公开(公告)号：USD876430S1

公开(公告)日：2020-02-25

申请号：US29644716

申请日：2018-04-19

Applicant: Shu-Hung Lin ,  Wang-Hung Yeh ,  Hsin-Chieh Fang ,  Chun-Wen Wang

Designer： Shu-Hung Lin ,  Wang-Hung Yeh ,  Hsin-Chieh Fang ,  Chun-Wen Wang

公开(公告)号：US20190155338A1

公开(公告)日：2019-05-23

申请号：US16177429

申请日：2018-11-01

Applicant: Shu-Hung Lin ,  Wang-Hung Yeh ,  Shih-Chin Chou ,  Hsin-Chieh Fang ,  Ping-Chu Tsai ,  Chun-Wen Wang ,  Che-Hsien Lin

Inventor： Shu-Hung Lin ,  Wang-Hung Yeh ,  Shih-Chin Chou ,  Hsin-Chieh Fang ,  Ping-Chu Tsai ,  Chun-Wen Wang ,  Che-Hsien Lin

IPC: G06F1/16

Abstract: A linkage mechanism including a base, at least one first linking rod, a first linkage member and a driving member is provided. Each of the at least one first linking rod includes a first pivot portion and a second pivot portion. Each of the first linking rod is pivoted to the base via the first pivot portion. The first linking member includes a first engaged portion and a first groove along a first direction. Each of the first linking rod is pivoted in the first groove of the first linkage member via the second pivot portion. The first linking rod is connected to the driving member. When the driving member is located at an unlocked position, the first engaged portion is retracted inside the base. When the driving member is moved from the unlocked position to a locked position, the first linking rod is driven by the driving member, so that the first linkage member is moved along a second direction, and the first engaged portion protrudes from the base. An electronic device is further provided.

公开(公告)号：US09653660B1

公开(公告)日：2017-05-16

申请号：US15197797

申请日：2016-06-30

Applicant: Shu-Hung Lin

Inventor： Shu-Hung Lin

IPC: H01L33/52 ,  H01L33/48 ,  H01L21/56 ,  H01L23/31 ,  H01L21/78

CPC classification number: H01L33/52 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3185 ,  H01L33/48 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L2933/0033 ,  H01L2933/005

Abstract: A chip scale LED packaging method includes the following steps: clamping an upper mold with a plurality of through holes and a plate-shaped lower mold together; allowing bottoms of the plurality of through holes of the upper mold to be sealed by the plate-shaped lower mold to form a pattern of a plurality of grooves; placing chips one by one in corresponding through holes of the plurality of through holes; pouring encapsulation gel into each of the corresponding through holes; separating the upper mold from the plate-shaped lower mold after the encapsulation gel is cured and molded; and separating each cured and molded encapsulation gel from each of the corresponding through holes of the upper mold and taking each cured and molded encapsulation gel out of the upper mold to obtain an individual chip scale LED package.

公开(公告)号：US20050052636A1

公开(公告)日：2005-03-10

申请号：US10927983

申请日：2004-08-27

Applicant: Chieh-Jen Lee ,  Shu-Hung Lin

Inventor： Chieh-Jen Lee ,  Shu-Hung Lin

IPC: G01B11/02 ,  G01C3/08 ,  G01S7/481 ,  G01S17/02 ,  H01J35/30

CPC classification number: G01S7/4813 ,  G01S17/023

Abstract: An optical range finder measuring distance to a target and capturing the image of the target simultaneously is provided. The optical range finder includes an emitting system emitting a pulse toward the target and a receiving system receiving the pulse reflected from the target, to calculate the distance there between. The emitting system or the receiving system includes a beam splitter for separating the visible beam of the target from the pulse, and the visible beam of the target is received by an image sensor. Thus, the optical range finder measures the distance and captures the image of the target. Moreover, the optical range finder further includes a display showing the captured image and distance data.

Abstract translation: 测量与目标距离并同时捕获目标图像的光学测距仪。 光学测距仪包括向目标发射脉冲的发射系统和接收从目标反射的脉冲的接收系统，以计算其间的距离。 发射系统或接收系统包括用于将目标的可见光束与脉冲分离的分束器，并且目标的可见光束被图像传感器接收。 因此，光学测距仪测量距离并捕获目标的图像。 此外，光学测距器还包括显示捕获图像和距离数据的显示器。