公开(公告)号：US20210175175A1

公开(公告)日：2021-06-10

申请号：US16706533

申请日：2019-12-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Fu-Chen CHU ,  Hung-Chun KUO ,  Chen-Chao WANG

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/552

Abstract: A semiconductor device package includes a lower-density substrate and a higher-density substrate. The higher-density substrate is attached to the lower-density substrate. The higher-density substrate has a first interconnection layer and a second interconnection layer disposed over the first interconnection layer. A thickness of the first interconnection layer is different from a thickness of the second interconnection layer.

公开(公告)号：US20170256508A1

公开(公告)日：2017-09-07

申请号：US15057673

申请日：2016-03-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Jun ZHUANG ,  Hung-Chun KUO ,  Chun-Chin HUANG

IPC: H01L23/00

CPC classification number: H01L24/06 ,  H01L23/5386 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/03472 ,  H01L2224/06051 ,  H01L2224/06152 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/14051 ,  H01L2224/14131 ,  H01L2224/14134 ,  H01L2224/14136 ,  H01L2224/14151 ,  H01L2224/14156 ,  H01L2224/17106 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81447 ,  H01L2924/15321 ,  H01L2924/381 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor device includes a substrate main body, a plurality of first bump pads, and redistribution layer (RDL). The first bump pads are disposed adjacent to a surface of the substrate main body, each of the first bump pads has a first profile from a top view, the first profile has a first width along a first direction and a second width along a second direction perpendicular to the first direction, and the first width of the first profile is greater than the second width of the first profile. The RDL is disposed adjacent to the surface of the substrate main body, and the RDL includes a first portion disposed between two first bump pads.