Method and apparatus for handling element on an adhesive film
    21.
    发明授权
    Method and apparatus for handling element on an adhesive film 有权
    在粘合膜上处理元件的方法和装置

    公开(公告)号:US6123800A

    公开(公告)日:2000-09-26

    申请号:US128662

    申请日:1998-08-04

    摘要: A system for handling semiconductor and electronic elements secured to an adhesive surface is provided. According to one aspect of the invention, a vacuum is applied through holes in a loading base. Under the influence of the vacuum, the adhesive film is pulled down toward the loading base and stretched around a pick rod so that the adhesive film is peeled away from the element. Thus, adhesive contact between the film and the element is reduced and a vacuum pick or collet is able to lift the element from the adhesive film with minimal force applied to the surface of the element.

    摘要翻译: 提供一种用于处理固定到粘合剂表面的半导体和电子元件的系统。 根据本发明的一个方面,通过加载基座中的孔施加真空。 在真空的影响下,将粘合剂膜向着装载基座拉下,并在镐杆周围拉伸,使得粘合剂膜从该元件剥离。 因此,膜和元件之间的粘合剂接触被减小,并且真空接头或夹头能够以最小的力施加到元件的表面上从粘合剂膜提升元件。