MULTILAYER CHIP CAPACITOR
    21.
    发明申请
    MULTILAYER CHIP CAPACITOR 有权
    多层芯片电容器

    公开(公告)号:US20100033897A1

    公开(公告)日:2010-02-11

    申请号:US12340200

    申请日:2008-12-19

    IPC分类号: H01G4/38

    摘要: There is provided a multilayer chip capacitor a multilayer chip capacitor including: a capacitor body including first and second capacitor units arranged therein; and first to fourth outer electrodes, wherein the first capacitor unit includes first and second inner electrodes, and the first capacitor unit includes a plurality of capacitor elements each having a pair of the first and second inner electrodes repeatedly laminated, the second capacitor unit includes third and fourth inner electrodes, and the second capacitor unit includes at least one capacitor element having a pair of the third and fourth inner electrodes repeatedly laminated, and at least one of the capacitor elements of the first capacitor unit is different from the other capacitor elements of the first capacitor unit in a lamination number of the first and second inner electrodes or a resonant frequency.

    摘要翻译: 提供了一种多层片状电容器,其包括:电容器主体,包括布置在其中的第一和第二电容器单元; 以及第一至第四外部电极,其中所述第一电容器单元包括第一和第二内部电极,并且所述第一电容器单元包括多个电容器元件,每个电容器元件具有反复层叠的一对第一和第二内部电极,所述第二电容器单元包括第三电极单元 和第四内部电极,并且第二电容器单元包括至少一个电容器元件,其具有重复层叠的一对第三和第四内部电极,并且第一电容器单元的电容器元件中的至少一个与其他电容器元件不同 第一电容器单元的第一和第二内部电极的叠层数或谐振频率。

    MULTILAYER CHIP CAPACITOR
    22.
    发明申请
    MULTILAYER CHIP CAPACITOR 有权
    多层芯片电容器

    公开(公告)号:US20090225492A1

    公开(公告)日:2009-09-10

    申请号:US12248476

    申请日:2008-10-09

    IPC分类号: H01G4/005

    CPC分类号: H01G4/012 H01G4/232 H01G4/30

    摘要: A multilayer chip capacitor includes a capacitor body including a stack of a plurality of dielectric layers and having first and second side faces and first and second end faces, a plurality of external electrodes of opposite polarity alternated on each of the first and second side faces, and a plurality of internal electrodes each including one or two leads extending to an outer face of the capacitor body and respectively connected to the external electrodes. A horizontal distance between leads of the internal electrodes of opposite polarity adjacent to each other in a stack direction is longer than a pitch between the external electrodes of opposite polarity adjacent to each other on the same side face of the capacitor body.

    摘要翻译: 多层片状电容器包括电容器主体,其包括多个电介质层的叠层,并且具有第一和第二侧面以及第一和第二端面,多个相反极性的外部电极在第一和第二侧面中的每一个上交替, 以及多个内部电极,每个内部电极包括延伸到电容器主体的外表面并分别连接到外部电极的一个或两个引线。 在堆叠方向上彼此相邻的内部电极的引线之间的水平距离比在电容器主体的同一侧面上彼此相邻的外部电极之间的间距长。

    MULTILAYER CHIP CAPACITOR
    23.
    发明申请
    MULTILAYER CHIP CAPACITOR 有权
    多层芯片电容器

    公开(公告)号:US20090213525A1

    公开(公告)日:2009-08-27

    申请号:US12245865

    申请日:2008-10-06

    IPC分类号: H01G4/005

    CPC分类号: H01G4/005 H01G4/30

    摘要: A multilayer chip capacitor includes a capacitor body including first and second longer side surfaces facing each other and first and second shorter side surfaces facing each other, first and second external electrodes respectively disposed at the first and second longer side surfaces, one or more first internal electrode pairs each including first and second internal electrodes, and one or more second internal electrode pairs each including third and fourth internal electrodes. The first to fourth internal electrodes each have one lead and are sequentially disposed in a stacked direction. The first to fourth internal electrodes have first to fourth leads respectively extending to first to fourth corners or portions adjacent thereto, and alternately connected with the first and second external electrodes. The first internal electrode pair and the second internal electrode pair cause a current to diagonally flow in opposite directions with respect to a long side direction.

