公开(公告)号：US09210808B2

公开(公告)日：2015-12-08

申请号：US13616348

申请日：2012-09-14

Applicant: Kentaro Kaneko ,  Toshimitsu Omiya ,  Kotaro Kodani ,  Junichi Nakamura ,  Kazuhiro Kobayashi

Inventor： Kentaro Kaneko ,  Toshimitsu Omiya ,  Kotaro Kodani ,  Junichi Nakamura ,  Kazuhiro Kobayashi

IPC: H05K1/11 ,  H05K3/46 ,  H01L23/00 ,  H01L23/544 ,  H01L21/683 ,  H01L23/13 ,  H01L23/498 ,  H01L21/48

CPC classification number: H05K3/188 ,  C25D5/022 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/544 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/0017 ,  H05K3/46 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/06 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height.

Abstract translation: 布线基板包括绝缘层，埋置在绝缘层中的连接焊盘，该连接焊盘处于连接焊盘的上表面从绝缘层的上表面露出的状态以及下表面和侧表面的至少一部分 所述连接焊盘与所述绝缘层接触，以及形成在所述绝缘层中的所述连接焊盘的外周部分的凹陷高度差部分，其中所述连接焊盘的上表面和所述绝缘层的上表面被布置在 相同的高度

公开(公告)号：US08922304B2

公开(公告)日：2014-12-30

申请号：US13280734

申请日：2011-10-25

Applicant: Kazunari Kimura ,  Junichi Nakamura ,  Takeshi Kijima ,  Isao Abe ,  Takahiro Suzuki ,  Toshiaki Araki

Inventor： Kazunari Kimura ,  Junichi Nakamura ,  Takeshi Kijima ,  Isao Abe ,  Takahiro Suzuki ,  Toshiaki Araki

IPC: H01P1/203 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4061 ,  H01P1/20345 ,  H05K3/4629 ,  Y10T29/49165

Abstract: A laminated electronic device comprises two or more wiring layers including a first wiring layer and a second wiring layer, an insulating layer interposed between the first wiring layer and second wiring layer, and a through conductor extending through the insulating layer for electrically connecting a first conductor disposed on the first wiring layer to a second conductor disposed on the second wiring layer. The through conductor includes divergent sections at both ends, which have a diameter gradually increased toward the first conductor or second conductor.

Abstract translation: 层叠电子器件包括两个或更多个布线层，包括第一布线层和第二布线层，插入在第一布线层和第二布线层之间的绝缘层，以及穿过绝缘层的贯通导体，用于将第一布线 布置在第一布线层上的布置在第二布线层上的第二导体。 贯通导体包括两端的发散部分，其具有朝向第一导体或第二导体逐渐增加的直径。

公开(公告)号：US08797757B2

公开(公告)日：2014-08-05

申请号：US13344864

申请日：2012-01-06

Applicant: Kentaro Kaneko ,  Toshiaki Aoki ,  Kazuhiro Kobayashi ,  Kotaro Kodani ,  Junichi Nakamura

Inventor： Kentaro Kaneko ,  Toshiaki Aoki ,  Kazuhiro Kobayashi ,  Kotaro Kodani ,  Junichi Nakamura

IPC: H05K7/12 ,  H05K1/11 ,  H05K1/16

CPC classification number: H05K1/113 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H05K3/4682 ,  H05K2203/0152 ,  H05K2203/016 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A wiring substrate includes plural insulating layers including an outermost insulating layer; and plural wiring layers which are alternately laminated between the insulating layers and include outermost wiring layers exposed from the outermost insulating layer and through wirings having electrode pads on end portions of the through wirings and penetrating through the outermost insulating layer, wherein the electrode pads of the through wirings are exposed from the outermost insulating layer, and a part of the outermost wiring layers overlaps the end portions of the through wirings and is connected to the through wirings.

