摘要:
There is provided a multilayer chip capacitor a multilayer chip capacitor including: a capacitor body including first and second capacitor units arranged therein; and first to fourth outer electrodes, wherein the first capacitor unit includes first and second inner electrodes, and the first capacitor unit includes a plurality of capacitor elements each having a pair of the first and second inner electrodes repeatedly laminated, the second capacitor unit includes third and fourth inner electrodes, and the second capacitor unit includes at least one capacitor element having a pair of the third and fourth inner electrodes repeatedly laminated, and at least one of the capacitor elements of the first capacitor unit is different from the other capacitor elements of the first capacitor unit in a lamination number of the first and second inner electrodes or a resonant frequency.
摘要:
A multilayer chip capacitor includes a capacitor body including a stack of a plurality of dielectric layers and having first and second side faces and first and second end faces, a plurality of external electrodes of opposite polarity alternated on each of the first and second side faces, and a plurality of internal electrodes each including one or two leads extending to an outer face of the capacitor body and respectively connected to the external electrodes. A horizontal distance between leads of the internal electrodes of opposite polarity adjacent to each other in a stack direction is longer than a pitch between the external electrodes of opposite polarity adjacent to each other on the same side face of the capacitor body.
摘要:
A multilayer chip capacitor includes a capacitor body including first and second longer side surfaces facing each other and first and second shorter side surfaces facing each other, first and second external electrodes respectively disposed at the first and second longer side surfaces, one or more first internal electrode pairs each including first and second internal electrodes, and one or more second internal electrode pairs each including third and fourth internal electrodes. The first to fourth internal electrodes each have one lead and are sequentially disposed in a stacked direction. The first to fourth internal electrodes have first to fourth leads respectively extending to first to fourth corners or portions adjacent thereto, and alternately connected with the first and second external electrodes. The first internal electrode pair and the second internal electrode pair cause a current to diagonally flow in opposite directions with respect to a long side direction.
摘要:
A multilayer chip capacitor including: a capacitor body having a lamination structure where a plurality of dielectric layers are laminated and including a first capacitor part and a second capacitor part arranged according to a lamination direction; first to fourth outer electrodes formed on side surfaces of the capacitor body, the first and third outer electrodes having the same polarity and the second and fourth outer electrodes having the same polarity opposite to that of the first outer electrode; and one or more connection conductor lines formed on an outer surface of the capacitor body and connecting the first outer electrode to the third outer electrode or connecting the second outer electrode to the fourth outer electrode.
摘要:
There is provided a multilayer chip capacitor capable of tuning capacitance, including: a capacitor body where a plurality of dielectric layers are laminated; a plurality of pairs of first and second internal electrodes arranged alternately, while interposing a corresponding one of the dielectric layers; and a plurality of pairs of first and second external electrodes connected to the first and second internal electrodes, wherein the first and second internal electrodes include a plurality of groups each including at least one pair of the first and second internal electrodes, and the first and second internal electrodes of each of the groups are connected to different pairs of the first and second external electrodes, respectively, wherein a corresponding one of the pairs of the first and second external electrodes is selectively connected to power lines so that the multilayer chip capacitor has at least two different capacitances.
摘要:
There is provided a laminated inductor including: a body where a plurality of magnetic layers are laminated; a coil part formed on the magnetic layers, the coil part including a plurality of conductor patterns and a plurality of conductive vias; first and second external electrodes formed on an outer surface of the body to connect to both ends of the coil part, respectively; and a non-magnetic conductor formed on at least one of the magnetic layers so as to relax magnetic saturation caused by direct current flowing through the coil part. The laminated inductor employs the non-magnetic conductor as a non-magnetic gap to be simplified in a manufacturing process and effectively improved in DC superposition characteristics.
摘要:
An integrated multilayer chip capacitor module including: plurality of multilayer chip capacitors arranged close to one another and co-planar with one another; and a capacitor support accommodating the multilayer chip capacitors, wherein each of the multilayer chip capacitors includes a rectangular parallelepiped capacitor body and a plurality of first and second external electrodes formed on at least two sides of the capacitor body, and the external electrodes on adjacent sides of adjacent ones of the multilayer chip capacitor in the capacitor support are electrically connected to each other by a conductive adhesive material.
摘要:
A multilayer chip capacitor includes: a capacitor body having first and second side surfaces and a bottom surface; a plurality of first and second internal electrodes in the capacitor body; first and second external electrodes having a first polarity and formed on the first and second side surfaces, respectively, to cover a respective lower edge of the side surfaces and to partially extend to the bottom surface; and a third external electrode having a second polarity and formed on the bottom surface. The internal electrodes are disposed in perpendicular to the bottom surface. Each of the first internal electrodes has a first lead drawn to the first side and bottom surfaces and a second lead drawn to the second side and bottom surfaces. Each of the second internal electrodes has a third lead drawn to the bottom surface.
摘要:
A multilayer chip capacitor including: a capacitor body having a plurality of dielectric layers deposited therein and having a parallelepiped shape; at least three pairs of first and second external electrodes formed on two longer sides, the first and second external electrodes in each of the pairs having different polarities and opposing each other, and the first and second external electrodes on each of the longer sides arranged alternately with each other; and a plurality of first and second internal electrodes arranged alternately to interpose each of the dielectric layers, the first and second internal electrodes connected to the first and second external electrodes by leads, respectively, wherein the capacitor body has a length that is 2.5 times greater than a width thereof.
摘要:
A multilayer chip capacitor including: a capacitor body where a plurality of dielectric layers are deposited, the capacitor body having opposing first and second sides and opposing third and fourth sides; a plurality of layers of internal electrodes deposited alternately with the dielectric layers in the capacitor body; at least one first external electrode formed on the first side; and at least one second external electrode formed on the second side, wherein the first and second external electrodes are staggered with respect to each other and spaced apart from each other at a certain distance in a length direction of the first side.