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公开(公告)号:US4870649A
公开(公告)日:1989-09-26
申请号:US290780
申请日:1988-12-28
申请人: Andrew H. Bobeck , Lloyd R. Harriott , Robert L. Hartman , Daniel R. Kaplan , George J. Przybylek , William J. Tabor
发明人: Andrew H. Bobeck , Lloyd R. Harriott , Robert L. Hartman , Daniel R. Kaplan , George J. Przybylek , William J. Tabor
CPC分类号: H01S5/1082 , H01S5/028 , H01S2301/14 , H01S5/0286 , H01S5/12 , H01S5/227
摘要: A reflection filter is disposed on a solid state laser so as to preferentially reflect TE or TM modes and to suppress oscillation within the resonator of the non-reflected modes. In one embodiment, the filter includes a layer having a plurality of grooves which may be straight and parallel or curved to approximate the mode shape. In another embodiment, the filter includes a polarization sensitive film, without grooves, which either absorbs or transmits the undesired mode. Specifically described is a buried heterostructure semiconductor DFB laser with such a reflection filter formed on at least one facet thereof.
摘要翻译: 将反射滤光器设置在固态激光器上,以优先反射TE或TM模式并抑制谐振器内的无反射模式的振荡。 在一个实施例中,过滤器包括具有多个凹槽的层,其可以是直的并且平行或弯曲以近似模式形状。 在另一个实施例中,滤光器包括无凹槽的偏振敏感膜,其吸收或传输不期望的模式。 具体描述的是在其至少一个方面上形成有这种反射滤光器的掩埋异质结构半导体DFB激光器。
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2.
公开(公告)号:US4730198A
公开(公告)日:1988-03-08
申请号:US674681
申请日:1984-11-26
申请人: Michael G. Brown , Stephen R. Forrest , Daniel R. Kaplan , Paul A. Kohl , Yusuke Ota , Harvey S. Trop
发明人: Michael G. Brown , Stephen R. Forrest , Daniel R. Kaplan , Paul A. Kohl , Yusuke Ota , Harvey S. Trop
IPC分类号: G02B6/36 , G02B6/38 , G02B6/42 , H01L27/146
CPC分类号: H01L27/14643 , G02B6/3636 , G02B6/3839 , G02B6/4249 , G02B6/3652 , G02B6/3692
摘要: Linear arrays of optical fibers are aligned to linear arrays of optoelectronic devices (e.g., photodiodes, diode lasers or LEDs) formed on an elongated chip. The alignment procedure results in a subassembly which includes fiber segments embedded between V-groove mounting blocks and the device array chip affixed to an end face of the blocks.
摘要翻译: 光纤的线性阵列与形成在细长芯片上的光电子器件(例如,光电二极管,二极管激光器或LED)的线性阵列对准。 对准过程产生一个子组件,其中包括嵌入在V形槽安装块之间的光纤段和固定在块的端面上的器件阵列芯片。
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