公开(公告)号：US20210055489A1

公开(公告)日：2021-02-25

申请号：US16544699

申请日：2019-08-19

Applicant: Cisco Technology, Inc.

Inventor： Ashley J. MAKER ,  Joyce J. M. PETERNEL ,  Sandeep RAZDAN ,  Matthew J. TRAVERSO ,  Aparna R. PRASAD

IPC: G02B6/42

Abstract: An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechanical connection features, to provide structural support to the connection between the connected component and the die/frame structure.

公开(公告)号：US20200220329A1

公开(公告)日：2020-07-09

申请号：US16242984

申请日：2019-01-08

Applicant: Cisco Technology, Inc.

Inventor： Dominic F. SIRIANI ,  Jock T. BOVINGTON ,  Matthew J. TRAVERSO

IPC: H01S5/22 ,  H01S5/02 ,  H01S5/028

Abstract: An optical apparatus comprises a semiconductor substrate and a slab-coupled optical waveguide (SCOW) emitter disposed on the semiconductor substrate. The SCOW emitter comprises an optical waveguide comprising: a first region doped with a first conductivity type; a second region doped with a different, second conductivity type; and an optically active region disposed between the first region and the second region. The optically active region comprises a plurality of quantum dots.

公开(公告)号：US20200049890A1

公开(公告)日：2020-02-13

申请号：US16058608

申请日：2018-08-08

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar PATEL ,  Matthew J. TRAVERSO ,  Ashley J. MAKER ,  Jock T. BOVINGTON

IPC: G02B6/30

Abstract: By determining an alignment point for a photonic element in a substrate of a given material; applying, via a laser aligned with the photonic element according to the alignment point, an etching pattern to the photonic element to produce a patterned region and an un-patterned region in the photonic element, wherein applying the etching pattern alters a chemical bond in the given material for the patterned region of the photonic element that increases a reactivity of the given material to an etchant relative to a reactivity of the un-patterned region, and wherein the patterned region defines an engagement feature in the un-patterned region that is configured to engage with a mating feature on a Photonic Integrated Circuit (PIC); and removing the patterned region from the photonic element via the etchant, various systems and methods may make use of laser patterning in optical components to enable alignment of optics to chips.

公开(公告)号：US20240295694A1

公开(公告)日：2024-09-05

申请号：US18177552

申请日：2023-03-02

Applicant: Cisco Technology, Inc.

Inventor： Jock T. BOVINGTON ,  Mark C. NOWELL ,  Matthew J. TRAVERSO ,  Long CHEN

IPC: G02B6/126 ,  G02B6/27

CPC classification number: G02B6/126 ,  G02B6/2766 ,  G02B6/2773

Abstract: A system, method, and photonic chip for an optical circulator are described. The system includes a first polarization splitter, a first optical circuit, and a first controller. The first polarization splitter receives, at a first port of the first polarization splitter, a first optical signal. The first optical circuit is optically coupled to the first polarization splitter. The first optical circuit includes a first plurality of phase shifters. The first optical circuit receives, at a first port of the first optical circuit, a second optical signal. The first controller adjusts the first plurality of phase shifters such that the first optical circuit outputs the first optical signal at a second port of the first optical circuit and such that the first polarization splitter outputs the second optical signal at the first port of the first polarization splitter.

公开(公告)号：US20220320765A1

公开(公告)日：2022-10-06

申请号：US17645195

申请日：2021-12-20

Applicant: Cisco Technology, Inc.

Inventor： Matthew J. TRAVERSO ,  Sandeep RAZDAN ,  Joyce J. M. PETERNEL

IPC: H01R12/70 ,  G02B6/38

Abstract: An apparatus includes a substrate, a frame, and a socket. The frame defines a slot. The frame is coupled to the substrate such that the slot is aligned with an attachment location on the substrate. The socket receives a first device. The socket aligns with the attachment location on the substrate when the socket is inserted in the slot.

公开(公告)号：US20220236477A1

公开(公告)日：2022-07-28

申请号：US17446013

申请日：2021-08-26

Applicant: Cisco Technology, Inc.

