公开(公告)号：US20220336973A1

公开(公告)日：2022-10-20

申请号：US17719506

申请日：2022-04-13

Applicant: Hyun Duk KIM ,  Sensorview Co., Ltd. ,  okins electronics Co.,Ltd

Inventor： Byoung Nam KIM ,  Kyoung Il KANG ,  Jin Woo LEE ,  Jin Kook JUN ,  Sung Gyu PARK ,  Hyun Duk KIM ,  Jong Wook HAM ,  Sang Woo HAN

IPC: H01R9/05 ,  H01R13/17 ,  H01R13/502

Abstract: Disclosed is a cable adaptor comprising a first member which is conductive and comes into contact with a signal pin of the cable, a second member disposed outside the first member and coupled to the first member, a third member which is conductive and disposed outside the second member, and a contact pin fixed to the first member. Here, the first member includes a first body coupled to the second member and a first contact portion which extends from the first body and comes into contact with the signal pin. The third member includes a second body coupled to the second member and a second contact portion which extends from the second body and comes into contact with the outer conductor. A plurality of first contact points of the signal pin and the first contact portion are arranged at same intervals along a circumferential direction of the signal pin.

公开(公告)号：US20210199692A1

公开(公告)日：2021-07-01

申请号：US16812147

申请日：2020-03-06

Applicant: OKINS ELECTRONICS CO., LTD

Inventor： Jin Kook JUN ,  Eun Hyeong PYO ,  Won Ho CHOI

IPC: G01R1/067 ,  G01R1/04 ,  G01R1/073

Abstract: There is provided a probe pin for performing an electrical inspection between a contact pad of a test apparatus and a conductive ball of a semiconductor device, the probe pin including a cylinder-type bottom plunger connected to the contact pad and configured to slide vertically, a piston-type top plunger connected to the conductive ball and configured to slide vertically, and an outer spring configured to provide an elastic force between the bottom plunger and the top plunger. According to the configuration of the present invention, it is possible to perform a stable inspection process by using the outer spring despite pin miniaturization.

公开(公告)号：US20170027056A1

公开(公告)日：2017-01-26

申请号：US14919442

申请日：2015-10-21

Applicant: Okins Electronics Co., Ltd.

Inventor： Jin Kook Jun ,  Sung Gye Park ,  Jae Weon Shim ,  Sang Hoon Cha

IPC: H05K1/11 ,  H05K1/02 ,  G01R1/04

CPC classification number: H05K1/11 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/07342 ,  G01R1/0735 ,  H05K1/028 ,  H05K2201/0364

Abstract: A microelectromechanical system (MEMS) film for a test socket is arranged between a semiconductor device and a test apparatus for performing an electrical test of the semiconductor device and includes a flexible bare film and a plurality of round-type MEMS bumps on the bare film, each of the MEMS bumps being formed on the bare film by using a MEMS processing technique, having an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, and having a contact surface rounded from an edge side toward a center side in a convex manner in a direction toward the electrode pad or the conductive ball.

Abstract translation: 用于测试插座的微电子机械系统（MEMS）膜布置在半导体器件和用于执行半导体器件的电测试的测试装置之间，并且在裸膜上包括柔性裸片和多个圆形MEMS凸块， 每个MEMS凸块通过使用MEMS处理技术形成在裸膜上，该MEMS处理技术与测试装置的电极焊盘或半导体器件的导电球电接触，并且具有从边缘侧朝向 在朝向电极焊盘或导电球的方向上呈凸形的中心侧。