公开(公告)号：US09679786B2

公开(公告)日：2017-06-13

申请号：US15051852

申请日：2016-02-24

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shouyu Hong ,  Kai Lu ,  Zhenqing Zhao

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L25/07 ,  H01L23/498 ,  H01L23/373

CPC classification number: H01L21/565 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/49844 ,  H01L23/49861 ,  H01L24/97 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85

Abstract: The disclosure discloses a packaging module of a power converting circuit and a method for manufacturing the same. The packaging module of the power converting circuit includes a substrate, a molding layer and a plurality of pins. A power device is assembled at the substrate, a plurality of pins electrically are coupled to the power device, the molding layer covers the surface of the substrate with the power device, and at least a contact surface of the pins configured to electrically connect an external circuit is exposed. The molding layer includes a main hat-body part and a hat-brim part, the main hat-body part and the hat-brim part form a hat-shaped molding layer, and the hat-brim part is used to increase a creepage distance between the contact surfaces of the pins located at the top of the molding layer and the bottom of the substrate.

公开(公告)号：US20160366780A1

公开(公告)日：2016-12-15

申请号：US15168262

申请日：2016-05-31

Applicant: Delta Electronics, Inc.

Inventor： Le Liang ,  Shouyu Hong ,  Zhenqing Zhao

IPC: H05K7/02 ,  H02M7/04 ,  H02M7/44 ,  H01R12/58 ,  H02M1/42 ,  H05K7/20 ,  H02M7/00 ,  H01R12/52 ,  H02M3/04 ,  H02M5/04

CPC classification number: H01R12/585 ,  H01R12/52 ,  H02M3/04

Abstract: A power module with vertically stacked structure and a pin thereof are disclosed. The power module comprises at least three circuit modules. The at least three circuit modules are a first circuit module, a second circuit module and a third circuit module. The pin is led from the first circuit module. The pin comprises: a main body, a first connection surface and a second connection surface. An upper part of the main body is electrically connected with the first circuit module. The first connection surface is provided at a middle part of the main body and electrically connected with the second circuit module. The second connection surface is provided at a terminal of the main body and electrically connected with the third circuit module.

Abstract translation: 公开了具有垂直堆叠结构的电源模块及其引脚。 功率模块包括至少三个电路模块。 所述至少三个电路模块是第一电路模块，第二电路模块和第三电路模块。 引脚从第一个电路模块引出。 销包括：主体，第一连接表面和第二连接表面。 主体的上部与第一电路模块电连接。 第一连接表面设置在主体的中间部分并与第二电路模块电连接。 第二连接表面设置在主体的端子处并与第三电路模块电连接。