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公开(公告)号：US20130341742A1
公开(公告)日：2013-12-26
申请号：US13924047
申请日：2013-06-21
Applicant: NextInput, Inc.
Inventor： Amnon Brosh
CPC classification number: B81B3/0072 , B81B3/0021 , B81C1/00158 , B81C1/00666 , G01L1/044 , G01L1/18 , G01L5/0028 , G01L5/0057 , G01L5/162
Abstract: A composite wafer level MEMS force dies including a spacer coupled to a sensor is described herein. The sensor includes at least one flexible sensing element, such as a beam or diaphragm, which have one or more sensor elements formed thereon. Bonding pads connected to the sensor elements are placed on the outer periphery of the sensor. The spacer, which protects the flexible sensing element and the wire bonding pads, is bonded to the sensor. For the beam version, the bond is implemented at the outer edges of the die. For the diaphragm version, the bond is implemented in the center of the die. An interior gap between the spacer and the sensor allows the flexible sensing element to deflect. The gap can also be used to limit the amount of deflection of the flexible sensing element in order to provide overload protection.
Abstract translation: 本文描述了包括耦合到传感器的间隔件的复合晶片级MEMS力模。 传感器包括至少一个柔性传感元件，例如梁或隔膜，其具有形成在其上的一个或多个传感器元件。 连接到传感器元件的接合垫放置在传感器的外周。 保护柔性感测元件和引线接合垫的间隔件被粘合到传感器上。 对于光束版本，焊接在裸片的外边缘处实现。 对于膜片版本，键合在芯片的中心实现。 间隔器和传感器之间的内部间隙允许柔性传感元件偏转。 该间隙也可用于限制柔性传感元件的偏转量，以提供过载保护。
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公开(公告)号：US20240418583A1
公开(公告)日：2024-12-19
申请号：US18274127
申请日：2022-01-31
Applicant: NextInput, Inc.
Inventor： Julius Minglin Tsai , Ali Foughi
Abstract: A hybrid sensor device includes a substrate; a first sensing element configured to sense force; a second sensing element configured to sense at least one of light intensity, acoustic impedance, electrical conductivity, electrical permittivity, or temperature; signal processing circuitry configured to receive and process respective output signals of the first and second sensing elements; and decision logic circuitry configured to validate an intent of a user input based on the respective output signals of the first and second force sensors, wherein the first and second sensors, the signal processing circuitry, and the decision logic circuitry are integrated on the substrate.
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公开(公告)号：US20230184603A1
公开(公告)日：2023-06-15
申请号：US18103465
申请日：2023-01-30
Applicant: NextInput, Inc.
Inventor： Julius Minglin Tsai , Dan Benjamin
CPC classification number: G01L1/2281 , G01L1/16 , G01L1/18
Abstract: MEMS force sensors for providing temperature coefficient of offset (TCO) compensation are described herein. An example MEMS force sensor can include a TCO compensation layer to minimize the TCO of the force sensor. The bottom side of the force sensor can be electrically and mechanically mounted on a package substrate while the TCO compensation layer is disposed on the top side of the sensor. It is shown the TCO can be reduced to zero with the appropriate combination of Young’s modulus, thickness, and/or thermal coefficient of expansion (TCE) of the TCO compensation layer.
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公开(公告)号：US20230016531A1
公开(公告)日：2023-01-19
申请号：US17860941
申请日：2022-07-08
Applicant: NextInput, Inc.
Inventor： Julius Minglin Tsai , Ryan Diestelhorst , Dan Benjamin
Abstract: An example microelectromechanical system (MEMS) force sensor is described herein. The MEMS force sensor can include a sensor die configured to receive an applied force. The sensor die can include a first substrate and a second substrate, where a cavity is formed in the first substrate, and where at least a portion of the second substrate defines a deformable membrane. The MEMS force sensor can also include an etch stop layer arranged between the first substrate and the second substrate, and a sensing element arranged on a surface of the second substrate. The sensing element can be configured to convert a strain on the surface of the membrane substrate to an analog electrical signal that is proportional to the strain.