Inventor： Jock T. BOVINGTON ,  Matthew J. TRAVERSO ,  Mark C. NOWELL

IPC: F21V8/00 ,  G02B6/12 ,  G02B6/42 ,  G02B6/38

Abstract: Aspects include a pluggable optical device and related optical system. The pluggable optical device comprises a housing, a printed circuit board (PCB) within the housing, and one or more blind mate optical connectors attached to the PCB along a first end of the PCB. The pluggable optical device further comprises one or more electrical contacts of the PCB near the first end, one or more external optical connectors arranged near a second end of the PCB opposite the first end, and one or more optical components attached to the PCB and included in optical paths extending between the one or more external optical connectors and the one or more blind mate optical connectors.

公开(公告)号：US20210247569A1

公开(公告)日：2021-08-12

申请号：US16787632

申请日：2020-02-11

Applicant: Cisco Technology, Inc.

Inventor： Matthew J. TRAVERSO ,  Jock T. BOVINGTON ,  Ashley J.M. ERICKSON

IPC: G02B6/13 ,  G02B6/12

Abstract: Solder reflow compatible connections between optical components are provided by use of reflow compatible epoxies to bond optical components and remain bonded between the optical components at temperatures of at least 260 degrees Celsius for at least five minutes. In some embodiments, the reflow compatible epoxy is index matched to the optical channels in the optical components and is disposed in the light path therebetween. In some embodiments, a light path is defined between the optical channels through at least a portion of an air gap between the optical components.

公开(公告)号：US20210141154A1

公开(公告)日：2021-05-13

申请号：US16677404

申请日：2019-11-07

Applicant: Cisco Technology, Inc.

Inventor： Sandeep RAZDAN ,  Vipulkumar K. PATEL ,  Mark A. WEBSTER ,  Matthew J. TRAVERSO

IPC: G02B6/122 ,  G02B6/30 ,  H01L23/48 ,  H01L23/498 ,  H01L21/48 ,  H01L21/762

Abstract: Aspects described herein include a method comprising bonding a photonic wafer with an electronic wafer to form a wafer assembly, removing a substrate of the wafer assembly to expose a surface of the photonic wafer or of the electronic wafer, forming electrical connections between metal layers of the photonic wafer and metal layers of the electronic wafer, and adding an interposer wafer to the wafer assembly by bonding the interposer wafer with the wafer assembly at the exposed surface. The interposer wafer comprises through-vias that are electrically coupled with the metal layers of one or both of the photonic wafer and the electronic wafer. The method further comprises dicing the wafer assembly to form a plurality of dies. A respective edge coupler of each die is optically exposed at an interface formed by the dicing.

公开(公告)号：US20210091529A1

公开(公告)日：2021-03-25

申请号：US16581923

申请日：2019-09-25

Applicant: Cisco Technology, Inc.

Inventor： Dominic F. SIRIANI ,  Vipulkumar K. PATEL ,  Jock T. BOVINGTON ,  Matthew J. TRAVERSO

IPC: H01S3/23 ,  H01L31/0304 ,  H01S5/10 ,  H01S5/14 ,  G02B6/12

Abstract: Described herein is a two chip photonic device (e.g., a hybrid master oscillator power amplifier (MOPA)) where a gain region and optical amplifier region are formed on a III-V chip and a variable reflector (which in combination with the gain region forms a laser cavity) is formed on a different semiconductor chip that includes silicon, silicon nitride, lithium niobate, or the like. Sides of the two chips are disposed in a facing relationship so that optical signals can transfer between the gain region, the variable reflector, and the optical amplifier.

公开(公告)号：US20200088940A1

公开(公告)日：2020-03-19

申请号：US16132109

申请日：2018-09-14

Applicant: Cisco Technology, Inc.

Inventor： Jock T. BOVINGTON ,  Matthew J. TRAVERSO

IPC: G02B6/12 ,  H01S5/026 ,  H04B10/25

Abstract: A method comprises receiving, at a plurality of optical distributors of a photonic chip, optical energy from a plurality of primary laser sources. Each of the optical distributors receives optical energy from a respective primary laser source at a respective first input. The method further comprises detecting a failed primary laser source of the primary laser sources using control circuitry of a sparing system. The sparing system further comprises one or more secondary laser sources configured to provide optical energy to respective second inputs of the optical distributors. A first one of the secondary laser sources is optically coupled with at least two of the optical distributors. The method further comprises controlling, using the control circuitry, a first one of the secondary laser sources to selectively provide optical energy to the optical distributor whose first input is optically coupled with the failed primary laser source.