MASK DEFECT DETECTION
    1.
    发明申请

    公开(公告)号:US20230046682A1

    公开(公告)日:2023-02-16

    申请号:US17886348

    申请日:2022-08-11

    Abstract: An improved methods and systems for detecting defect(s) on a mask are disclosed. An improved method comprises inspecting an exposed wafer after the wafer was exposed, by a lithography system using a mask, with a selected process condition that is determined based on a mask defect printability under the selected process condition; and identifying, based on the inspection, a wafer defect that is caused by a defect on the mask to enable identification of the defect on the mask.

    METROLOGY DATA CORRECTION USING IMAGE QUALITY METRIC

    公开(公告)号:US20210241449A1

    公开(公告)日:2021-08-05

    申请号:US17268863

    申请日:2019-08-14

    Abstract: A method for correcting metrology data of a patterning process. The method includes obtaining (i) metrology data of a substrate subjected to the patterning process and (ii) a quality metric (e.g., a focus index) that quantifies a quality of the metrology data of the substrate; establishing a correlation between the quality metric and the metrology data; and determining a correction to the metrology data based on the correlation between the quality metric and the metrology data.

    SEMICONDUCTOR DEVICE GEOMETRY METHOD AND SYSTEM

    公开(公告)号:US20220327364A1

    公开(公告)日:2022-10-13

    申请号:US17638472

    申请日:2020-07-31

    Abstract: Systems and methods for predicting substrate geometry associated with a patterning process are described. Input information including geometry information and/or process information for a pattern is received and, using a machine learning prediction model, multi-dimensional output substrate geometry is predicted. The multi-dimensional output information may include pattern probability images. A stochastic edge placement error band and/or a stochastic failure rate may be predicted. The input information can include simulated aerial images, simulated resist images, target substrate dimensions, and/or data from a lithography apparatus associated with device manufacturing. Different aerial images may correspond to different heights in resist layers associated with the patterning process, for example.

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