摘要:
The integrated injection logic semiconductor device comprises an N type semiconductor substrate, a P type semiconductor layer laminated on the N type semiconductor substrate, a first N type region extending through the P type semiconductor layer to reach the N type semiconductor substrate, a P type region formed in the first N type region and having a periphery along the outer periphery of the first N type region and a second N type region formed in the P type semiconductor layer. The integrated injection logic semiconductor device is constituted by a PNP lateral transistor utilizing the P type region, the first N type region and the P type semiconductor layer as the emitter, base and collector electrodes respectively, and a NPN vertical transistor utilizing the N type semiconductor substrate, P type semiconductor layer and the second N type region as the emitter, base and collector electrodes, respectively.
摘要:
A P type semiconductor layer is formed on an N type semiconductor layer by vapour epitaxial growth technique, an insulating film is formed on the P type semiconductor layer and a grid shape first opening is provided through the insulating film. Then, phosphorus is diffused into the P type semiconductor layer through the grid shape opening to form a first N type region extending through the semiconductor layer to reach the N type semiconductor layer. Then, second openings are formed through respective sections of the insulating film divided by and surrounded by the grid shape first opening and boron is diffused through the first and second openings to form first and second P type regions in the grid shape first N type region and the P type semiconductor layer, respectively. Finally, third openings are formed through respective portions of the insulating film and phosphorus is diffused into the P type semiconductor layer through the third openings to form second N type regions thereby forming an integrated injection logic semiconductor device including a lateral PNP transistor and a vertical NPN transistor.
摘要:
A P type semiconductor layer is formed on an N type semiconductor layer by vapor epitaxial growth technique, an insulating film is formed on the P type semiconductor layer and a grid shape first opening is provided through the insulating film. Then, phosphorus is diffused into the P type semiconductor layer through the grid shape opening to form a first N type region extending through the semiconductor layer to reach the N type semiconductor layer. Then, second openings are formed through respective sections of the insulating film divided by and surrounded by the grid shape first opening and boron is diffused through the first and second openings to form first and second P type regions in the grid shape first N type region and the P type semiconductor layer, respectively. Finally, third openings are formed through respective portions of the insulating film and phosphorus is diffused into the P type semiconductor layer through the third openings to form second N type regions thereby forming an integrated injection logic semiconductor device including a lateral PNP transistor and a vertical NPN transistor.
摘要:
A P type semiconductor layer is formed on an N type semiconductor layer by vapor epitaxial growth technique, an insulating film is formed on the P type semiconductor layer and a grid shape first opening is provided through the insulating film. Then, phosphorus is diffused into the P type semiconductor layer through the grid shape opening to form a first N type region extending through the semiconductor layer to reach the N type semiconductor layer. Then, second openings are formed through respective sections of the insulating film divided by and surrounded by the grid shape first opening and boron is diffused through the first and second openings to form first and second P type regions in the grid shape first N type region and the P type semiconductor layer, respectively. Finally, third openings are formed through respective portions of the insulating film and phosphorus is diffused into the P type semiconductor layer through the third openings to form second N type regions thereby forming an integrated injection logic semiconductor device including a lateral PNP transistor and a vertical NPN transistor.
摘要:
An integrated injection logic semiconductor device is composed of an N type semiconductor substrate, a P type layer, a first N type region so formed as to penetrate through the P type semiconductor layer and contact the N type semiconductor substrate, a second N type region formed in the P type semiconductor layer, and a P type region formed in the first N type region. A third N type region is provided surrounding said first and second N type regions and penetrating through the P type semiconductor layer. I.sup.2 L circuit is composed of a lateral PNP transistor whose emitter, base and collector are constituted by said P type region, said first N type region and said P type semiconductor layer, respectively, and a vertical NPN transistor whose emitter, base and collector are constituted by said N type semiconductor substrate, said P type semiconductor layer and said second N type region, respectively.
摘要:
An integrated injection logic semiconductor device comprises an N type semiconductor substrate, a P type semiconductor layer laminated on said semiconductor substrate, and N type first region formed in a manner penetrating through said P type semiconductor layer to reach said N type semiconductor substrate, a first P type region formed in said first N type region, a second N type regionformed in said P type semiconductor layer, and a second P type region formed between said second N type region and said N type semiconductor substrate in a manner connected directly to said N type semiconductor substrate. An integrated injection logic circuit is comprised of a lateral NPN transistor whose emitter, base and collector are constituted by said first P type region, first N type region and P type semiconductor layer, respectively, and a vertical PNP transistor whose emitter, base and collector are constituted by said N type semiconductor substrate, P type semiconductor layer plus second P type region, and second N type region, respectively.
摘要:
An integrated injection logic semiconductor device which comprises an N type semiconductor substrate; a P type semiconductor layer superposed on the N type semiconductor substrate; a first N type region formed in the P type semiconductor layer; a second N type region formed in the P type semiconductor layer; and a P type region formed in the first N type region, wherein the first N type region is connected to the N type semiconductor substrate through an N type connector region formed between the first N type region and N type semiconductor substrate.
摘要:
A measuring apparatus comprises: a first series circuit having first and second resistors connected between a power source terminal and ground; a second series circuit having a thermistor and a third resistor connected between the power source and ground; a first variable frequency oscillator for generating a pulse signal with the frequency corresponding to the current derived from the junction between the first and second resistors of the first series circuit; a second variable frequency oscillator for generating a pulse signal with the frequency corresponding to the current derived from the junction between the thermistor and the third resistor; a first counter which counts the pulse signal from the second variable frequency oscillator to produce a high level signal till it counts a given number of pulses; and AND gate connected to the output terminal of the first variable frequency oscillator and the first counter, a second counter for counting the pulse fed from the first variable frequency oscillator via the AND gate; and a display circuit for displaying the contents of the counter. The first and second variable oscillating circuits each have an odd number of inverters which are cascade-connected and each formed of an integrated injection logic circuit with a power receiving terminal connected to the first or second series circuit, the output terminal of the last stage inverter being connected to the input terminal of the first stage inverter.
摘要:
A gate circuit is constituted by a plurality of logical elements formed on the same P type semiconductor substrate. Each logical element is composed of an N type first region and P type second region formed by double diffusion in one of a plurality of P type isolated islands formed on a P type semiconductor substrate, and an N type isolating region and N type buried region surrounding the islands. The P type second region, N type first region and P type island constitute a first vertical PNP transistor by operating as an emitter, base and collector, respectively, while the N type first region, P type island and N type buried region constitute a second vertical NPN transistor by operating as an emitter, base and collector, respectively. In the plurality of logical elements, a Schottky diode is provided for each input section thereof. Connected to a connection point between an anode of this Schottky diode and a base of the second vertical NPN transistor of one logical element is a collector of that of another logical element. A collector of the second NPN transistor of one logical element constitutes an output section.
摘要:
A semiconductor R-S flip-flop circuit comprises first and second input terminals, first and second output terminals, a first integrated injection logic unit consisting of a first transistor acting as a switching element and a second transistor acting as an injector, and a second integrated injection logic unit consisting of a third transistor acting as a switching element and a fourth transistor acting as an injector. The R-S flip-flop circuit further includes a first diode having a cathode connected to the first input terminal and an anode connected to the base of the first transistor, a second diode having a cathode connected to the second input terminal and an anode connected to the base of the third transistor, a third diode having an anode connected to the base of the first transistor and a cathode connected to the collector of the third transistor, and a fourth diode having an anode connected to the base of the third transistor and a cathode connected to the collector of the first transistor.