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公开(公告)号：US10678124B2
公开(公告)日：2020-06-09
申请号：US15919340
申请日：2018-03-13
Inventor： Xiongzhou Wei , Min Li , Qiang Xiong , Jiaqi Pang , Chao Liu , Bin Wan , Hongyu Sun , Ruilin Bi
Abstract: Provided is a method for manufacturing a color filter substrate including a base substrate, a black matrix layer and a plurality of color pixel units, and the color pixel unit including sub-pixel units of at least three colors. The method for manufacturing a color filter substrate includes: providing a base substrate; and forming a black matrix layer and the plurality of color pixel units on the base substrate, wherein the forming of the plurality of color pixel units includes: depositing an irreversible temperature-change material on the base substrate; and heating the irreversible temperature-change material to form sub-pixel units of at least two colors in the color pixel unit.
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公开(公告)号：US10656473B2
公开(公告)日：2020-05-19
申请号：US15995659
申请日：2018-06-01
Inventor： Ruilin Bi , Qiang Xiong , Kui Zhang , Xiongzhou Wei , Chao Liu
IPC: G02F1/1339 , G02F1/1333
Abstract: A curved display panel includes a first substrate and a second substrate cell-assembled to each other, a spacer layer disposed between the first substrate and the second substrate and configured to support the first substrate and the second substrate so as to form a gap, and a liquid crystal layer disposed in the gap, wherein the spacer layer includes a plurality of spacer groups, each of the plurality of spacer groups includes a first spacer provided on the first substrate and a second spacer provided on the second substrate, the plurality of spacer groups have supporting area on the first substrate as same as supporting area on the second substrate. A curved display device is further provided.
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23.发明授权公开(公告)号：US10139441B2
公开(公告)日：2018-11-27
申请号：US15105594
申请日：2015-09-18
Applicant: BOE Technology Group Co., Ltd.
Inventor： Yujun Zhang , Chao Liu
Abstract: A film structure includes a first metal layer, a second metal layer, and an insulation layer located between the first metal layer and the second metal layer. In at least a portion of an edge region of the film structure, the first metal layer extends outwards relative to an edge of the insulation layer by a first predetermined length, and the insulation layer extends outwards relative to an edge of the second metal layer by a second predetermined length. In this way, when the film structure is measured, a fall value between the surface, adjacent to the second metal layer, of the insulation layer and the surface, adjacent to the insulation layer, of the first metal layer is measured by means of a motion trajectory of the measuring probe at the time of ascending or descending, thereby obtaining a more accurate thickness value of the insulation layer.
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24.发明申请公开(公告)号：US20140063434A1
公开(公告)日：2014-03-06
申请号：US13877504
申请日：2012-10-29
Applicant: Boe Technology Group Co., Ltd.
Inventor： Dejiang Zhao , Yujun Zhang , Chao Liu , Zhongyuan Sun
IPC: G02F1/1339 , G02F1/1341
CPC classification number: G02F1/1339 , B23B27/00 , B32B17/06 , B32B27/00 , G02F1/133305 , G02F1/1341
Abstract: Embodiments of the present invention disclose a bended liquid crystal display and a manufacturing method and apparatus therefore. The method comprises: preparing an array substrate and a color filter substrate with flat glass sheets having different thermal expansion coefficients; applying adhesive sealant at edges of surfaces of the array substrate and/or the color filter substrate; heating the array substrate and the color filter substrate, and binding the expanded array substrate and color filter substrate together, to form an assembled substrate; and cooling the assembled substrate and forming a bended assembled substrate having a degree of curvature. The bended liquid crystal display has a better stability, and has no variation in its degree of curvature over service time.