Abstract translation: 布线基板包括包括最外绝缘层的多个绝缘层; 以及多个布线层，交替层叠在绝缘层之间，并且包括从最外层绝缘层露出的最外面的布线层，并且穿过在通孔布线的端部上穿过最外层绝缘层的电极焊盘的布线，其中， 通过布线从最外侧绝缘层露出，并且最外面的布线层的一部分与贯通配线的端部重叠，并与贯通布线连接。

公开(公告)号：US08735478B2

公开(公告)日：2014-05-27

申请号：US13376546

申请日：2010-06-08

Applicant: Shinsuke Haraguchi ,  Motomi Tanaka ,  Junichi Nakamura ,  Daisuke Natsui

Inventor： Shinsuke Haraguchi ,  Motomi Tanaka ,  Junichi Nakamura ,  Daisuke Natsui

IPC: C08K5/06 ,  C08L37/00

CPC classification number: C09D5/024 ,  C08F220/14 ,  C08F265/06 ,  C08F283/124 ,  C08K3/36 ,  C09D7/61 ,  C09D7/63 ,  C09D7/67 ,  C09D133/12 ,  C08F2220/1825 ,  C08F2220/1858 ,  C08F2220/325 ,  C08F2220/1808 ,  C08F220/58 ,  C08F220/06 ,  C08F222/1006 ,  C08F236/22 ,  C08F220/18 ,  C08F220/32

Abstract: The present invention relates to an aqueous coating material containing polymer (I), colloidal silica (II), and nonionic surfactant (III) with an HLB value of 16 or more. The polymer (I) is obtained by copolymerization of monomer mixture (M) that contains 0.2 to 10% by mass of monomer (a) having two or more radically polymerizable groups. The solid content of the colloidal silica (II) is 0.1 to 20 parts by mass with respect to 100 parts by mass of the polymer (I). The content of the nonionic surfactant (III) is 0.01 to 10 parts by mass with respect to 100 parts by mass of the polymer (I). The present invention also relates to a painted article where the aqueous coating material is applied. Therefore, an aqueous coating material and a painted article capable of expressing stain resistance and weather resistance can be provided by reducing a water contact angle.

Abstract translation: 本发明涉及含有HLB值为16以上的聚合物（I），胶体二氧化硅（II）和非离子表面活性剂（III））的水性涂料。 聚合物（I）通过含有0.2〜10质量％的具有两个以上自由基聚合性基团的单体（a）的单体混合物（M）的共聚而得到。 胶体二氧化硅（II）的固体成分相对于聚合物（I）100质量份为0.1〜20质量份。 相对于聚合物（I）100质量份，非离子性表面活性剂（III）的含量为0.01〜10质量份。 本发明还涉及涂覆有水性涂料的涂漆制品。 因此，可以通过降低水接触角来提供能够表现耐污染性和耐候性的水性涂料和涂漆制品。

公开(公告)号：US08530351B2

公开(公告)日：2013-09-10

申请号：US12905540

申请日：2010-10-15

Applicant: Junichi Nakamura

Inventor： Junichi Nakamura

IPC: H01L21/44

CPC classification number: H05K3/4007 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15159 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09481 ,  H05K2203/1536 ,  H01L2224/05552

Abstract: A semiconductor package and a fabrication method thereof are disclosed, whereby an environmental problem is solved by using external connection terminals or semiconductor element-mounting terminals containing a smaller amount of lead, while at the same time achieving a fine pitch of the terminals. The semiconductor package includes a board (20) including a plurality of insulating resin layers, semiconductor element-mounting terminals (18) formed on the uppermost surface of the board, and external connection terminals (12) formed on the bottom surface thereof. Each external connection terminal (12) is formed as a bump projected downward from the bottom surface of the package, and each bump is filled with the insulating resin (14) while the surface thereof is covered by a metal (16). Wiring (24), (26) including a conductor via (26a) electrically connect the metal of the metal layer 16 and the semiconductor element-mounting terminals (18).

