公开(公告)号：US12051658B2

公开(公告)日：2024-07-30

申请号：US17829119

申请日：2022-05-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yuan Kung ,  Hung-Yi Lin

IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H01L25/00 ,  H01L25/16

CPC classification number: H01L23/66 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/16 ,  H01L25/16 ,  H01L25/50 ,  H01L23/49816 ,  H01L23/552 ,  H01L2223/6655 ,  H01L2224/16225

Abstract: A semiconductor package structure includes a redistribution structure and an impedance matching device. The redistribution structure includes a first surface, a second surface opposite to the first surface and a circuitless region extending from the first surface to the second surface. The impedance matching device is disposed on the redistribution structure and includes at least one impedance matching circuit aligned with the circuitless region.

公开(公告)号：US20220157709A1

公开(公告)日：2022-05-19

申请号：US16951936

申请日：2020-11-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Chiang Shih ,  Meng-Wei Hsieh ,  Hung-Yi Lin ,  Cheng-Yuan Kung

IPC: H01L23/522 ,  H01L23/00 ,  H01L23/528 ,  H01L23/31 ,  H01L27/08 ,  H01L21/768 ,  H01L21/78

Abstract: A semiconductor package structure and method for manufacturing the same are provided. The semiconductor package structure includes a first electronic component, a conductive pillar, a second electronic component, and a conductive through via. The conductive pillar is disposed on the first electronic component and has a first surface facing away from the first electronic component. The second electronic component is disposed on the first electronic component. The conductive through via extends through the second electronic component and has a first surface facing away from the first electronic component. The first surface of the conductive through via and the first surface of the conductive pillar are substantially coplanar.

公开(公告)号：US11233010B2

公开(公告)日：2022-01-25

申请号：US16732157

申请日：2019-12-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yuan Kung ,  Hung-Yi Lin

IPC: H01L23/538 ,  H01L25/18 ,  H01L25/16 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00

Abstract: An assembly structure includes a core-computing section and a sub-computing section. The core-computing section has a first surface and a second surface opposite to the first surface. The core-computing section includes at least one conductive via electrically connecting the first surface and the second surface. The sub-computing section has a first surface stacked on the first surface of the core-computing section and a second surface opposite to the first surface. The sub-computing section includes at least one conductive via electrically connecting the first surface and the second surface. The assembly structure includes a first signal transmission path and a second signal transmission path. The first signal transmission path is between the at least one conductive via of the sub-computing section and the at least one conductive via of the core-computing section. The second signal transmission path is between the second surface of the sub-computing section and the at least one conductive via of the sub-computing section.