公开(公告)号：US10212862B2

公开(公告)日：2019-02-19

申请号：US15195213

申请日：2016-06-28

Applicant: ABB Schweiz AG

Inventor： Bruno Agostini ,  Daniele Torresin ,  Francesco Agostini ,  Gernot Riedel ,  Mathieu Habert

IPC: H05K7/20 ,  F28D15/02 ,  F28D15/04 ,  F28F21/08 ,  H01L23/373 ,  H01L23/427 ,  B23P15/26 ,  F28D21/00

Abstract: This invention relates to a cooling apparatus comprising a base plate, an evaporator and a condenser. In order to obtain a simple and efficient cooling apparatus the evaporator is a porous aluminum evaporator having a capillary structure with pores and a plurality of larger sized evaporator channels extending through the evaporator between a second end and the first end of the evaporator. A compensation chamber extending along a second surface of the evaporator receives first fluid from the condenser such that pores opening up into the second surface of the evaporator are provided with first fluid.

公开(公告)号：US20170301607A1

公开(公告)日：2017-10-19

申请号：US15485676

申请日：2017-04-12

Applicant: ABB Schweiz AG

Inventor： Bruno Agostini ,  Daniele Torresin ,  Francesco Agostini ,  Mathieu Habert ,  Munaf Rahimo

IPC: H01L23/427 ,  H01L29/78 ,  H01L29/739 ,  H05K7/20 ,  H01L29/16

CPC classification number: H01L23/427 ,  F25B25/005 ,  H01L23/473 ,  H01L29/1608 ,  H01L29/2003 ,  H01L29/22 ,  H01L29/7393 ,  H01L29/78 ,  H05K7/20936

Abstract: A power device comprises at least one power semiconductor module comprising a wide bandgap semiconductor element; and a cooling system for actively cooling the wide bandgap semiconductor element with a cooling medium, wherein the cooling system comprises a refrigeration device for lowering a temperature of the cooling medium below an ambient temperature of the power device; wherein the cooling system is adapted for lowering the temperature of the cooling medium in such a way that a temperature of the wide bandgap semiconductor element is below 100° C.

公开(公告)号：US20170202108A1

公开(公告)日：2017-07-13

申请号：US15401630

申请日：2017-01-09

Applicant: ABB Schweiz AG

Inventor： Daniele Torresin ,  Bruno Agostini ,  Francesco Agostini ,  Thomas Gradinger ,  Mathieu Habert

IPC: H05K7/20 ,  F28F1/02

CPC classification number: H05K7/20309 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/022 ,  F28F13/00 ,  F28F2270/00 ,  F28F2275/02 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20336 ,  H05K7/20936

Abstract: It is proposed a two-phase heat exchanger device for a power-electronic module arrangement having a semiconductor module. The two-phase heat exchanger device includes a base plate configured for being in contact with a first semiconductor module at a first side of the base plate; and at least one tube element for a first cooling medium including a first portion having at least one evaporator channel and a second portion having at least one condenser channel. The base plate has a groove containing the tube element, wherein the groove is dimensioned for enabling thermal contact between the base plate and the first portion of the tube element and dimensioned to form a gap between the base plate and the second portion of the tube element for thermal separation of the base plate and the second portion of the tube element.

公开(公告)号：US20170094843A1

公开(公告)日：2017-03-30

申请号：US15275428

申请日：2016-09-25

Applicant: ABB Schweiz AG

Inventor： Francesco Agostini ,  Daniele Torresin ,  Mathieu Habert ,  Bruno Agostini

IPC: H05K7/20 ,  F28F13/10

CPC classification number: H05K7/20936 ,  F28D15/025 ,  F28D15/0266 ,  F28D15/0275 ,  F28F9/0278 ,  F28F13/10 ,  H05K7/209

Abstract: A cooling device for cooling at least two power electronic devices by a working fluid. The cooling device has a heat receiver portion of the Pulsating Heat Pipe circuit system and a pair of thermo-conducting walls provided on mutually opposite sides of the heat receiver arrangement and sandwiching the heat receiver portion between them. These walls are adapted for being thermally connected to a respective one of the power electronic devices. The cooling device further has a heat dissipator arrangement with a heat dissipator portion of the Pulsating Heat Pipe circuit system and a plurality of fins thermally coupled to the heat dissipator portion for transferring heat from the heat dissipator portion to an external cooling fluid for cooling the working fluid in the heat dissipator portion. The Pulsating Heat Pipe circuit system connects the heat receiver portion with the heat dissipator portion for transferring heat from the heat receiver portion to the heat dissipator portion by the Pulsating Heat Pipe action of the working fluid.