Abstract translation: 公开了一种半导体封装及其制造方法，通过使用包含较少量的引线的外部连接端子或半导体元件安装端子，同时实现端子的精细间距来解决环境问题。 半导体封装包括：多个绝缘树脂层的基板（20），形成在基板的最上表面的半导体元件安装端子（18），以及形成在其底面上的外部连接端子（12）。 每个外部连接端子（12）形成为从封装的底表面向下突出的凸起，并且每个凸起都填充有绝缘树脂（14），同时其表面被金属（16）覆盖。 包括导体通孔（26a）的布线（24），（26）将金属层16的金属与半导体元件安装端子（18）电连接。

公开(公告)号：US08476536B2

公开(公告)日：2013-07-02

申请号：US11987617

申请日：2007-12-03

Applicant: Kentaro Kaneko ,  Kotaro Kodani ,  Junichi Nakamura ,  Kazuhiro Kobayashi

Inventor： Kentaro Kaneko ,  Kotaro Kodani ,  Junichi Nakamura ,  Kazuhiro Kobayashi

IPC: H05K1/11

CPC classification number: H05K1/113 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2924/0002 ,  H05K3/108 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/0341 ,  H05K2201/09563 ,  H05K2201/096 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A wiring substrate has pads formed from a plurality of metal layers and vias connected to the pads. The plurality of metal layers have a metal layer exposed through the wiring substrate, and a first metal layer which is interposed between the metal layer and the vias and which prevents diffusion of metal included in the vias into the metal layer. A second metal layer which is less subject to oxidation than the first metal layer is provided between the vias and the first metal layer, and the vias are connected to the second metal layer.

Abstract translation: 布线基板具有由多个金属层形成的焊盘和连接到焊盘的通孔。 多个金属层具有通过布线基板露出的金属层，以及介于金属层和通孔之间的第一金属层，并且防止通孔中包含的金属扩散到金属层中。 在通孔和第一金属层之间设置有比第一金属层更少受到氧化的第二金属层，并且通孔连接到第二金属层。

公开(公告)号：US08447867B2

公开(公告)日：2013-05-21

申请号：US13006124

申请日：2011-01-13

Applicant: Junichi Nakamura ,  Hideki Sato

Inventor： Junichi Nakamura ,  Hideki Sato

IPC: G06F15/16 ,  H04N7/16

CPC classification number: H04N5/775 ,  H04L65/4092 ,  H04N5/765 ,  H04N5/781 ,  H04N5/907 ,  H04N21/4122 ,  H04N21/4135 ,  H04N21/42204 ,  H04N21/4325 ,  H04N21/4334 ,  H04N21/43615 ,  H04N21/47 ,  H04N21/482

Abstract: A content display-playback system includes at least one server that distributes audio-visual content via streaming, and at least one client that plays back, by streaming, the content distributed via streaming from the server, and the server and client are connected. The client beforehand makes settings regarding a client operation to be performed for submitting a streaming distribution request to the server to perform playback by streaming.

Abstract translation: 内容显示回放系统包括至少一个通过流媒体分发视听内容的服务器，以及至少一个客户端，通过流式传输从服务器流传送的内容，以及服务器和客户端的连接。 客户端预先进行关于客户端操作的设置，以便向服务器提交流分发请求以通过流式传输进行播放。

公开(公告)号：US08404604B2

公开(公告)日：2013-03-26

申请号：US12866559

申请日：2009-02-09

Applicant: Tatsuo Hidaka ,  Junichi Nakamura ,  Yoshitaka Mayumi ,  Hidekazu Hashima ,  Kohei Fukumi ,  Naoyuki Kitamura ,  Junji Nishii

Inventor： Tatsuo Hidaka ,  Junichi Nakamura ,  Yoshitaka Mayumi ,  Hidekazu Hashima ,  Kohei Fukumi ,  Naoyuki Kitamura ,  Junji Nishii

IPC: C03C3/247 ,  C03C3/19

CPC classification number: C03C3/16 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C3/247 ,  C03C3/253 ,  G02B1/00 ,  G02B3/04

Abstract: A P2O5—BaO—ZnO—Nb2O5 type optical glass contains 25-50 wt. % P2O5, 15-35 wt. % BaO, 1-25 wt. ZnO, and 3-10 wt. % Nb2O5. The optical glass has a high refractive index (particularly preferably the refractive index nd of 1.6 or more), low dispersion (an Abbe number υd of 42 or more), a low deformation point, and improved resistance to devitrification upon molding, and is suitable for precision-mold press molding or other molding processes and also suitable for transfer of a fine structure.

