Abstract:
Techniques are provided for employing independent gate control in asymmetrical memory cells. A memory circuit, such as an SRAM circuit, can include a number of bit line structures, a number of word line structures that intersect the bit line structures to form a number of cell locations, and a number of asymmetrical memory cells located at the cell locations. Each of the asymmetrical cells can be selectively coupled to a corresponding one of the bit line structures under control of a corresponding one of the word line structures. Each of the cells can include a number of field effect transistors (FETS), and at least one of the FETS can be configured with separately biased front and back gates. One gate can be biased separately from the other gate in a predetermined manner to enhance read stability of the asymmetrical cell.
Abstract:
Techniques are provided for employing independent gate control in asymmetrical memory cells. A memory circuit, such as an SRAM circuit, can include a number of bit line structures, a number of word line structures that intersect the bit line structures to form a number of cell locations, and a number of asymmetrical memory cells located at the cell locations. Each of the asymmetrical cells can be selectively coupled to a corresponding one of the bit line structures under control of a corresponding one of the word line structures. Each of the cells can include a number of field effect transistors (FETS), and at least one of the FETS can be configured with separately biased front and back gates. One gate can be biased separately from the other gate in a predetermined manner to enhance read stability of the asymmetrical cell.
Abstract:
Disclosed are a multi-threshold CMOS circuit and a method of designing such a circuit. The preferred embodiment combines an MTCMOS scheme and a hybrid SOI-epitaxial CMOS structure. Generally, the logic transistors (both nFET and pFET) are placed in SOI, preferably in a high-performance, high density UTSOI; while the headers or footers are made of bulk epitaxial CMOS devices, with or without an adaptive well-biasing scheme. The logic transistors are based on (100) SOI devices or super HOT, the header devices are in bulk (100) or (110) pFETs with or without an adaptive well biasing scheme, and the footer devices are in bulk (100) NFET with or without an adaptive well biasing scheme.
Abstract:
Disclosed is an eight transistor static random access memory (SRAM) device, comprising first and second inverters, a first bit line, a first complement bit line, a pair of write access transistors, and a pair of read access transistors. Each of the first and second inverters includes a respective pair of transistors, and has a respective data node. Each of a first and a second of the access transistors has a source, a drain, a front gate, and a back gate. The first access transistor is coupled to the first bit line, and the second access transistor is coupled to the first complement bit line. The back gate of the first access transistor is coupled to the data node of the first inverter; and the back gate of the second access transistor is coupled to the data node of the second inverter. This increases the difference between the threshold voltages of the first and second access transistors.
Abstract:
A multi-threshold integrated circuit (IC) with reduced subthreshold leakage and method of reducing leakage. Selectable supply switching devices (NFETs and/or PFETS) between a logic circuit and supply connections (Vdd and Ground) for the circuit have higher thresholds than normal circuit devices. Some devices may have thresholds lowered when the supply switching devices are on. Header/footer devices with further higher threshold voltages and widths may be used to further increase off resistance and maintain/reduce on resistance. Alternatively, high threshold devices may be stacked to further reduce leakage to a point achieved for an even higher threshold. Intermediate supply connects at the devices may have decoupling capacitance and devices may be tapered for optimum stack height and an optimum taper ratio to minimize circuit leakage and circuit delay.
Abstract:
The present invention proposes a gate oxide breakdown-withstanding power switch structure, which is connected with an SRAM and comprises a first CMOS switch and a second CMOS switch respectively having different gate-oxide thicknesses or different threshold voltages. The CMOS switch, which has a normal gate-oxide thickness or a normal threshold voltage, provides current for the SRAM to wake up the SRAM from a standby or sleep mode to an active mode. The CMOS switch, which has a thicker gate-oxide thickness or a higher threshold voltage, provides current for the SRAM to work in an active mode. The present invention prevents a power switch from gate-oxide breakdown lest noise margin, stabilization and performance of SRAM be affected.
Abstract:
A disturb-free static random access memory cell includes: a latch circuit having a first access terminal and a second access terminal; a first switching circuit having a first bit transferring terminal coupled to the first access terminal, a first control terminal coupled to a first write word line, and a second bit transferring terminal; a second switching circuit having a third bit transferring terminal coupled to the second access terminal, a second control terminal coupled to a second write word line, and a fourth bit transferring terminal coupled to the second bit transferring terminal; a third switching circuit having a fifth bit transferring terminal coupled to the fourth bit transferring terminal, a third control terminal coupled to a word line, and a sixth bit transferring terminal coupled to a bit line; and a sensing amplifier coupled to the bit line, for determining a bit value appearing at the bit line.
Abstract:
Asymmetrical SRAM cells are improved by providing one or more of improved read stability and improved write performance and margin. A first inverter and a second inverter are cross-coupled and configured for selective coupling to true and complementary bit lines under control of read and write word lines. The first inverter is formed by a first, n-type, FET (NFET) and a second, p-type, FET (PFET). Process and/or technology approaches can be employed to adjust the relative strength of the FETS to obtain, for example, read margin, write margin, and/or write performance improvements.
Abstract:
A dynamic logic gate has a device for charging a dynamic node during a pre-charge phase of a clock. A logic tree evaluates the dynamic node with a device during an evaluate phase of the clock. The dynamic node has a keeper circuit comprising an inverter with its input coupled to the dynamic node and its output coupled to the back gate of a dual gate PFET device. The source of the dual gate PFET is coupled to the power supply and its drain is coupled to the dynamic node forming a half latch. The front gate of the dual gate PFET is coupled to a logic circuit with a mode input and a logic input coupled back to a node sensing the state of the dynamic node. The mode input may be a slow mode to preserve dynamic node state or the clock delayed that turns ON the strong keeper after evaluation.
Abstract:
A cascaded pass-gate test circuit including interposed split-output drive devices provides accurate measurement of critical timing parameters of pass gates. The rise time and fall time of signals passed through the pass gate can be separately measured in a ring oscillator or one-shot delay line configuration. Inverters or other buffer circuits are provided as drive devices to couple the pass gates in cascade. The final complementary tree in each drive device is split so that the only one of the output pull-down transistor or pull-up transistor is connected to the next pass gate input, while the other transistor is connected to the output of the pass gate. The result is that the state transition associated with the device connected to the pass gate input is dominant in the delay, while the other state transition is propagated directly to the output of the pass gate, bypassing the pass gate.