Abstract translation: 本发明的实施例公开了一种弯曲液晶显示器及其制造方法和装置。 该方法包括：准备具有不同热膨胀系数的平板玻璃板的阵列基板和滤色器基板; 在阵列基板和/或滤色器基板的表面的边缘处施加粘合剂密封剂; 加热阵列基板和滤色器基板，并将扩展的阵列基板和滤色器基板结合在一起，以形成组装的基板; 并冷却组装的基板并形成具有曲率程度的弯曲组装的基板。 弯曲的液晶显示器具有更好的稳定性，并且在使用时间上的曲率程度没有变化。
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25.发明授权公开(公告)号：US12278244B2
公开(公告)日：2025-04-15
申请号：US17787985
申请日：2021-05-25
Inventor： Linhui Gong , Chen Li , Chao Liu , Jiacheng Qi
Abstract: A display panel includes: a backplane, a plurality of light-emitting devices, a plurality of connecting leads, a first protective layer and a reflective layer. The backplane includes a first main surface, a second main surface, and a plurality of side surfaces. At least one side surface is as a selected side surface. The plurality of light-emitting devices are disposed on the second main surface and are electrically connected to the plurality of connecting leads. The plurality of connecting leads are disposed on the first main surface, the selected side surface and the second main surface, and each connecting lead sequentially passes through the selected side surface and the second main surface from the first main surface. The first protective layer covers the plurality of connecting leads. The reflective layer includes at least a first portion covering a portion of the first protective layer on the selected side surface.
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Patent Agency Ranking
公开(公告)号：US11493793B2
公开(公告)日：2022-11-08
申请号：US16893472
申请日：2020-06-05
Applicant: BOE Technology Group Co., Ltd.
Inventor： Qiangwei Cui , Lili Wang , Ke Meng , Chao Liu , Chuhang Wang , Linhui Gong , Zhaohui Li , Donghui Wang
IPC: H01L23/00 , H01L51/00 , G02F1/1333 , G02F1/1335 , G02F1/1362 , H01L27/32
Abstract: The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.
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公开(公告)号：US11276674B2
公开(公告)日：2022-03-15
申请号：US16862934
申请日：2020-04-30
Inventor： Ke Meng , Chao Liu , Qiangwei Cui , Chuhang Wang , Lili Wang , Linhui Gong , Yutian Chu , Fan Yang
IPC: H01L27/118 , H01L25/075 , H01L27/12 , H01L33/62
Abstract: A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.
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公开(公告)号：US20220068972A1
公开(公告)日：2022-03-03
申请号：US17201198
申请日：2021-03-15
Inventor： Linhui Gong , Chao Liu , Haiwei Sun
Abstract: A display panel, a preparation method thereof, and a display device are disclosed. The display panel includes: a plurality of pixel units arranged in an array; a plurality of first signal lines extending in a first direction and arranged in a second direction; and a plurality of first connecting electrodes arranged in the second direction; where the first direction intersects with the second direction. The plurality of pixel units form m pixel rows arranged in sequence along the first direction and each extending along the second direction, where m is an integer greater than 1; and a projection of at least one pixel unit in an m-th pixel row on a plane perpendicular to the second direction and projections of the first connecting electrodes on the plane perpendicular to the second direction have an overlapped area.
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公开(公告)号：US11239198B2
公开(公告)日：2022-02-01
申请号：US16830834
申请日：2020-03-26
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Lili Wang , Haiwei Sun , Zhenxing Tang , Feng Qu , Jing Liu , Chao Liu , Chuhang Wang , Qiangwei Cui , Ke Meng , Linhui Gong
Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.
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公开(公告)号：US09666609B2
公开(公告)日：2017-05-30
申请号：US14469554
申请日：2014-08-26
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chao Liu , Yujun Zhang , Zengsheng He , Lei Chen
IPC: H01L27/12
CPC classification number: H01L27/124 , H01L27/1259
Abstract: This disclosure relates to an array substrate wiring and manufacturing and repairing method thereof. The array substrate wiring comprises a first wiring formed on the substrate for transmitting electric signals; an insulating layer formed on the first wiring; a second wiring formed on the insulating layer, being opposite to the first wiring, the second wiring being in a hanging state and not transmitting electric signals. By means of such a double layer wiring structure, the holes produced in the insulating layer are blocked using the second wiring in the upper layer, such that the outside moisture cannot reach the first wiring via the holes in the insulating layer, thereby protecting the first wiring for transmitting electric signals from corrosion and scratch.
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