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    MODULAR POWER SUPPLY ARCHITECTURE OPTIMIZED FOR FLAT EFFICIENCY ACROSS LOADINGS
    21.
    发明公开
    MODULAR POWER SUPPLY ARCHITECTURE OPTIMIZED FOR FLAT EFFICIENCY ACROSS LOADINGS 审中-公开

    公开(公告)号：US20230361668A1

    公开(公告)日：2023-11-09

    申请号：US18353536

    申请日：2023-07-17

    Applicant: Cisco Technology, Inc.

    Inventor： Xiqun Zhu ,  Sung Kee Baek ,  Joel Goergen ,  Doug Paul Arduini ,  Ruqi Li

    IPC: H02M1/00

    CPC classification number: H02M1/0048 ,  H02M1/0043

    Abstract: A control method improves the efficiency profile of a power supply across a wide range of output loading. The method includes obtaining a measure of output power for a power supply, which includes one or more output modules and an auxiliary power supply. The method determines whether a maximum power rating of the auxiliary power supply is sufficient to provide the measure of output power. Responsive to a determination that the maximum power rating of the auxiliary power supply is sufficient to provide the measure of output power, the controller of the power supply directs the auxiliary power supply to provide the output power.

    COMBINED LIQUID AND AIR COOLING SYSTEM FOR FAIL-SAFE OPERATION OF HIGH POWER DENSITY ASIC DEVICES
    23.
    发明申请
    COMBINED LIQUID AND AIR COOLING SYSTEM FOR FAIL-SAFE OPERATION OF HIGH POWER DENSITY ASIC DEVICES 有权

    公开(公告)号：US20220240419A1

    公开(公告)日：2022-07-28

    申请号：US17720436

    申请日：2022-04-14

    Applicant: Cisco Technology, Inc.

    Inventor： M. Baris Dogruoz ,  Joel Goergen

    IPC: H05K7/20 ,  H05K1/02

    Abstract: A combined liquid and air cooling system is provided over a printed circuit board (PCB) of an electronic device, where the PCB includes an integrated circuit package including an application specific integrated circuit (ASIC) die and a plurality of high bandwidth memory (HBM) modules located proximate the ASIC die, and the combined liquid and air cooling system includes a liquid cooling system located over the integrated circuit package and an air cooling system integrated with the liquid cooling system and a portion of the PCB. The system operates in a normal mode, where both liquid and air cooling systems provide cooling to components of the PCB, and a fail-safe mode, where the liquid cooling system is not operating (e.g., due to a detected condition) but the air cooling system operation is adjusted such that it provides sufficient cooling to PCB components which facilitates continuous operation of the electronic device.

    Minimal touch post for multi-layer cable routing
    24.
    发明授权
    Minimal touch post for multi-layer cable routing 有权

    公开(公告)号：US11184688B2

    公开(公告)日：2021-11-23

    申请号：US16672942

    申请日：2019-11-04

    Applicant: Cisco Technology, Inc.

    Inventor： Rohit Dev Gupta ,  Joel Goergen ,  Arjun Guzar Jayaprakash ,  Naveen Kumar Bangalore Shiva Kumar

    IPC: H04Q1/06 ,  H04Q1/04 ,  H05K7/18 ,  H04L12/931

    Abstract: A system includes a tray, where the tray includes a rail and a bracket that secures the rail to a networking device such that the rail is distanced from a surface of the networking device. A support post is removably coupled to the rail. The support post includes a first support member and a second support member vertically displaced from the first support member, where each of the first and second support members includes a support structure that supports a cable connected with a port at the surface of the networking device and routes the cable away from the networking device to another location distanced from the networking device. The cable supported by the first support member is separated and segregated from the cable supported by the second support member. With minimal touch, a support post can be moved from one location to another along the rail.

    Virtualized chassis with power-over-Ethernet for networking applications
    26.
    发明授权
    Virtualized chassis with power-over-Ethernet for networking applications 有权

    公开(公告)号：US10680836B1

    公开(公告)日：2020-06-09

    申请号：US16284400

    申请日：2019-02-25

    Applicant: Cisco Technology, Inc.

    Inventor： Paolo Sironi ,  Sushin Suresan Adackaconam ,  Joel Goergen ,  Roberto Gianella

    IPC: H04L12/10 ,  H02M1/32 ,  H01H83/10 ,  H01H83/22

    Abstract: An apparatus comprises an Ethernet port including high-side transformers and low-side transformers. High-side current paths supply high-side currents form a high voltage rail to high-side center taps of the high-side transformers. Low-side current paths supply or do not supply low-side currents from a low voltage rail to low-side center taps of the low-side transformers, and convert the low-side currents to sense voltages. A controller configures the low-side current paths to either supply or not supply the low-side currents to the low-side center taps when none of the sense voltages exceed a voltage threshold representative of an overcurrent threshold or when at least one of the sense voltages exceeds the voltage threshold, respectively. A current monitor injects additional current into the low-side current paths only when at least one of the high-side currents exceeds the overcurrent threshold.

    Multiple sense points for addressing a voltage gradient
    30.
    发明授权
    Multiple sense points for addressing a voltage gradient 有权

    公开(公告)号：US11650247B2

    公开(公告)日：2023-05-16

    申请号：US17344539

    申请日：2021-06-10

    Applicant: Cisco Technology, Inc.

    Inventor： Jerrold Mark Pianin ,  Joel Goergen ,  Shobhana Ram Punjabi

    IPC: G01R31/28

    CPC classification number: G01R31/2884

    Abstract: Regulation of a voltage gradient may be provided. A plurality of test voltage values associated with a corresponding plurality of locations associated with an electronic device may be received. Then, based on the plurality of test voltage values, a target setpoint may be determined for a power supply that supplies power to the electronic device. The target setpoint may be configured to cause a maximum of voltage values at the plurality of locations to be below a maximum voltage level defined by a specification for the electronic device. The target setpoint may also be configured to cause a minimum of the voltage values at the plurality of locations to be above a minimum voltage level defined by the specification for the electronic device. The power supply may then be driven at the target setpoint.

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