    摘要翻译: 一种多层片状电容器包括:电容器主体,包括彼此面对的第一和第二较长侧表面;以及彼此面对的第一和第二短边表面,分别设置在第一和第二长边侧表面的第一和第二外部电极, 每个电极对包括第一和第二内部电极,以及一个或多个第二内部电极对,每个包括第三和第四内部电极。 第一至第四内部电极各自具有一个引线并且沿堆叠方向依次布置。 第一至第四内部电极具有分别延伸到第一至第四角部或与其相邻的部分的第一至第四引线,并且与第一和第二外部电极交替连接。 第一内部电极对和第二内部电极对使得电流相对于长边方向在相反的方向上斜向流动。

    MULTILAYER CHIP CAPACITOR AND CIRCUIT BOARD DEVICE INCLUDING THE SAME
    24.
    发明申请
    MULTILAYER CHIP CAPACITOR AND CIRCUIT BOARD DEVICE INCLUDING THE SAME 有权
    多层芯片电容器和电路板装置,包括它们

    公开(公告)号:US20090139757A1

    公开(公告)日:2009-06-04

    申请号:US12195015

    申请日:2008-08-20

    IPC分类号: H01G4/005 H05K1/18

    摘要: A multilayer chip capacitor including: a capacitor body having a lamination structure where a plurality of dielectric layers are laminated and including a first capacitor part and a second capacitor part arranged according to a lamination direction; first to fourth outer electrodes formed on side surfaces of the capacitor body, the first and third outer electrodes having the same polarity and the second and fourth outer electrodes having the same polarity opposite to that of the first outer electrode; and one or more connection conductor lines formed on an outer surface of the capacitor body and connecting the first outer electrode to the third outer electrode or connecting the second outer electrode to the fourth outer electrode.

    摘要翻译: 一种多层片状电容器,包括:层叠有多个电介质层的叠层结构的电容器体,具有根据层叠方向配置的第一电容器部和第二电容器部; 形成在电容器主体的侧面的第一至第四外部电极,第一和第三外部电极具有相同的极性,第二和第四外部电极具有与第一外部电极的极性相反的极性; 以及一个或多个连接导线,形成在电容器主体的外表面上,并将第一外电极连接到第三外电极或将第二外电极连接到第四外电极。

    MULTILAYERED CHIP CAPACITOR AND CAPACITANCE TUNNING METHOD OF THE SAME
    25.
    发明申请
    MULTILAYERED CHIP CAPACITOR AND CAPACITANCE TUNNING METHOD OF THE SAME 失效
    多层芯片电容器及其电容调谐方法

    公开(公告)号:US20090086405A1

    公开(公告)日:2009-04-02

    申请号:US12238688

    申请日:2008-09-26

    IPC分类号: H01G4/228

    摘要: There is provided a multilayer chip capacitor capable of tuning capacitance, including: a capacitor body where a plurality of dielectric layers are laminated; a plurality of pairs of first and second internal electrodes arranged alternately, while interposing a corresponding one of the dielectric layers; and a plurality of pairs of first and second external electrodes connected to the first and second internal electrodes, wherein the first and second internal electrodes include a plurality of groups each including at least one pair of the first and second internal electrodes, and the first and second internal electrodes of each of the groups are connected to different pairs of the first and second external electrodes, respectively, wherein a corresponding one of the pairs of the first and second external electrodes is selectively connected to power lines so that the multilayer chip capacitor has at least two different capacitances.

