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公开(公告)号：US20230378656A1
公开(公告)日：2023-11-23
申请号：US18163091
申请日：2023-02-01
Applicant: Aptiv Technologies Limited
CPC classification number: H01Q13/22 , H01P3/121 , H01P5/107 , H01Q21/0043 , H01P11/002 , G01S7/032
Abstract: This document describes a single-layer air waveguide antenna integrated on a circuit board. The waveguide guides electromagnetic energy through channels filled with air. It is formed from a single layer of material, such as a sheet of metal, metal-coated plastic, or other material with conductive surfaces that is attached to a circuit board. A portion of a surface of the circuit board is configured as a floor of the channels filled with air. This floor is an electrical interface between the circuit board and the channels filled with air. The single layer of material is positioned atop this electrical interface to define walls and a ceiling of the channels filled with air. The single layer of material can be secured to the circuit board in various ways. The cost of integrating an air waveguide antenna on to a circuit board this way may be less expensive than other waveguide-manufacturing techniques.
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公开(公告)号：US20220256685A1
公开(公告)日：2022-08-11
申请号：US17306868
申请日：2021-05-03
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David Wayne Zimmerman
Abstract: Formed waveguide antennas using one or metal sheets can improve the materials and manufacturing process of a radar assembly. For example, the radar system can include a printed circuit board (PCB) and a metal sheet attached to the PCB. The metal sheet can be formed to provide multiple waveguide antennas that each include multiple waveguide channels. Multiple radiation slots can be formed on a surface of each of the multiple waveguide channels. The PCB can include an MIMIC and a thermally conductive material covering a portion of a first and a second surface of the PCB. The metal sheet can also be formed to provide a shield for the MIMIC. In this way, the described techniques and systems permit the waveguide antennas to formed with materials and a manufacturing process that reduce costs while still providing high performance (e.g., minimized loss).
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Patent Agency Ranking
公开(公告)号：US11362436B2
公开(公告)日：2022-06-14
申请号：US17061675
申请日：2020-10-02
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , Mark W. Hudson , David W. Zimmerman
Abstract: This document describes techniques and apparatuses for a plastic air-waveguide antenna with conductive particles. The described antenna includes an antenna body made from a resin embedded with conductive particles, a surface of the antenna body that includes a resin layer with no or fewer conductive particles, and a waveguide structure. The waveguide structure can be made from a portion of the surface on which the embedded conductive particles are exposed. The waveguide structure can be molded as part of the antenna body or cut into the antenna body using a laser, which also exposes the conductive particles. If the waveguide is molded as part of the antenna body, the conductive particles can be exposed by an etching process or by using the laser. In this way, the described apparatuses and techniques can reduce weight, improve gain and phase control, improve high-temperature performance, and avoid at least some vapor-deposition plating operations.
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公开(公告)号：US11217505B2
公开(公告)日：2022-01-04
申请号：US16566068
申请日：2019-09-10
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , Mark W. Hudson
IPC: H01L23/367 , H01L23/373
Abstract: An electronics heat exchanger including a fluid flow body having a first panel, a second panel, and at least one fluid flow guide connecting the first panel and the second panel, a plurality of pedestals extending from the second panel, the plurality of pedestals including at least a first pedestal having a first height and a second pedestal having a second height, distinct from the first height, and wherein each of the pedestals is integral with the second panel.
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公开(公告)号：US20210344100A1
公开(公告)日：2021-11-04
申请号：US17375145
申请日：2021-07-14
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David W. Zimmerman , Shawn Shi
Abstract: An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.
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公开(公告)号：US20210210832A1
公开(公告)日：2021-07-08
申请号：US16735884
申请日：2020-01-07
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David W. Zimmerman , Shawn Shi
Abstract: An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.
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公开(公告)号：US20210111096A1
公开(公告)日：2021-04-15
申请号：US16599712
申请日：2019-10-11
Applicant: APTIV TECHNOLOGIES LIMITED
Inventor： Scott D. Brandenburg , David W. Zimmerman
IPC: H01L23/373 , H01L23/367 , H05K7/20
Abstract: An electronic device includes a printed circuit board that supports an integrated circuit (IC) chip and a thermal interface layer that is configured to transfer thermal energy from the IC chip. The thermal interface layer includes a containment frame that is non-electrically conductive and a thermal conductance pane that is inset in the containment frame.
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