HEAT-REMOVAL ASSEMBLIES WITH OPPOSING SPRINGS

    公开(公告)号:US20190104608A1

    公开(公告)日:2019-04-04

    申请号:US15865156

    申请日:2018-01-08

    Applicant: Apple Inc.

    Abstract: Heat-removal assemblies with springs on opposing sides of a support structure and methods for using the same are provided. Heat may be removed from a heat-generating assembly of an electronic device by a heat-removal assembly that may include a heat-dissipating subassembly (e.g., a heat spreader and/or a heat pipe) and a fastener subassembly. The fastener subassembly may be configured to press the heat-dissipating subassembly against the heat-generating assembly for enabling the heat-dissipating subassembly to be thermally coupled to the heat-generating assembly for removing heat therefrom. In order for the fastener subassembly to provide an even pressure distribution across the heat-dissipating subassembly for such heat removal and/or to limit deformation of one or more portions of the electronic device during such heat removal, the fastener subassembly may include two springs positioned on opposite sides of a circuit board that may be supporting the heat-generating assembly.

    Internal architecture of a computing device

    公开(公告)号:US11950354B2

    公开(公告)日:2024-04-02

    申请号:US17653634

    申请日:2022-03-04

    Applicant: Apple Inc.

    Abstract: This application relates to a layout of components within an electronic device. The electronic device includes a circuit board and one or more thermal components located on or proximate to each surface of the circuit board. As a result, thermal energy generated by components of the circuit board are drawn away from the circuit board in a more efficient manner. Additionally, the electronic device may include one or more air movers designed to draw ambient air into the electronic device in a manner that causes the ambient air to cool components upstream from the air movers. Further, the electronic device includes a fin stack that is thermally coupled to the aforementioned thermal components, and further receives air driven in by the air mover(s). Also, the electronic device is designed to receive the ambient air through openings that define a 360-degree air inlet.

    RECONFIGURABLE STAND ECOSYSTEM
    26.
    发明申请

    公开(公告)号:US20220325848A1

    公开(公告)日:2022-10-13

    申请号:US17653854

    申请日:2022-03-07

    Applicant: Apple Inc.

    Abstract: Support systems and stands for electronic devices include tilt hinges, lift arms, and their component parts. Some tilt hinges include assemblies for guiding and retaining bars or protrusions into preferred positioning within receiver openings to unify the parts, particularly as they move, and to reduce wobble or slop in the joints. Lift arms provide simplified and low-cost guidance and counterbalance mechanisms for controlling movement of the electronic device relative to the base of a stand. In some cases, the lift arms have sheaths to help protect or cover mechanisms while allowing additional space for the mechanisms within the lift arm. Other interconnection systems hide and protect a connector interface between the stand and the electronic device within a housing until unlocked and the connector is moved into an exposed position. These systems improve efficiency, comfort, ergonomics, accessibility, and user satisfaction of the electronic devices and their supports.

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