Flexible printed circuit and manufacture method thereof, electronic device module and electronic device

    公开(公告)号:US11412613B2

    公开(公告)日:2022-08-09

    申请号:US16766787

    申请日:2020-01-22

    Abstract: A flexible printed circuit and a manufacture method thereof, an electronic device module and an electronic device are provided. The flexible printed circuit includes a main sub-circuit board and a transfer sub-circuit board. The main sub-circuit board includes a first transfer terminal, a first wiring portion and a second wiring portion; and the transfer sub-circuit board includes a second transfer terminal and a third wiring portion, and the third wiring portion electrically connects a first group of second contact pads with a second group of second contact pads of the second transfer terminal. The transfer sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the first group of second contact pads to the first group of first contact pads and electrically connecting the second group of second contact pads to the second group of first contact pads.

    Display module and electronic device

    公开(公告)号:US12219743B2

    公开(公告)日:2025-02-04

    申请号:US18023269

    申请日:2022-06-17

    Abstract: A display module and an electronic device are provided. The display module includes a display film layer, a heat dissipation film layer, a support plate and an elastic thermal conductive sheet. The display film layer and the heat dissipation film layer include a flat area and bending areas, and an angle exists between a tangent of a curved surface formed by the bending areas and a plane where the flat area is located. The display film layer is stacked on a first surface of the heat dissipation film layer. The support plate is connected to a position where the flat area of a second surface of the heat dissipation film layer is located, and the elastic thermal conductive sheet is connected to a position where the bending areas of the second surface of the heat dissipation film layer are located. The first surface and the second surface are opposite surfaces.

    Display device and assembly method thereof

    公开(公告)号:US11482032B2

    公开(公告)日:2022-10-25

    申请号:US16959047

    申请日:2019-08-01

    Abstract: The display device includes a display panel, a fingerprint identification module, a fingerprint identification flexible circuit board, and a frame sealant, wherein the fingerprint identification module is disposed on a non-display side of the display panel, the fingerprint identification module includes a fingerprint identification region and a peripheral region surrounding the fingerprint identification region; the frame sealant is at least partially disposed between the display panel and the peripheral region of the fingerprint identification module; and wherein at least one opening is provided on a side of an orthographic projection of the frame sealant on the display panel proximal to the fingerprint identification flexible circuit board, and the at least one opening being at least partially overlapped with an orthographic projection of the fingerprint identification flexible circuit board on the display panel.

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