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公开(公告)号：US11255737B2
公开(公告)日：2022-02-22
申请号：US16485016
申请日：2018-02-09
Applicant: NEXTINPUT, INC.
Inventor： Ali Foughi , Ryan Diestelhorst , Dan Benjamin , Julius Minglin Tsai , Michael Dueweke
Abstract: In one embodiment, a ruggedized wafer level microelectromechanical (“MEMS”) force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.
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Patent Agency Ranking
公开(公告)号：US20210190608A1
公开(公告)日：2021-06-24
申请号：US16757225
申请日：2018-10-17
Applicant: NEXTINPUT, INC.
Inventor： Julius Minglin Tsai , Dan Benjamin
Abstract: MEMS force sensors for providing temperature coefficient of offset (TCO) compensation are described herein. An example MEMS force sensor can include a TCO compensation layer to minimize the TCO of the force sensor. The bottom side of the force sensor can be electrically and mechanically mounted on a package substrate while the TCO compensation layer is disposed on the top side of the sensor. It is shown the TCO can be reduced to zero with the appropriate combination of Young's modulus, thickness, and/or thermal coefficient of expansion (TCE) of the TCO compensation layer.
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公开(公告)号：US10817061B2
公开(公告)日：2020-10-27
申请号：US16119033
申请日：2018-08-31
Applicant: JOYSON SAFETY SYSTEMS ACQUISITION LLC , NextInput, Inc.
Inventor： David Andrews , Ian Campbell , Ryan Diestelhorst , Jason Carl Lisseman , Don Metzger
IPC: G09G5/00 , G06F3/01 , B60K35/00 , G06F3/041 , B60K37/06 , G06F3/0354 , B60R16/023 , B60W50/16 , G06F3/16
Abstract: A multi-dimensional track pad is described that acts as human-machine interface (HMI). Inputs to the HMI can be made not only using the tradition two-dimensional (X-Y) inputs of a track pad, but also a third dimension, force, and even a fourth dimension, time. Tactile or audible feedback to the inputs can be provided. Methods of using the HMI to control a system are described as well as a track pad system that utilizes the HMI in communication with a processor.
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公开(公告)号：US20200234023A1
公开(公告)日：2020-07-23
申请号：US16634495
申请日：2018-07-25
Applicant: NEXTINPUT, INC.
Inventor： Julius Minglin TSAI , Dan BENJAMIN
Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) sensor including both fingerprint and force sensing elements and integrated with complementary metal-oxide-semiconductor (“CMOS”) circuitry on the same chip. The sensor employs either piezoresistive or piezoelectric sensing elements for detecting force and also capacitive or ultrasonic sensing elements for detecting fingerprint patterns. Both force and fingerprint sensing elements are electrically connected to integrated circuits on the same chip. The integrated circuits can amplify, digitize, calibrate, store, and/or communicate force values and/or fingerprint patterns through output pads to external circuitry.
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公开(公告)号：US20190383675A1
公开(公告)日：2019-12-19
申请号：US16485026
申请日：2018-02-09
Applicant: NEXTINPUT, INC.
Inventor： Julius Minglin Tsai , Ryan Diestelhorst , Dan Benjamin
Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including both piezoresistive and piezoelectric sensing elements and integrated with complementary metal-oxide-semiconductor (“CMOS”) circuitry on the same chip. The sensor employs piezoresistive strain gauges for static force and piezoelectric strain gauges for dynamic changes in force. Both piezoresistive and piezoelectric sensing elements are electrically connected to integrated circuits provided on the same substrate as the sensing elements. The integrated circuits can be configured to amplify, digitize, calibrate, store, and/or communicate force values electrical terminals to external circuitry.
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公开(公告)号：US20180179050A1
公开(公告)日：2018-06-28
申请号：US15904631
申请日：2018-02-26
Applicant: NextInput, Inc.
Inventor： Amnon Brosh , Ryan Diestelhorst , Steven Nasiri
CPC classification number: B81B3/0056 , B81B2201/0264 , B81B2201/0292 , B81C1/00626 , G01L1/18 , G01L1/205 , G01L9/0047 , G01L9/0048
Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.
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