公开(公告)号：US20140154960A1

公开(公告)日：2014-06-05

申请号：US14233489

申请日：2012-07-16

Applicant: Seh Kwang Lee ,  Joo Han Lee

Inventor： Seh Kwang Lee ,  Joo Han Lee

IPC: B24B53/017

CPC classification number: B24B53/017 ,  B24B53/12

Abstract: The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.

Abstract translation: 本发明涉及一种CMP衬垫调节器，其具有形成在衬底的至少一个表面上的衬底和切割尖端图案，更具体地涉及具有切割尖端图案的CMP垫调节器，其中切割尖端图案具有改进的结构 这可以提高CMP垫调节器的生产率，并且可以充分确保切割尖端图案的强度和安全性。

公开(公告)号：US20120182653A1

公开(公告)日：2012-07-19

申请号：US13316020

申请日：2011-12-09

Applicant: Joo-Han LEE ,  Young-Soo AN ,  Yong-Hyun KIM ,  Seong-Chan HAN

Inventor： Joo-Han LEE ,  Young-Soo AN ,  Yong-Hyun KIM ,  Seong-Chan HAN

IPC: H02H9/04

CPC classification number: H02H9/046 ,  H05K1/0259

Abstract: A semiconductor module includes a printed circuit board, at least one on-board device unit coupled between at least one voltage line and a power line. The at least on-board device unit is mounted on the printed circuit board. At least one electrostatic discharge protection circuit unit, configured to protect the at least one on-board device unit from an electrostatic discharge that occurs in the at least one voltage line, is coupled to the at least one voltage line.

Abstract translation: 半导体模块包括印刷电路板，耦合在至少一个电压线和电力线之间的至少一个板上器件单元。 至少车载设备单元安装在印刷电路板上。 至少一个静电放电保护电路单元被配置为保护至少一个板上器件单元免于在至少一个电压线中发生的静电放电，耦合到至少一个电压线。

公开(公告)号：US20110194260A1

公开(公告)日：2011-08-11

申请号：US13017452

申请日：2011-01-31

Applicant: Jin-san Jung ,  Joo-han Lee ,  Jung-chan Cho ,  Hyun-seok Choi

Inventor： Jin-san Jung ,  Joo-han Lee ,  Jung-chan Cho ,  Hyun-seok Choi

IPC: H05K7/00 ,  H05K3/10

CPC classification number: H05K3/10 ,  H05K1/0353 ,  H05K1/112 ,  H05K3/3452 ,  H05K2201/09581 ,  H05K2201/09909 ,  Y10T29/49155

Abstract: A semiconductor package module including a self-assembled organic molecule layer and a method of manufacturing the semiconductor package module is provided. The semiconductor package module may include a module printed circuit board (PCB) having a plurality of metal line patterns and a plurality of mounting pads formed thereon. The semiconductor package may further include an insulation thin film self-assembled on at least one metal line pattern selected from among the plurality of metal line patterns. In order to manufacture the semiconductor package module, the insulation thin film is formed in a manner that the plurality of metal line patterns are formed on the module PCB wherein a plurality of via holes are formed, and then an organic compound is self-assembled on a surface of at least one metal line pattern selected from the plurality of metal line patterns.

Abstract translation: 提供了包括自组装有机分子层的半导体封装模块和制造半导体封装模块的方法。 半导体封装模块可以包括具有多个金属线图案和形成在其上的多个安装焊盘的模块印刷电路板（PCB）。 半导体封装还可以包括在从多个金属线图案中选择的至少一种金属线图案上自组装的绝缘薄膜。 为了制造半导体封装模块，绝缘薄膜形成为在模块PCB上形成多个金属线图案，其中形成多个通孔，然后将有机化合物自组装在 从所述多个金属线图案中选择的至少一个金属线图案的表面。