公开(公告)号：US20210165399A1

公开(公告)日：2021-06-03

申请号：US17174159

申请日：2021-02-11

Applicant: ASML NETHERLANDS B.V.

Inventor： Sarathi ROY ,  Edo Maria HULSEBOS ,  Roy WERKMAN ,  Junru RUAN

IPC: G05B19/418 ,  G06N3/04 ,  G03F7/20 ,  G05B13/02

Abstract: A method for configuring a semiconductor manufacturing process, the method including: obtaining a first value of a first parameter based on measurements associated with a first operation of a process step in the semiconductor manufacturing process and a first sampling scheme; using a recurrent neural network to determine a predicted value of the first parameter based on the first value; and using the predicted value of the first parameter in configuring a subsequent operation of the process step in the semiconductor manufacturing process.

公开(公告)号：US20200278614A1

公开(公告)日：2020-09-03

申请号：US16762982

申请日：2018-11-09

Applicant: ASML NETHERLANDS B.V.

Inventor： Roy WERKMAN ,  Bijoy RAJASEKHARAN ,  Lydia Marianna VERGAIJ-HUIZER ,  Jochem Sebastiaan WILDENBERG ,  Ronald VAN ITTERSUM ,  Pieter Gerardus Jacobus SMORENBERG ,  Robertus Wilhelmus VAN DER HEIJDEN ,  Xiuhong WEI ,  Hadi YAGUBIZADE

IPC: G03F7/20

Abstract: A method for determining a plurality of corrections for control of at least one manufacturing apparatus used in a manufacturing process for providing product structures to a substrate in a plurality of layers, the method including: determining the plurality of corrections including a correction for each layer, based on an actuation potential of the applicable manufacturing apparatus used in the formation of each layer, wherein the determining includes determining corrections for each layer simultaneously in terms of a matching parameter.

公开(公告)号：US20200026200A1

公开(公告)日：2020-01-23

申请号：US16495119

申请日：2018-03-28

Applicant: ASML NETHERLANDS B.V.

Inventor： Jochem Sebastiaan WILDENBERG ,  Marinus JOCHEMSEN ,  Erik JENSEN ,  Erik Johannes Maria WALLERBOS ,  Cornelis Johannes RIJNIERSE ,  Bijoy RAJASEKHARAN ,  Roy WERKMAN ,  Jurgen Johannes Henerikus Maria SCHOONUS

IPC: G03F7/20

Abstract: A method for optimizing a sequence of processes for manufacturing of product units, includes: associating measurement results of performance parameters (e.g., fingerprints) with the recorded process characteristics (e.g., context); obtaining a characteristic (e.g., context) of a previous process (e.g. deposition) in the sequence already performed on a product unit; obtaining a characteristic (e.g., context) of a subsequent process (e.g., exposure) in the sequence to be performed on the product unit; determining a predicted performance parameter (e.g., fingerprint) of the product unit associated with the sequence of previous and subsequent processes by using the obtained characteristics to retrieve measurement results of the performance parameters (e.g., fingerprints) corresponding to the recorded characteristics; and determining corrections to be applied to future processes (e.g. exposure, etch) in the sequence to be performed on the product unit, based on the determined predicted performance parameter.

公开(公告)号：US20190285992A1

公开(公告)日：2019-09-19

申请号：US16463057

申请日：2017-11-06

Applicant: ASML NETHERLANDS B.V.

Inventor： Richard Johannes Franciscus VAN HAREN ,  Victor Emanuel CALADO ,  Leon Paul VAN DIJK ,  Roy WERKMAN ,  Everhardus Cornelis MOS ,  Jochem Sebastiaan WILDENBERG ,  Marinus JOCHEMSEN ,  Bijoy RAJASEKHARAN ,  Erik JENSEN ,  Adam Jan URBANCZYK

IPC: G03F7/20

Abstract: A method to change an etch parameter of a substrate etching process, the method including: making a first measurement of a first metric associated with a structure on a substrate before being etched; making a second measurement of a second metric associated with a structure on a substrate after being etched; and changing the etch parameter based on a difference between the first measurement and the second measurement.

公开(公告)号：US20190271919A1

公开(公告)日：2019-09-05

申请号：US16461044

申请日：2018-05-23

Applicant: ASML NETHERLANDS B.V.

Inventor： Davit HARUTYUNYAN ,  Fei JIA ,  Frank STAALS ,  Fuming WANG ,  Hugo Thomas LOOIJESTIJN ,  Cornelis Johannes RIJNIERSE ,  Maxim PISARENCO ,  Roy WERKMAN ,  Thomas THEEUWES ,  Tom VAN HEMERT ,  Vahid BASTANI ,  Jochem Sebastian WILDENBERG ,  Everhardus Cornelis MOS ,  Erik Johannes Maria WALLERBOS

IPC: G03F7/20

Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method including: obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.

公开(公告)号：US20180011398A1

公开(公告)日：2018-01-11

申请号：US15546583

申请日：2016-01-20

Applicant: ASML Netherlands B.V.

Inventor： Wim Tjibbo TEL ,  Marinus JOCHEMSEN ,  Frank STAALS ,  Christopher PRENTICE ,  Laurent Michel Marcel DEPRE ,  Johannes Marcus Maria BELTMAN ,  Roy WERKMAN ,  Jochem Sebastiaan WILDENBERG ,  Everhardus Cornelis MOS

IPC: G03F1/70 ,  G03F1/22 ,  G06T7/00

Abstract: A method includes determining topographic information of a substrate for use in a lithographic imaging system, determining or estimating, based on the topographic information, imaging error information for a plurality of points in an image field of the lithographic imaging system, adapting a design for a patterning device based on the imaging error information. In an embodiment, a plurality of locations for metrology targets is optimized based on imaging error information for a plurality of points in an image field of a lithographic imaging system, wherein the optimizing involves minimizing a cost function that describes the imaging error information. In an embodiment, locations are weighted based on differences in imaging requirements across the image field.