Abstract:
An image sensor module is presented which includes a semiconductor chip, a holder and a coupling member. The semiconductor chip has a semiconductor chip body; an image sensing section over the semiconductor chip body; and bonding pads on the semiconductor chip body. The holder is mounted over the semiconductor chip and has an insulation section over the semiconductor chip body; connection patterns on the insulation section which are electrically coupled to the bonding pads; and a transparent cover over the image sensing section which is connected to the insulation section. The coupling member is interposed between the holder and the semiconductor chip for coupling together the holder to the semiconductor chip.
Abstract:
The present invention relates to a method of displaying several types of messages all together through a single window and of enabling a user to write and transmit a message with no consideration of message type. This unified message management method displays various types of messages all together along with their respective message types through a single window, converts the type of a written message, if needed, to match it to a protocol determined based on information written in its field distinguishing a message type, and transmits the type-converted message, whereby a user can confirm all types of received messages at a time and user's inconvenience that a message type to write should be distinguished in advance prior to choosing a message input screen can be removed.
Abstract:
Provided are a substrate supporting unit and a substrate treating apparatus using the substrate supporting unit. The substrate supporting unit comprises a base plate and a supporting portion formed on the base plate. The supporting portion comprises two supporting rods and a plurality of supporting members. The two supporting rods extend in a predetermined direction to be separated from each other. The plurality of supporting members is disposed to be separated from each other in the predetermined direction. Each of the supporting members connects the supporting rods.
Abstract:
A mobile communication terminal and a method of restricting harmful information thereof are provided. The mobile communication terminal includes a data judgment module which judges whether to restrict digital content by comparing content information included in a packet of the digital content with viewing restriction information; and a control unit which controls whether to display the digital content in accordance with a result of the judgment of the data judgment module. The method includes receiving digital content that is transmitted in a unit of a packet; judging whether viewing of the digital content is permitted by comparing content information included in the packet with viewing restriction information; and preventing a display of the digital content if it is judged that the viewing of the digital content is not permitted.
Abstract:
The rectangular planar-type ICP (Inductively Coupled Plasma) antenna having a balanced ratio of a magnetic field and an electric potential is capable of improving uniformity of plasma as well as improving a density of plasma. The planar-type ICP antenna includes first and second antenna elements spirally shaped outwards from an end thereof, respectively. The ends of the fist and second antenna elements are interconnected by means of a grounded common terminal. A RF power source is connected to a powered common terminal for connecting first and second powered terminals that are the other ends of the first and second antenna elements. The first and second powered terminals are arranged in peripheral portions of the antenna and the grounded common terminal is arranged in a center portion of the antenna in order to compensate for a drop of plasma ion flux in a region to which power is applied.
Abstract:
A method of forming an isolating region of a semiconductor device including the steps of: forming first insulating layers which vary in width on a substrate; forming trenches which vary in width on the substrate by using the first insulating layers as a mask; forming second insulating layers on the trenches and the first insulating layers; exposing the predetermined portions of the first insulating layers by etching the second insulating layers; and wet-etching the first insulating layers and the non-etched portions of the second insulating layers. In the present invention, an isolating region in the narrow trench is formed without voids by regulating the deposition/etching ratio during the formation of an insulating layer in a trench.
Abstract:
A semiconductor device having a spiral electrode pattern and fabrication method thereof. The device includes an undoped semiconductor substrate, a first and a second probing pads formed on the substrate, and a pair of electrode fingers extending spirally toward a concentric center from the respective first and second probing pads and interdigitated with each other. The method includes the steps of, patterning an insulation layer on a semiconductor substrate in a spiral structure, depositing a metal layer on the substrate including the insulation layer but excluding the sides of the insulation layer, and etching the insulation layer using a wet etching technique.