port connector.
Abstract:
A corrosion-resistant electrical connector is disclosed. A multi-layer nickel underplating is applied to the substrate material of the connector contacts. The three layers of nickel include a leveling nickel layer, a sulfumate nickel layer, and a high-phosphorous nickel layer. A layer of gold is applied to the nickel underplating in an embodiment.
Abstract:
A corrosion-resistant electrical connector is disclosed. A multi-layer nickel underplating is applied to the substrate material of the connector contacts. The three layers of nickel include a leveling nickel layer, a sulfumate nickel layer, and a high-phosphorous nickel layer. A layer of gold is applied to the nickel underplating in an embodiment.
Abstract:
Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a base coupled to a circuit board for electrically coupling with the removable module, a cage for biasing the module down against the base, and a guide for retaining the module at a functional insertion position within the device.
Abstract:
Receptacle connectors and male plug connectors having a reduced size in at least one direction can be provided. One example reduces height by not including a center contact tab or tongue, but instead places contacts on an insulator that is adjacent to a bottom portion of the receptacle. Another example may reduce width by reducing contact pitch, and may use a particular shape of contact to achieve god signal quality. Receptacle connectors and male plug connectors can also provide support for one or more new high-speed communication standards, such as USB 3.0 and DisplayPort. Methods can provide one or more standardized connector components to speed connector design and manufacture of new electronic devices such as media players, thus reducing their time to market.
Abstract:
An electrical connector that utilizes a flexible substrate for providing electrical contact surfaces within the electrical connector is disclosed. Advantageously, the electrical contact surfaces can be precisely formed on the flexible substrate such that manual assembly of individual contacts (e.g., pins) for a connector can be avoided. In one embodiment, the flexible substrate also facilitates connection of the electrical connector to other electrical components, such as other substrates, integrated circuits, etc., without having to solder leads or pins of a connector to a printed circuit board. In one implementation, the flexible substrate can be integrally formed with a system substrate.
Abstract:
Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a base coupled to a circuit board for electrically coupling with the removable module, a cage for biasing the module down against the base, and a guide for retaining the module at a functional insertion position within the device.
Abstract:
Electronic devices are provided with ejectable component assemblies. The ejectable component assembly may include a tray that can be loaded with one or more removable modules, wafers coupled to circuit boards, cages and retaining plates to assist in retaining the tray within the assembly. The ejectable component assembly may include springs operative to engage detents in the tray to retain the tray in the assembly. The ejectable component assembly may include a tray ejector mechanism for ejecting the tray from the assembly.
Abstract:
Wireless electronic devices may include wireless communications circuitry such as a transceiver, antenna, and other wireless circuitry. The transceiver may be coupled to the antenna through a bidirectional switch connector. The switch connector may mate with a corresponding radio-frequency test probe that is connected to radio-frequency test equipment. When the test probe is mated with the switch connector, the transceiver may be decoupled from the antenna. During transceiver testing, radio-frequency test signals may be conveyed between the test unit and the transceiver using the test probe. During antenna testing, radio-frequency test signals may be conveyed between the test unit and the antenna using the test probe. Transceiver testing and antenna testing may, if desired, be conducted in parallel using the test probe.