    摘要翻译: 提供一种能够调谐电容的多层片状电容器,包括:电容器体,层叠多个电介质层; 多个成对的第一和第二内部电极交替布置,同时插入相应的一个电介质层; 以及连接到所述第一和第二内部电极的多对第一和第二外部电极,其中所述第一和第二内部电极包括多个组,每个组包括至少一对所述第一和第二内部电极,以及所述第一和第二内部电极 每个组的第二内部电极分别连接到第一和第二外部电极的不同对,其中第一和第二外部电极对中的相应一个选择性地连接到电力线,使得多层片状电容器具有 至少两个不同的电容。

    LAMINATED INDUCTOR
    26.
    发明申请
    LAMINATED INDUCTOR 有权
    层压电感器

    公开(公告)号:US20090051474A1

    公开(公告)日:2009-02-26

    申请号:US12194935

    申请日:2008-08-20

    IPC分类号: H01F27/02

    摘要: There is provided a laminated inductor including: a body where a plurality of magnetic layers are laminated; a coil part formed on the magnetic layers, the coil part including a plurality of conductor patterns and a plurality of conductive vias; first and second external electrodes formed on an outer surface of the body to connect to both ends of the coil part, respectively; and a non-magnetic conductor formed on at least one of the magnetic layers so as to relax magnetic saturation caused by direct current flowing through the coil part. The laminated inductor employs the non-magnetic conductor as a non-magnetic gap to be simplified in a manufacturing process and effectively improved in DC superposition characteristics.

    摘要翻译: 提供一种层叠电感器,包括:层叠有多个磁性层的主体; 形成在所述磁性层上的线圈部分,所述线圈部分包括多个导体图案和多个导电通孔; 第一外部电极和第二外部电极分别形成在主体的外表面上以连接到线圈部分的两端; 以及形成在至少一个磁性层上的非磁性导体,以便缓和由直流电流流过线圈部分的磁饱和。 层叠电感器在制造工艺中使用非磁性导体作为非磁性间隙进行简化,并有效地改善了DC叠加特性。

    Integrated multilayer chip capacitor module and integrated circuit apparatus having the same
    27.
    发明申请
    Integrated multilayer chip capacitor module and integrated circuit apparatus having the same 有权
    集成多层片状电容器模块及其集成电路装置

    公开(公告)号:US20080204971A1

    公开(公告)日:2008-08-28

    申请号:US12007737

    申请日:2008-01-15

    IPC分类号: H01G4/228

    摘要: An integrated multilayer chip capacitor module including: plurality of multilayer chip capacitors arranged close to one another and co-planar with one another; and a capacitor support accommodating the multilayer chip capacitors, wherein each of the multilayer chip capacitors includes a rectangular parallelepiped capacitor body and a plurality of first and second external electrodes formed on at least two sides of the capacitor body, and the external electrodes on adjacent sides of adjacent ones of the multilayer chip capacitor in the capacitor support are electrically connected to each other by a conductive adhesive material.

    摘要翻译: 一种集成多层片状电容器模块,包括:彼此靠近并且彼此共面布置的多个多层片状电容器; 以及容纳所述多层片状电容器的电容器支架,其中,所述多层片状电容器中的每一者包括长方体电容器主体和形成在所述电容器主体的至少两侧的多个第一外部电极和所述第二外部电极, 的电容器支撑体中的多层片状电容器的相邻电容器通过导电性粘合剂材料彼此电连接。

    Multilayer chip capacitor
    28.
    发明申请
    Multilayer chip capacitor 有权
    多层片式电容器

    公开(公告)号:US20080186652A1

    公开(公告)日:2008-08-07

    申请号:US11987835

    申请日:2007-12-05

    IPC分类号: H01G4/228

    CPC分类号: H01G4/30 H01G4/012 H01G4/232

    摘要: A multilayer chip capacitor includes: a capacitor body having first and second side surfaces and a bottom surface; a plurality of first and second internal electrodes in the capacitor body; first and second external electrodes having a first polarity and formed on the first and second side surfaces, respectively, to cover a respective lower edge of the side surfaces and to partially extend to the bottom surface; and a third external electrode having a second polarity and formed on the bottom surface. The internal electrodes are disposed in perpendicular to the bottom surface. Each of the first internal electrodes has a first lead drawn to the first side and bottom surfaces and a second lead drawn to the second side and bottom surfaces. Each of the second internal electrodes has a third lead drawn to the bottom surface.