Abstract translation: P2O5-BaO-ZnO-Nb2O5型光学玻璃含有25〜50wt。 ％P 2 O 5，15-35wt。 ％BaO，1-25wt。 ZnO和3-10wt。 ％Nb2O5。 光学玻璃具有高折射率（特别优选折射率nd为1.6以上），低色散（阿贝数为42以上），低变形点，成型时耐失透性提高，适合 用于精密模压成型或其它成型工艺，也适用于精细结构的转印。

公开(公告)号：US08153902B2

公开(公告)日：2012-04-10

申请号：US12627096

申请日：2009-11-30

Applicant: Junichi Nakamura ,  Kotaro Kodani ,  Michiro Ogawa

Inventor： Junichi Nakamura ,  Kotaro Kodani ,  Michiro Ogawa

IPC: H05K1/00

CPC classification number: H01L23/49544 ,  H01L23/49822 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0271 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/4682 ,  H05K2201/09136 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/2009 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A wiring board includes a wiring forming region in which a plurality of wiring layers are stacked while sandwiching insulating layers, an outer periphery region which is arranged around the wiring forming region and in which a reinforcing pattern is formed in the same layer as each of the wiring layers. An area ratio of the reinforcing pattern to the outer periphery region and an area ratio of the wiring layer to the wiring forming region are substantially the same in each of the layers, and the reinforcing patterns exist without a gap in the outer periphery region when the wiring board is viewed in planar perspective.

Abstract translation: 布线基板包括布线形成区域，其中堆叠多个布线层，同时夹着绝缘层;外周区域布置在布线形成区域周围，并且其中加强图案形成在与每个布线形成区域相同的层中 接线层。 增强图案与外周区域的面积比和布线层与布线形成区域的面积比在各层中基本相同，并且当外围区域中没有间隙时，增强图案在外周区域中不存在间隙 接线板以平面视角观看。

公开(公告)号：US20120057725A1

公开(公告)日：2012-03-08

申请号：US13218864

申请日：2011-08-26

Applicant: Junichi Nakamura

Inventor： Junichi Nakamura

IPC: H03G3/00

CPC classification number: H04H60/04 ,  H04R27/00 ,  H04R29/008 ,  H04R2227/005 ,  H04R2430/01 ,  H04S7/40

Abstract: A control terminal apparatus includes a transmission unit transmitting a control signal to audio output apparatuses, a display unit, an operation detector detecting an operation associated with display content, and a controller displaying individual volume setting sections which correspond to the audio output apparatuses and which include operation members performing variable operations of volume settings while volume setting states are displayed, displaying a master volume setting section including an operation member performing collective variable operation while the volume balance of the audio output apparatuses is maintained, executing clear display of a setting changeable range in which the volume balance is maintained in the master volume setting section, generating, when the operation detector detects an operation performed on one of the individual volume setting sections or the master volume setting section, a control signal corresponding to content of the operation, and causing the transmission unit to transmit the control signal.

Abstract translation: 一种控制终端装置，包括向音频输出设备发送控制信号的发送单元，显示单元，检测与显示内容相关联的操作的操作检测器，以及显示与音频输出设备相对应的各个音量设置部分的控制器， 操作部件在显示音量设定状态的同时进行音量设定的可变动作，显示主音量设定部，包括在保持音频输出装置的音量平衡的同时执行集合可变动作的操作部件，执行清晰显示设定可变范围 在主体积设定部中保持体积平衡，当操作检测器检测到对各个体积设定部或主体设定部中的一个进行的动作时，生成与动作的内容对应的控制信号， g发送单元发送控制信号。