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公开(公告)号:US12004392B2
公开(公告)日:2024-06-04
申请号:US17473602
申请日:2021-09-13
Inventor: Benlian Wang , Li Wang , Yipeng Chen , Yueping Zuo , Zheng Liu
IPC: H10K59/131
CPC classification number: H10K59/131
Abstract: A display panel and a display device are provided. The display panel comprises a substrate, a plurality of sub-pixels, a plurality of data lines, a plurality of wiring structures and a plurality of pads. The substrate comprises a display area and a non-display area comprising a bending area. The sub-pixels and data lines are in the display area and electrically connected with each other. The wiring structures are in the bending area and electrically connected with the data lines. At least one wiring structure comprises a plurality of hollow patterns connected successively, each hollow pattern comprises a first conductive part and a second conductive part connected with each other. The plurality of pads are in the non-display area and located on a side of the plurality of wiring structures away from the display area and electrically connected with the plurality of wiring structures.
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公开(公告)号:US11226526B2
公开(公告)日:2022-01-18
申请号:US15779680
申请日:2017-11-08
Inventor: Benlian Wang , Li Wang , Yipeng Chen , Yueping Zuo , Zheng Liu
IPC: G02F1/1333 , G02F1/1362
Abstract: The application provides a wiring structure, a display substrate, and a display device, which pertain to the field of display technologies. The wiring structure includes a plurality of hollow units connected in series, and each of the hollow units includes a hollow area and a non-hollow area. The non-hollow areas of any two adjacent hollow units at least partially overlap, and the hollow areas thereof do not overlap. Compared with a conventional linear-type wiring structure, the wiring structure can release stress through the hollow area of the hollow unit in the process of bending, stretching, and twisting, so as to avoid breaking of the wiring structure which may result in failure of the device on the substrate that employs the wiring structure.
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公开(公告)号:US11177448B2
公开(公告)日:2021-11-16
申请号:US16611110
申请日:2019-01-23
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Shuai Zhang , Yueping Zuo , Libin Liu
Abstract: The present disclosure provides a flexible display device and a manufacturing method. The manufacturing method includes: forming a layer of flexible display devices on a support plate; etching the layer of flexible display devices on the support plate to expose a portion of the support plate at a cutting region, the cutting region being a predetermined region between two adjacent flexible display devices; and removing the layer of flexible display devices from the support plate after the etching process so as to obtain a plurality of flexible display devices separated from each other.
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公开(公告)号:US11114518B2
公开(公告)日:2021-09-07
申请号:US15779658
申请日:2017-11-07
Inventor: Benlian Wang , Li Wang , Yipeng Chen , Yueping Zuo , Zheng Liu
Abstract: The application discloses a wiring structure, a display substrate and a display device. The wiring structure provided includes a plurality of hollowed pattern strings, each hollowed pattern string including a plurality of hollowed patterns arranged sequentially in a length extension direction of the wiring structure, each hollowed pattern including a hollowed region and a non-hollowed region. The non-hollowed region of any hollowed pattern in a hollowed pattern string at least partially overlaps the non-hollowed region of a hollowed pattern in a further hollowed pattern string adjacent to the hollowed pattern string, and the hollowed regions of the hollowed patterns in the plurality of hollowed pattern strings do not overlap each other. The wiring structure is particularly adapted for flexible display.
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公开(公告)号:US10748937B2
公开(公告)日:2020-08-18
申请号:US16051947
申请日:2018-08-01
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Yueping Zuo , Hongwei Tian , Shuai Zhang
IPC: H01L27/12 , H01L21/027 , H01L27/32 , H01L51/00 , G02F1/1368 , G02F1/1362 , G02F1/1333
Abstract: A substrate and a manufacturing method thereof and a display device are provided. The substrate includes: a base including a bendable region; an interlayer on the base and in the bendable region; and a signal line at a side, facing away from the base, of the interlayer. In the bendable region, an orthographic projection of the signal line on the base is within an orthographic projection of the interlayer on the base; and in the bendable region, the interlayer is provided with a groove on at least one side of a portion, corresponding to the signal line, of the interlayer.
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公开(公告)号:US09876038B2
公开(公告)日:2018-01-23
申请号:US15238970
申请日:2016-08-17
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Yinghai Ma , Liangjian Li , Yueping Zuo
IPC: H01L27/14 , H01L27/12 , H01L29/786 , H01L21/311 , H01L29/66
CPC classification number: H01L27/1255 , H01L21/31116 , H01L27/124 , H01L27/1248 , H01L27/1259 , H01L27/127 , H01L27/1288 , H01L29/41733 , H01L29/66757 , H01L29/78621
Abstract: A manufacturing method of an array substrate comprises: forming a source and a drain of a thin film transistor on a base; forming a first insulation layer; forming an active layer of the thin film transistor; forming a second insulation layer; forming a first via hole and a second via hole in the first insulation layer and the second insulation layer above the source and the drain, by etching, and forming a third via hole and a fourth via hole in the second insulation layer above the active layer, by etching; forming a first connection line connecting the source with the active layer through the first via hole and the third via hole, a second connection line connecting the drain with the active layer and the pixel electrode through the second via hole and the fourth via hole and a pixel electrode.
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27.
公开(公告)号:US20170148884A1
公开(公告)日:2017-05-25
申请号:US15116195
申请日:2016-02-22
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Liangjian Li , Yueping Zuo , Yinghai Ma , Xiaowei Xu
IPC: H01L29/417 , H01L27/12 , H01L29/66 , H01L29/786 , H01L23/535 , H01L29/423 , H01L29/06
CPC classification number: H01L29/41733 , H01L23/535 , H01L27/1222 , H01L27/124 , H01L27/1248 , H01L27/1288 , H01L29/0649 , H01L29/42384 , H01L29/6675 , H01L29/78684
Abstract: The present application discloses a thin film transistor comprising active layer on a base substrate; an insulating layer over fee active layer, the insulating layer comprising a source via and a drain via, each of which extending through the insulating layer; a source electrode within the source via in contact with the active layer; and a drain electrode within the drain via in contact with the active layer.
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公开(公告)号:US20170141135A1
公开(公告)日:2017-05-18
申请号:US15107070
申请日:2016-02-22
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Yueping Zuo , Chien Hung Liu , Liangjian Li , Yinghai Ma
IPC: H01L27/12
CPC classification number: H01L27/1266
Abstract: The present application discloses a method of fabricating a display apparatus, comprising providing a carrier substrate comprising a base substrate and an adhesive layer over the base substrate, wherein the base substrate comprises a plurality of fluid passages between the base substrate and the adhesive layer, and a plurality of fluid inlets connected with the plurality of fluid passages; forming a product substrate on a side of the adhesive layer distal to the base substrate; dispensing a detaching agent through the plurality of fluid inlets to the plurality of fluid passages, and contacting the detaching agent with the adhesive layer through the plurality of fluid passages; and detaching the product substrate from the carrier substrate.
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