公开(公告)号：US06838756B2

公开(公告)日：2005-01-04

申请号：US10227266

申请日：2002-08-26

Applicant: Wei-Feng Lin ,  Chung-Ju Wu ,  Chen-Wen Tsai

Inventor： Wei-Feng Lin ,  Chung-Ju Wu ,  Chen-Wen Tsai

IPC: H01L23/13 ,  H01L23/495

CPC classification number: H01L23/13 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A chip-packaging substrate. The substrate is capable of reducing damage during packaging, shrinking its connecting portions so that the length of any of the gap slots between the packaging portion and the frame portion of the substrate is increased. Furthermore, a dummy layer is provided to one surface of the frame portion to flush the surface on the frame portion with that of the packaging portion as much as possible.

Abstract translation: 芯片封装基板。 该基板能够减少封装期间的损坏，使其连接部分收缩，使得封装部分和基板的框架部分之间的任何间隙的长度增加。 此外，在框架部分的一个表面上设置虚拟层，以尽可能多地将框架部分的表面与包装部分的表面齐平。

公开(公告)号：US06747350B1

公开(公告)日：2004-06-08

申请号：US10455525

申请日：2003-06-06

Applicant: Wei-Feng Lin ,  Yin-Chieh Hsueh ,  Chung-Ju Wu

Inventor： Wei-Feng Lin ,  Yin-Chieh Hsueh ,  Chung-Ju Wu

IPC: H01L2312

CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L23/49822 ,  H01L23/552 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/166 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A flip chip package structure. The structure includes a substrate, an IC chip electrically connected to the substrate through a plurality of conductive bumps, encapsulant between the substrate and IC chip, and an electrically protective device. The substrate has interior wiring, a plurality of first contacts arranged at a predetermined pitch among each other on a surface, and a trace line area beyond the first contacts on the surface. The electrically protective device has a protruding part covering the IC chip, and an extending part extending over the surface of the substrate with a gap as large as 40 mil. The extending part further covers the trace line area, and connects to the surface of the substrate using a fixing material.

Abstract translation: 倒装芯片封装结构。 该结构包括基板，通过多个导电凸块电连接到基板的IC芯片，基板和IC芯片之间的密封剂以及电保护装置。 衬底具有内部布线，在表面上彼此以预定间距布置的多个第一触点以及超过表面上的第一触点的迹线区域。 电保护装置具有覆盖IC芯片的突出部分和在基板的表面上延伸大约40密耳的间隙的延伸部分。 延伸部分进一步覆盖迹线区域，并使用固定材料连接到基板的表面。