Motion compensation system for under water sonar systems
    21.
    发明申请
    Motion compensation system for under water sonar systems 审中-公开
    水下声纳系统运动补偿系统

    公开(公告)号:US20070022937A1

    公开(公告)日:2007-02-01

    申请号:US11177186

    申请日:2005-07-07

    申请人: George Wallace

    发明人: George Wallace

    IPC分类号: B63G8/22

    CPC分类号: B63G8/24 B63G8/22

    摘要: An underwater buoyancy apparatus for compensating for wave induced vertical and/or horizontal motion, particularly in sonar devices deployed from nautical platform. The underwater buoyancy apparatus is slidably connected along a tether between a nautical platform and an underwater sonar device. The underwater buoyancy apparatus contains a volume of air and/or water which can be changed to thereby alter the underwater buoyancy apparatus's depth in a body of water, in response to vertical and/or horizontal motion the nautical platform.

    摘要翻译: 一种用于补偿波浪引起的垂直和/或水平运动的水下浮力装置,特别是在从航海平台部署的声纳装置中。 水下浮力装置沿着航海平台和水下声呐装置之间的系绳可滑动地连接。 水下浮力装置包含一定量的空气和/或水,可响应于航海平台的垂直和/或水平运动而改变水下浮力装置在水体中的深度。

    Semiconductor Wafer Handler
    27.
    发明申请
    Semiconductor Wafer Handler 审中-公开
    半导体晶片处理器

    公开(公告)号:US20080051018A1

    公开(公告)日:2008-02-28

    申请号:US11856307

    申请日:2007-09-17

    IPC分类号: H01L21/00

    CPC分类号: B24B37/345

    摘要: A semiconductor wafer handler comprises a ring (70) attached to a hub (80) by a plurality of spokes (90). Vacuum is applied to the surface of the semiconductor wafer through orifices (100) containing in the ring (70). Water and/or nitrogen can be applied to the surface of the semiconductor wafer through orifices (110) contained in the spokes (90).

    摘要翻译: 半导体晶片处理器包括通过多个辐条(90)附接到毂(80)的环(70)。 真空通过包含在环(70)中的孔(100)施加到半导体晶片的表面。 可以通过包含在辐条(90)中的孔(110)将水和/或氮施加到半导体晶片的表面。

    Chemical mechanical polishing apparatus and method to minimize slurry accumulation and scratch excursions
    30.
    发明申请
    Chemical mechanical polishing apparatus and method to minimize slurry accumulation and scratch excursions 审中-公开
    化学机械抛光装置和方法,尽可能减少浆料堆积和刮擦偏移

    公开(公告)号:US20050113006A1

    公开(公告)日:2005-05-26

    申请号:US10718921

    申请日:2003-11-21

    IPC分类号: B24B1/00 B24B37/04 B24B53/007

    CPC分类号: B24B53/017

    摘要: A pad cleaning device (210, 220, 250) is used in conjunction with spray rinse water to thoroughly clean a polishing pad (110) of a chemical-mechanical polishing system (100) after a wafer (120) has been polished. A sprayer or sprayer extension (210, 220, 250) is strategically positioned and securely retained on a portion of the dispensing arm (130) and adapted for applying a rinse water spray directly to the center portion (150) of the pad preventing conglomerated slurry from accumulating.

    摘要翻译: 在抛光晶片(120)之后,垫片清洁装置(210,22,250)与喷雾冲洗水结合使用以彻底地清洁化学机械抛光系统(100)的抛光垫(110)。 喷雾器或喷雾器延伸部(210,220,250)被策略性地定位并牢固地保持在分配臂(130)的一部分上,并且适于将冲洗水喷雾直接施加到垫的中心部分(150),防止聚集的浆料 从积累。