    摘要翻译: 一种多层片状电容器包括:具有第一和第二侧表面和底表面的电容器本体; 电容器主体中的多个第一和第二内部电极; 第一和第二外部电极分别具有第一极性并形成在第一和第二侧表面上,以覆盖侧表面的相应下边缘并部分地延伸到底面; 和具有第二极性并形成在底面上的第三外部电极。 内部电极垂直于底面设置。 每个第一内部电极具有被引导到第一侧面和底部表面的第一引线和被引导到第二侧面和底部表面的第二引线。 每个第二内部电极具有被引导到底面的第三引线。

    Multilayer chip capacitor
    29.
    发明申请
    Multilayer chip capacitor 有权
    多层片式电容器

    公开(公告)号:US20080180879A1

    公开(公告)日:2008-07-31

    申请号:US12005300

    申请日:2007-12-27

    IPC分类号: H01G4/38

    CPC分类号: H01G4/232 H01G4/012 H01G4/30

    摘要: A multilayer chip capacitor including: a capacitor body having a plurality of dielectric layers deposited therein and having a parallelepiped shape; at least three pairs of first and second external electrodes formed on two longer sides, the first and second external electrodes in each of the pairs having different polarities and opposing each other, and the first and second external electrodes on each of the longer sides arranged alternately with each other; and a plurality of first and second internal electrodes arranged alternately to interpose each of the dielectric layers, the first and second internal electrodes connected to the first and second external electrodes by leads, respectively, wherein the capacitor body has a length that is 2.5 times greater than a width thereof.

    摘要翻译: 一种多层片状电容器,包括:具有沉积在其中并具有平行六面体形状的多个电介质层的电容器主体; 形成在两个长边上的至少三对第一和第二外部电极,每对中的第一和第二外部电极具有不同的极性并且彼此相对,并且每个长边上的第一和第二外部电极交替布置 彼此; 并且交替地布置多个第一和第二内部电极以分别插入每个电介质层,第一和第二内部电极分别通过引线连接到第一和第二外部电极,其中电容器主体具有2.5倍的长度 比其宽度。

    Multilayer chip capacitor
    30.
    发明申请
    Multilayer chip capacitor 有权
    多层片式电容器

    公开(公告)号:US20080074826A1

    公开(公告)日:2008-03-27

    申请号:US11902398

    申请日:2007-09-21

    IPC分类号: H01G4/30

    CPC分类号: H01G4/232 H01G4/30

    摘要: A multilayer chip capacitor including: a capacitor body where a plurality of dielectric layers are deposited, the capacitor body having opposing first and second sides and opposing third and fourth sides; a plurality of layers of internal electrodes deposited alternately with the dielectric layers in the capacitor body; at least one first external electrode formed on the first side; and at least one second external electrode formed on the second side, wherein the first and second external electrodes are staggered with respect to each other and spaced apart from each other at a certain distance in a length direction of the first side.

    摘要翻译: 一种多层片状电容器,包括:电容器体,其中沉积有多个电介质层,所述电容器体具有相对的第一和第二侧以及相对的第三和第四侧; 与电容器主体中的电介质层交替沉积的多层内部电极; 形成在所述第一侧上的至少一个第一外部电极; 以及形成在所述第二侧上的至少一个第二外部电极,其中所述第一和第二外部电极相对于彼此交错并且在所述第一侧的长度方向上以一定距离彼此间隔开。