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公开(公告)号：US20190383676A1
公开(公告)日：2019-12-19
申请号：US16485016
申请日：2018-02-09
Applicant: NEXTINPUT, INC.
Inventor： Ali Foughi , Ryan Diestelhorst , Dan Benjamin , Julius Minglin Tsai , Michael Dueweke
Abstract: Described herein is a ruggedized wafer level microelectromechanical (“MEMS”) force sensor including a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.
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公开(公告)号：US11946817B2
公开(公告)日：2024-04-02
申请号：US17676477
申请日：2022-02-21
Applicant: NEXTINPUT, INC.
Inventor： Ali Foughi , Ryan Diestelhorst , Dan Benjamin , Julius Minglin Tsai , Michael Dueweke
CPC classification number: G01L1/18 , B81B7/02 , B81C1/00246 , G01L1/14 , G01L1/16 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2207/015 , B81B2207/07 , B81C2201/013 , B81C2203/0109 , B81C2203/0714 , B81C2203/0728
Abstract: In one embodiment, a ruggedized wafer level microelectromechanical (“MEMS”) force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.
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Patent Agency Ranking
公开(公告)号：US20220268648A1
公开(公告)日：2022-08-25
申请号：US17676477
申请日：2022-02-21
Applicant: NEXTINPUT, INC.
Inventor： Ali Foughi , Ryan Diestelhorst , Dan Benjamin , Julius Minglin Tsai , Michael Dueweke
Abstract: In one embodiment, a ruggedized wafer level microelectromechanical (“MEMS”) force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.
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公开(公告)号：US11953380B2
公开(公告)日：2024-04-09
申请号：US17613222
申请日：2020-05-21
Applicant: NEXTINPUT, INC.
Inventor： Ali Foughi , Julius Minglin Tsai , Christopher Edwards
CPC classification number: G01J5/20 , G01J5/0007 , G01J5/024 , G01J5/58
Abstract: Described herein is a sensor in chip scale package form factor. For example, a non-vacuum packaged sensor chip described herein includes a substrate, and a sensing element arranged on the substrate. The sensing element is configured to change resistance with temperature. Additionally, the non-vacuum packaged sensor chip includes an absorbing layer configured to absorb middle infrared (“MIR”) radiation.
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公开(公告)号：US20240418583A1
公开(公告)日：2024-12-19
申请号：US18274127
申请日：2022-01-31
Applicant: NextInput, Inc.
Inventor： Julius Minglin Tsai , Ali Foughi
Abstract: A hybrid sensor device includes a substrate; a first sensing element configured to sense force; a second sensing element configured to sense at least one of light intensity, acoustic impedance, electrical conductivity, electrical permittivity, or temperature; signal processing circuitry configured to receive and process respective output signals of the first and second sensing elements; and decision logic circuitry configured to validate an intent of a user input based on the respective output signals of the first and second force sensors, wherein the first and second sensors, the signal processing circuitry, and the decision logic circuitry are integrated on the substrate.
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公开(公告)号：US11255737B2
公开(公告)日：2022-02-22
申请号：US16485016
申请日：2018-02-09
Applicant: NEXTINPUT, INC.
Inventor： Ali Foughi , Ryan Diestelhorst , Dan Benjamin , Julius Minglin Tsai , Michael Dueweke
Abstract: In one embodiment, a ruggedized wafer level microelectromechanical (“MEMS”) force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.
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公开(公告)号：US11914777B2
公开(公告)日：2024-02-27
申请号：US16645650
申请日：2018-09-07
Applicant: NEXTINPUT, INC.
Inventor： Julius Minglin Tsai , Albert Bergemont , Christopher Edwards , Ali Foughi
IPC: G06F3/01 , G01L5/1627 , H10N30/20 , H10N30/853 , B81B7/00 , B06B1/06
CPC classification number: G06F3/016 , B06B1/0644 , B06B1/0688 , B81B7/008 , G01L5/1627 , H10N30/20 , H10N30/8536 , H10N30/8542 , H10N30/8554
Abstract: Integrated systems for force or strain sensing and haptic feedback are described herein. An example force-haptic system can include a sensor chip configured to receive an applied force, where the sensor chip includes at least one sensing element and an integrated circuit. The force-haptic system can also include a haptic actuator configured to convert an electrical excitation signal into mechanical vibration. Further, the force-haptic system can include a circuit board, where the sensor chip and the haptic actuator are electrically and mechanically coupled to the circuit board. The integrated circuit can be configured to process an electrical signal received from the at least one sensing element and to output the electrical excitation signal.
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