公开(公告)号：US20240334662A1

公开(公告)日：2024-10-03

申请号：US18612272

申请日：2024-03-21

Applicant: ABB Schweiz AG

Inventor： Daniele Torresin ,  Andrey Petrov ,  Bruno Agostini

IPC: H05K7/20

CPC classification number: H05K7/20936 ,  H05K7/20318

Abstract: A vapor chamber for cooling a heat source is provided. The vapor chamber includes a cavity between a baseplate and a condenser wall, the cavity containing a cooling medium, wherein the baseplate has an evaporator side towards the cavity and an attachment side opposite to the evaporator side for attaching the heat source, wherein the baseplate is adapted for transferring heat from the attachment side to the cavity, such that cooling medium evaporates at the evaporator side and condenses at the condenser wall, and wherein the vapor chamber further includes a channel, which is at least partially connected to the baseplate, with an inlet below a liquid level of the cooling medium and an outlet above the liquid level and which provides a bubble pump for transporting the liquid medium from the inlet to the outlet.

公开(公告)号：US11197392B2

公开(公告)日：2021-12-07

申请号：US16834600

申请日：2020-03-30

Applicant: ABB Schweiz AG

Inventor： Bruno Agostini ,  Daniele Torresin ,  Matteo Bortolato

IPC: B23K26/21 ,  H05K7/20 ,  F28D15/02 ,  B23P15/26

Abstract: The invention relates to a method which is suited for manufacturing a 3D-vapor chamber in a defined and efficient manner. Especially, the present method provides a solution for providing a vapor chamber having an evaporator and a condenser made from a first part and a second part, wherein continuity of internal structures is given which in turn provides an efficient working behaviour of the vapor chamber.

公开(公告)号：US10748682B2

公开(公告)日：2020-08-18

申请号：US15610420

申请日：2017-05-31

Applicant: ABB Schweiz AG

Inventor： Colin Tschida ,  Pietro Cairoli ,  Francesco Agostini ,  Daniele Torresin ,  Davide Leoni ,  Luca Raciti ,  Zhiguo Pan

IPC: H01C7/12 ,  H01C1/02 ,  H01L23/46 ,  H01B17/54 ,  H03K17/082 ,  H02H9/04 ,  H01H9/52 ,  H01H9/54

Abstract: A surge arrester system includes a surge arrester, and an active cooling system having a cooling interface in contact with the surge arrester and operative to transfer heat from the surge arrester. The active cooling system includes a forced convection apparatus operative to provide forced convection cooling. A circuit breaker system includes a power semiconductor switch and an active cooling system constructed to cool the power semiconductor switch. The active cooling system includes a forced convection apparatus configured to provide forced convection cooling. The power semiconductor switch is in contact with the active cooling system. A surge arrester is disposed adjacent to and in contact with the active cooling system. The active cooling system includes a cooling interface constructed for contact with the surge arrester and operative to provide cooling to the surge arrester. The power semiconductor switch and the surge arrester dissipate power alternatively.

公开(公告)号：US20170082379A1

公开(公告)日：2017-03-23

申请号：US15272137

申请日：2016-09-21

Applicant: ABB Schweiz AG

Inventor： Bruno Agostini ,  Daniele Torresin ,  Francesco Agostini ,  Mathieu Habert ,  Timo Koivuluoma

IPC: F28D15/04 ,  F28F3/02 ,  F28F13/10 ,  F28D15/02

CPC classification number: F28D15/046 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28D15/0283 ,  F28D15/04 ,  F28D2021/0029 ,  F28F3/02 ,  F28F3/025 ,  F28F13/10 ,  F28F2215/06 ,  H01L23/427 ,  H01L23/467

Abstract: A cooling assembly comprising a plurality of fin elements stacked in a stack direction, a plurality of coolant channels each located between adjacent fin elements and extending in a coolant channel direction perpendicular to the stack direction, a first heat transfer surface adapted to be in contact with a heat generating element, and a second heat transfer surface spaced apart from the first heat transfer surface, the plurality of fin elements and the plurality of coolant channels being located between the first heat transfer surface and the second heat transfer surface. Each of the fin elements comprises a pulsating heat pipe embedded therein, a main pulsating direction of each of the pulsating heat pipes being substantially parallel to a normal of the first heat transfer surface.