摘要:
The integrated injection logic semiconductor device comprises an N type semiconductor substrate, a P type semiconductor layer laminated on the N type semiconductor substrate, a first N type region extending through the P type semiconductor layer to reach the N type semiconductor substrate, a P type region formed in the first N type region and having a periphery along the outer periphery of the first N type region and a second N type region formed in the P type semiconductor layer. The integrated injection logic semiconductor device is constituted by a PNP lateral transistor utilizing the P type region, the first N type region and the P type semiconductor layer as the emitter, base and collector electrodes respectively, and a NPN vertical transistor utilizing the N type semiconductor substrate, P type semiconductor layer and the second N type region as the emitter, base and collector electrodes, respectively.
摘要:
A P type semiconductor layer is formed on an N type semiconductor layer by vapour epitaxial growth technique, an insulating film is formed on the P type semiconductor layer and a grid shape first opening is provided through the insulating film. Then, phosphorus is diffused into the P type semiconductor layer through the grid shape opening to form a first N type region extending through the semiconductor layer to reach the N type semiconductor layer. Then, second openings are formed through respective sections of the insulating film divided by and surrounded by the grid shape first opening and boron is diffused through the first and second openings to form first and second P type regions in the grid shape first N type region and the P type semiconductor layer, respectively. Finally, third openings are formed through respective portions of the insulating film and phosphorus is diffused into the P type semiconductor layer through the third openings to form second N type regions thereby forming an integrated injection logic semiconductor device including a lateral PNP transistor and a vertical NPN transistor.
摘要:
A switch unit, which is connected to one or more computers and one or more storage systems, comprises an update function for updating transfer management information (a routing table, for example). The storage system has a function for adding a virtual port to a physical port. The storage system migrates the virtual port addition destination from a first physical port to a second physical port and transmits a request of a predetermined type which includes identification information on the virtual port of the migration target to the switch unit. The transfer management information is updated by the update function of the switch unit so that the transfer destination which corresponds with the migration target virtual port is the switch port connected to the second physical port.
摘要:
One code (a compressed redundant code) is created based on a plurality of first redundant codes, each created on the basis of a plurality of data units, and this compressed redundant code is written to a nonvolatile storage area. This compressed redundant code is used to restore either a data element constituting a multiple-failure data, or a first redundant code corresponding to the multiple-failure data, which is stored in an unreadable sub-storage area of a partially failed storage device, and to restore the data element constituting the multiple-failure data which is stored in a sub-storage area of a completely failed storage device, based on the restored either data element or first redundant code, and either another data element constituting the multiple-failure data or the first redundant code corresponding to the multiple-failure data.
摘要:
A semiconductor integrated device (CBi-CMOS) is disclosed wherein both CMOS transistors and a vertical npn and pnp transistor are formed in a single semiconductor substrate and a latch up phenomenon in the CMOS is prevented. A method of manufacturing the CBi-CMOS is also disclosed. In the CBi-CMOS, four elements, that is, an n-MOSFET, a p-MOSFET and npn and pnp vertical transistors are formed in an n-type epitaxial silicon layer formed on a p-type silicon substrate. The n-MOSFET is formed in a p-well which has a p.sup.+ -type buried region. In the element region of the p-MOSFET, an n.sup.+ -type buried region is also formed. In the element regions of the npn and pnp vertical transistors, a first p.sup.+ -type isolation diffusion region is selectively formed. An n.sup.+ -type buried region is selectively formed in both of these element region of the npn and pnp vertical transistors. In the element region of the npn transistor, the vertical npn transistor is formed using the n-type region surrounded by the first p.sup.+ -type isolation diffusion region as a collector. In the element region of the pnp transistor, a p.sup.+ -type buried region is formed on the n.sup.+ -type buried region, and the vertical pnp transistor is formed using the p.sup.+ -type buried region as a collector. In this case, a second p.sup.+ -type isolation diffusion region is formed to isolate an n-type base region of the vertical pnp transistor.